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Specifications
Voltage Rating:
100V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805B104K101NT
Model Number:
0805B104K101NT
Package:
0805
Key Attributes
Product Description
Product Overview
This General Series Multi-layer Ceramic Capacitor (MLCC) features a monolithic structure of laminated layers, offering high reliability and excellent soldering and solder resistance capabilities suitable for reflow and wave soldering. It provides high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X7S, X7T, X6S, X6T, X5R) offer higher capacitance with stable temperature characteristics, suitable for DC-blocking, coupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: Fenghua (implied by context and revision history)
- Type: General Series Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Material: Class I (C0G, C0H), Class II (X7R, X7S, X7T, X6S, X6T, X5R)
- Termination Styles: Nickel Barrier Termination, Flexible Solderable Termination
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Features | Structure | Monolithic structure of laminated layers |
| Soldering Capability | Excellent soldering and solder resistance, suitable for reflow and wave soldering | |
| Capacitance | High and stable capacitance | |
| Dielectric Characteristics | Class I (C0G, C0H) | Most stable electrical performance, almost no change with temperature, voltage, or time. Suitable for low-loss, high-stability high-frequency circuits. |
| Class II (X7R, X7S, X7T, X6S, X6T, X5R) | High dielectric constant, higher capacitance than Class I, semi-stable temperature characteristics. Suitable for DC-blocking, coupling, bypassing, frequency discriminating circuits. | |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) X7S: 22% (-55125) X7T: -33%~+22% (-55125) X6S: 22% (-55105) X6T: -33%~+22% (-55105) X5R: 15% (-5585) | |
| Nominal Capacitance Representation | First two digits are significant figures, third digit denotes number of zeros; R is decimal point. | |
| Capacitance Tolerance Codes | A (0.05pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) | |
| Rated Voltage Representation | First two digits are significant figures, third digit denotes number of zeros; R is decimal point. (e.g., 6R3 = 6.3V, 500 = 500V) | |
| Product Structure & Dimensions | Components | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Dimensions (EIA Size Code) | 01005 (0.400.20mm), 0201 (0.600.30mm), 0402 (1.000.50mm), 0603 (1.600.80mm), 0805 (2.001.25mm), 1206 (3.201.60mm), 1210 (3.202.50mm), 1808 (4.502.00mm), 1812 (4.503.20mm) | |
| Dimensions (LWT mm) | Refer to detailed tables for specific dimensions and tolerances (e.g., 0402: 0.400.02 0.200.02 0.200.02) | |
| Terminal Material Styles | Nickel Barrier Termination (N), Flexible Solderable Termination (A) | |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) | |
| Aging for Class II Capacitors | Heat treatment at 150 for 1 hour, then measure after 24 hours. | |
| Capacitance Range & Voltage | Refer to detailed tables for specific combinations of dielectric, size, voltage, and capacitance. | |
| Reliability Test Methods | Insulation Resistance (IR) | Class I: C10nF, Ri50000M; C>10nF, RiCR500S. Class II: C25nF, Ri10000M; C>25nF, RiCR>100S. |
| Dissipation Factor (DF, tan) | Refer to detailed tables for specific values based on dielectric, voltage, and capacitance. | |
| Dielectric Withstanding Voltage (DWV) | Class I: 300% Rated Voltage; Class II: 250% Rated Voltage (1-5s). Excludes high-voltage MLCCs. | |
| Solderability | >95% tin coverage. Visual inspection for damage. Preheating: 80-120 (10-30s). Lead-free solder: 2455 (20.5s). | |
| Resistance to Soldering Heat | C/C 2.5% or 0.25pF (whichever is larger) for Class I; 15% for Class II. DF and IR should be within initial standards. Appearance: no visible damage, >95% tin coverage. | |
| Resistance to Flexure | C/C: Class I: 5% or 0.5pF; Class II: 10%. Appearance: no visible damage. | |
| Termination Adhesion | No visible damage. | |
| Temperature Cycle | C/C: Class I: 1% or 1pF; Class II: -15%~+15%. Appearance: no visible damage. (5 cycles: -55 to +125/105/85) | |
| Humidity Load | C/C: Class I: 7.5% or 0.75pF; Class II: 12.5%. DF 2x initial. IR: Class I: Ri5000M or RiCR50S; Class II: Ri1000M or RiCR10S. (402, 90-95%RH, Rated Voltage, 500h) | |
| Life Test | C/C: Class I: 3% or 0.3pF; Class II: -20%~+20%. DF 2x initial. IR: Class I: Ri4000M or RiCR40S; Class II: Ri2000M or RiCR50S. (1000h, 2x Ur, 125/105/85) | |
| Packaging | Embossed Plastic Taping, Paper Taping, Reel dimensions (7' and 13'). Packing quantities vary by size and thickness. | |
| Storage Conditions | Relative humidity: 20-70%, Temperature: 5-40 (recommended below 30). Avoid corrosive gases and direct sunlight. | |
| Pre-installation Precautions | Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment before measurement for long-stored capacitors. | |
| Application Restrictions | Intended for general consumer electronics. Not recommended for high-reliability applications (aerospace, medical, military, etc.). | |
| Soldering Methods | Recommended: Reflow soldering, Wave soldering. Manual soldering requires careful operation. Refer to temperature profile charts. Recommended reflow pad sizes provided. |
2512241501_FH-0805B104K101NT_C89258.pdf
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