Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface mounting and are suitable for various DC high-voltage circuits, offering improved electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, excellent soldering and resistance properties for reflow and peak soldering, and high, stable capacitance. These capacitors adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA ()
- Product Type: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Series | High Voltage MLCC | |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 | |
| Dielectric Characteristics | C0G (Class I) | Temperature Coefficient: 030ppm/ Operating Temperature Range: -55125 |
| X7R (Class II) | Temperature Coefficient: 15% Operating Temperature Range: -55125 | |
| Capacitance Range & Voltage | Refer to detailed tables in the original document for specific combinations of dielectric, size, capacitance, and voltage. | |
| Ordering Code Structure | Size Code - Nominal Capacitance - Dielectric Code - Capacitance Tolerance - Rated Voltage - Termination Material - Package Style | |
| Termination Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) | |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) | |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 200% of rated voltage for 5 seconds for Vr < 500V, with max current of 50mA). | |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions vary by dielectric class and product specifications. | |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. | |
| Soldering Recommendations | Reflow soldering, Wave soldering, and Manual soldering are supported. Recommended temperature profiles and conditions are provided. | |
2511191605_FH-0603CG100J500NT_C91367.pdf
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