Product Overview
This general series of Multi-layer Ceramic Capacitors (MLCCs) features a monolithic structure for high reliability. They offer excellent soldering and solderability resistance, making them suitable for reflow and wave soldering processes. The capacitors provide high and stable capacitance. Class I dielectrics (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II dielectrics (X7R, X7S, X7T, X6S, X6T, X5R) provide higher capacitance with stable temperature characteristics, suitable for DC-blocking, coupling, bypassing, and frequency discrimination circuits. These MLCCs comply with GB/T 21041-2007 and GB/T 21042-2007 standards and are designed for various filtering, coupling, resonance, bypassing, and high-frequency electronic circuits.
Product Attributes
- Brand: Fenghua (implied from Revision History)
- Dielectric Types: C0G, C0H (Class I); X7R, X7S, X7T, X6S, X6T, X5R (Class II)
- Terminal Material: Nickel Barrier Termination (N), Flexible Solderable Termination (A)
- Packaging Styles: Braided 7-inch reel packing (T), Braided 13-inch reel packing (D)
Technical Specifications
| Category | Specification | Details | ||
|---|---|---|---|---|
| Product Structure | Ceramic Dielectric | |||
| Inner Electrode | ||||
| Substrate Electrode | ||||
| Nickel Layer | ||||
| Tin Layer | ||||
| Product Dimensions (mm) | Size Code | EIA (LW) | Dimensions (LWT) | |
| 1005 | 0.400.20 | 0.400.02 0.200.02 0.200.02 | ||
| 0201 | 0.600.30 | 0.600.03 0.300.03 0.300.03 | ||
| 0402 | 1.000.50 | 1.000.05 0.500.05 0.500.05 | ||
| 0603 | 1.600.80 | 1.600.10 0.800.10 0.800.10 | ||
| 0805 | 2.001.25 | 2.000.20 1.250.20 0.800.20 | ||
| 1206 | 3.201.60 | 3.200.30 1.600.30 0.800.20 | ||
| 1210 | 3.202.50 | 3.200.30 2.500.30 1.250.25 | ||
| 1808 | 4.502.00 | 4.500.40 2.000.20 1.600.30 | ||
| 1812 | 4.503.20 | 4.500.40 3.200.30 1.600.30 | ||
| Temperature Coefficient / Characteristics | Dielectric | Reference Temperature Point | Temperature Coefficient | Operation Temperature Range |
| C0G | 25 | 030ppm/ | -55125 | |
| X7R | 25 | 15% | -55125 | |
| X7S | 25 | 22% | -55125 | |
| X7T | 25 | -33%~+22% | -55125 | |
| X6S | 25 | 22% | -55105 | |
| X6T | 25 | -33%~+22% | -55105 | |
| X5R | 25 | 15% | -5585 | |
| Capacitance Range and Voltage | Class I (C0G) | See detailed tables for specific dimensions and voltages. | ||
| Class II (X7R, X7S, X7T, X6S, X6T, X5R) | See detailed tables for specific dimensions, voltages, and capacities. | |||
| Reliability Test Methods | See detailed tables for Capacitance, Insulation Resistance (IR), Dissipation Factor (DF), Dielectric Withstanding Voltage (DWV), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Termination Adhesion, Temperature Cycle, Humidity Load, and Life Test specifications. | |||
| Packaging | Embossed Plastic Taping, Paper Taping, Embossed Taping (various dimensions and reel sizes available). Packing quantities vary by size and thickness. | |||
| Storage Methods | Relative humidity: 20-70%, storage temperature: 5-40 (recommended below 30). Avoid corrosive gases, direct sunlight, and high humidity. | |||
| Precautions Before Use | Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment before measuring capacitance for long-stored capacitors. | |||
| Application Restrictions | Intended for general consumer electronic devices. Not recommended for high-reliability applications (aerospace, medical, military, etc.). Fenghua is not liable for damages from use in restricted applications without prior written consent. | |||
| Soldering Conditions | Refer to recommended temperature profile charts for reflow and wave soldering. Manual soldering requires careful operation to avoid thermal shock. Recommended solder amounts and pad sizes are provided. | |||
2512241501_FH-0603B104J500NT_C88136.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible