Product Overview
General Series Multi-layer Ceramic Capacitors (MLCCs) are designed with a monolithic structure of laminated layers, offering high reliability. These capacitors feature excellent soldering and resistance properties, making them suitable for both reflow and wave soldering processes. They provide high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, with minimal change in capacitance across temperature, voltage, and time, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X7S, X7T, X6S, X6T, X5R) have a higher dielectric constant and capacitance compared to Class I, with stable temperature characteristics, suitable for circuits requiring a wide capacitance range and less stringent stability, such as DC-blocking, coupling, bypassing, and frequency discrimination. These MLCCs comply with GB/T 21041-2007 and GB/T 21042-2007 standards and are applied in various filtering, coupling, resonant, bypassing, and high-frequency electronic circuits.
Product Attributes
- Brand: Fenghua (implied from context)
- Type: General Series Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Material: Class I (C0G, C0H), Class II (X7R, X7S, X7T, X6S, X6T, X5R)
- Compliance Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Details | ||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Product Structure | Ceramic dielectric, Inner electrode, Outer electrode (Substrate electrode), Nickel Layer, Tin Layer. | ||||||||||||||||||||||||||||||||
| Dimensions (EIA) |
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| Dielectric Codes | CG (C0G), X (X5R), B (X7R), BS (X7S), BT (X7T), DS (X6S), DT (X6T) | ||||||||||||||||||||||||||||||||
| Nominal Capacitance Expression | First two digits are significant figures, third digit is the number of zeros. 'R' denotes decimal point. (e.g., 102 = 10 x 10^2 pF) | ||||||||||||||||||||||||||||||||
| Capacitance Tolerance Codes | A (0.05pF, for 10pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) | ||||||||||||||||||||||||||||||||
| Rated Voltage Expression | First two digits are significant figures, third digit is the number of zeros. 'R' denotes decimal point. (e.g., 500 = 50 x 10^0 V, 6R3 = 6.3 V) | ||||||||||||||||||||||||||||||||
| Terminal Material Styles | N (Nickel Barrier Termination), T (Flexible Solderable Termination) | ||||||||||||||||||||||||||||||||
| Package Styles | T (Braided 7 inch reel packing), D (Braided 13 inch reel packing) | ||||||||||||||||||||||||||||||||
| Temperature Coefficient/Characteristics |
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| Reliability Test Methods | Capacitance, Insulation Resistance (IR), Dissipation Factor (DF, tan), Dielectric Withstanding Voltage (DWV), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Termination Adhesion, Temperature Cycle, Humidity Load, Life Test. (Detailed specifications and test conditions are provided in the source document). | ||||||||||||||||||||||||||||||||
| Packaging Options | Embossed Plastic Taping, Paper Taping, Embossed Taping (various dimensions and reel sizes like 7' and 13'). Packing quantities vary by size and thickness. | ||||||||||||||||||||||||||||||||
| Storage Conditions | Relative humidity: 20-70%, Storage temperature: 5-40 (recommended below 30). Avoid corrosive gases, direct sunlight, and high humidity. Check solderability if stored for extended periods. | ||||||||||||||||||||||||||||||||
| Precautions Before Use | Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage effects, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment on long-stored capacitors before measurement. | ||||||||||||||||||||||||||||||||
| Application Restrictions | Intended for general consumer electronic devices. Not recommended for high-reliability applications (aerospace, medical, military, etc.) without prior written consent. | ||||||||||||||||||||||||||||||||
| Soldering Recommendations | Reflow soldering and wave soldering are recommended. Manual soldering requires careful operation to avoid thermal shock. Specific pad sizes and temperature profiles are provided. |
2512241501_FH-0603X475K160NT_C99229.pdf
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