Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mount applications, offering excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, enhancing electronic circuit performance. They feature a monolithic structure for high reliability, superior soldering capabilities for reflow and wave soldering, and stable, high capacitance values. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Product Name: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Series | High Voltage MLCC |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Capacitance Range | See detailed tables in the specification document. |
| Voltage Ratings | Available up to 5KV (e.g., 6R3, 500, 101, 201, etc., representing specific voltage values like 6.3V, 500V, 1000V, 2000V). |
| Temperature Coefficient/Characteristics | C0G: 0 30ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Tolerance | 0.05pF (A), 0.10pF (B), 0.25pF (C), 0.50pF (D) for capacitance 10pF. 1% (F), 2% (G), 5% (J), 10% (K), 20% (M). |
| Termination Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel Layer, 5. Tin Layer |
| Dimensions (mm) | Detailed dimensions (L, W, T, WB) are provided for each size code (e.g., 0402: 1.000.05 x 0.500.05). Specific thickness 'T' is listed in the 'Capacity Range and Voltage' section. |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 200% of rated voltage for 5 seconds for Vr < 500V, with max current 50mA; 120% for 5 seconds with max current 10mA for 2000V < Vr 5000V). |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the document. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
2511191605_FH-0805B103K101NT_C128805.pdf
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