High-Voltage Multi-layer Ceramic Capacitors (MLCC)
Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, built upon established MLCC technology with special design considerations for enhanced high-voltage reliability. These surface-mountable components are suitable for various DC high-voltage circuits, contributing to improved electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, excellent soldering and resistance to soldering heat properties, making them compatible with reflow and wave soldering processes. The capacitors offer high and stable capacitance values and adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications
- Analog & Digital Modems
- LAN/WAN Interface
- Lighting Ballast Circuits
- Voltage Multipliers
- DC-DC Converters
- Back-lighting Inverters
Product Attributes
- Manufacturer: FENGHUA (implied from context)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description / Values |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage MLCC |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient / Characteristics |
|
| Capacitance Range & Voltage | Refer to detailed tables in the specification document for specific capacitance, voltage, and thickness combinations for C0G and X7R dielectrics across various sizes. |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch reel packing (T), Braided 13 inch reel packing (D) |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (Vr), typically 120% to 250% of Vr for 5 seconds, with current limits (e.g., max 50mA or 10mA). |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and test conditions are detailed in the document. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W), Manual Soldering. Specific temperature profiles and conditions are provided. |
Packaging Information
Available in Paper Taping and Embossed Taping formats on 7-inch and 13-inch reels. Specific dimensions for taping and reel sizes are detailed. Packing quantities vary by component size and thickness. Outer packing includes cases and labels with product information.
2511191605_FH-0805X226M250NT_C129303.pdf
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