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Specifications
Voltage Rating:
50V
Capacitance:
33pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603CG330J500NT
Model Number:
0603CG330J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface mounting and offer excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure for high reliability, superior soldering and resistance capabilities for reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Compliance Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Types | High-Voltage Multi-layer Ceramic Capacitors (MLCC) |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Dielectric Codes | C0G, X7R |
| Capacitance Tolerance Codes | A (0.05pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) |
| Rated Voltage Express Methods | e.g., 6R3 (6.3V), 500 (500V), 201 (200V) |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Guaranteed Solderability Period | 12 months (in delivered package) |
Capacitance Range and Voltage (Partial Data)
Note: Full details available in the original document. Below is a sample.
| Dielectric | Dimension | Capacity/Voltage (Example) |
|---|---|---|
| C0G | 0402 (1.0mm*0.5mm) | 10pF / 100V (CA) |
| C0G | 0805 (2.0mm*1.2mm) | 10pF / 500V (EA) |
| X7R | 0402 (1.0mm*0.5mm) | 100pF / 100V (EA) |
| X7R | 1206 (3.2mm*1.6mm) | 10nF / 250V (FB) |
| X7R | 1812 (4.6mm*3.2mm) | 100nF / 100V (IB) |
| X7R | 2225 (5.7mm*6.3mm) | 1F / 500V (MA) |
Measurement Method of Dielectric Withstanding Voltage
| Rated Voltage Range | Measuring Method |
|---|---|
| Vr=100V | Force 250% Rated voltage for 5 seconds. Max. current should not exceed 50mA. |
| 100V < Vr < 500V | Force 200% Rated voltage for 5 seconds. Max. current should not exceed 50mA. |
| 500V Vr 1000V | Force 150% Rated voltage for 5 seconds. Max. current should not exceed 50mA. |
| 1000V < Vr 2000V | Force 120% Rated voltage for 5 seconds. Max. current should not exceed 50mA. |
| 2000V < Vr 5000V | Force 120% Rated voltage for 5 seconds. Max. current should not exceed 10mA. |
Reliability Test Summary
| Item | Class I Specification | Class II Specification | Test Method/Conditions |
|---|---|---|---|
| Capacitance | Within specified tolerance | Within specified tolerance | 253, 1MHz10% (1000pF) or 1KHz10% (>1000pF), 1.00.2Vrms |
| Dissipation Factor (DF) | 1/(400+20C) (C<30pF), 0.1% (C30pF) | 25010-4 (C<1uF), 75010-4 (1uFC4.7uF) | 1KHz10%, 1.00.2Vrms |
| Insulation Resistance (IR) | Ri50000M (C10nF), RiCR500S (C>10nF) | Ri10000M (C25nF), RiCR100S (C>25nF) | Rated Voltage (Max 500V), 60s, 75%RH, 253 |
| Solderability | 95% of terminal electrode covered by new solder. Appearance: No visible damage. | Lead-free: 2455, 20.5s | |
| Resistance to Soldering Heat | C/C 2.5% or 0.25pF (whichever is larger), DF same as initial | C/C 15%, DF same as initial | Preheating: 100-200, 60-120s. Solder Temp: 2655, 101s. Recovery: 242h |
| Resistance to Flexure | C/C 5% or 0.5pF (whichever is larger) | C/C 10% | PCB bending 1mm, 1mm/sec. Measure in bent state. |
| Temperature Cycle | C/C 1% or 1pF (whichever is larger) | C/C -15% ~ +15% | 5 cycles: -55 (30min) +25 (2-3min) +125 (30min) +25 (2-3min). Recovery: 242h |
| Humidity Load | C/C 7.5% or 0.75pF (whichever is larger), IR 5000M or RiCR50S (whichever is smaller) | C/C -12.5% ~ +12.5%, IR 1000M or RiCR10S (whichever is smaller) | 402, 90-95%RH, Rated Voltage, 500h. Class II specific products require 150 heat treatment. Recovery: 242h |
| Life Test | C/C 3% or 0.3pF (whichever is larger), IR 4000M or RiCR40S (whichever is smaller) | C/C -20% ~ +20%, IR 2000M or RiCR50S (whichever is smaller) | 1.5Ur (100-200V), 1.3Ur (200-500V), 1.2Ur (>500V), 1000h, 125. Class II specific products require 150 heat treatment. Recovery: 242h |
Packaging
| Type | Description |
|---|---|
| Paper Taping | Available for 0402, 0603, 0805, 1206 sizes. Details on dimensions (A0, B0, W, etc.) provided. |
| Embossed Taping | Available for 0805~1812 sizes. Details on dimensions (A, B, C, etc.) provided. |
| Reel Dimensions | 7' Reel (1782.0mm), 13' Reel (3302.0mm) |
| Taping Specification | Top tape peeling strength: 0.1N < strength < 0.7N. No paper debris. |
| Packing Quantity | Varies by size and thickness. E.g., 0402 (0.500.05mm) has 10000 pcs for 7' PT, 50000 pcs for 13' PT. Packing style and quantity can be customized. |
| Outer Packing | First package (10 reels), Second package (6 cases). Labels include Part No., Quantity, Date. |
Soldering Recommendations
| Method | Conditions |
|---|---|
| Reflow Soldering | Temperature difference (soldering temp. vs. chip surface temp.) T 150. Specific profiles vary by size and type. |
| Wave Soldering | Lead-free peak temp: 240270. Temperature difference T 150. |
| Manual Soldering | Avoid direct contact of soldering iron tip with ceramic. Max. tip temp: 350, Max. power: 20W, Recommended tip diameter: 1mm, Max. soldering time: 3s. Avoid direct contact with ceramic components. |
2511191605_FH-0603CG330J500NT_C91368.pdf
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