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quality High Voltage MLCC FH 0805B224K500NT for LAN WAN Interface and Lighting Ballast Circuit Applications factory
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quality High Voltage MLCC FH 0805B224K500NT for LAN WAN Interface and Lighting Ballast Circuit Applications factory
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Specifications
Voltage Rating:
50V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805B224K500NT
Model Number:
0805B224K500NT
Package:
0805
Key Attributes
Product Description

Product Overview

High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure for high reliability, superior soldering and resistance capabilities suitable for reflow and wave soldering, and provide high and stable capacitance. These products comply with GB/T 21041-2007 and GB/T 21042-2007 standards.

Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, and Back-lighting Inverters.

Product Attributes

  • Manufacturer: FENGHUA (implied from context)
  • Product Type: High-Voltage Multi-layer Ceramic Capacitors (MLCC)
  • Dielectric Materials: C0G (Class I), X7R (Class II)
  • Compliance Standards: GB/T 21041-2007, GB/T 21042-2007

Technical Specifications

Feature Description
Product Series High Voltage Series Of Ceramic Chip Capacitors
Available Sizes (EIA) 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225
Dimensions (mm)
Size CodeLWTWB
04021.000.050.500.050.500.050.250.05
06031.600.100.800.100.800.100.350.20
08052.000.201.250.250.800.200.500.20
08052.000.201.250.251.250.250.500.20
12063.200.301.600.300.800.200.600.30
12063.200.301.600.301.250.250.600.30
12063.200.301.600.301.600.300.600.30
12103.200.302.500.301.250.250.600.30
12103.200.302.500.301.600.300.600.30
12103.200.302.500.302.000.300.600.30
12103.200.302.500.302.500.300.600.30
18084.600.402.000.301.600.300.600.30
18084.600.402.000.302.000.300.600.30
18124.600.403.200.301.250.250.600.30
18124.600.403.200.301.600.300.600.30
18124.600.403.200.302.000.300.600.30
18124.600.403.200.302.500.300.600.30
18254.600.406.300.501.600.300.600.30
18254.600.406.300.502.000.300.600.30
18254.600.406.300.502.500.300.600.30
22115.700.402.800.401.600.300.600.30
22115.700.402.800.402.000.300.600.30
22205.700.405.000.401.600.300.600.30
22205.700.405.000.402.000.300.600.30
22205.700.405.000.402.500.300.600.30
22255.700.506.300.501.600.300.600.30
22255.700.506.300.502.000.300.600.30
22255.700.506.300.502.500.300.600.30
Temperature Coefficient / Characteristics
DielectricReference Temp. PointNominal Temp. CoefficientOperation Temp. Range
C0G25C030ppm/-55125
X7R25C15%-55125
Capacitance Range & Voltage Refer to detailed tables for Class I (C0G) and Class II (X7R) capacitors, listing specific voltage ratings, capacitance values, and corresponding dimensions/thicknesses.
Dielectric Withstanding Voltage Test Method
Rated Voltage RangeMeasuring Method
Vr=100VForce 200%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
100VVr500VForce 200%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
500VVr1000VForce 150%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
1000VVr2000VForce 120%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
2000VVr5000VForce 120%Rated voltage for 5 seconds. Max. current should not exceed 10 mA.
Reliability Tests Includes tests for Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed within the document.
Packaging Available in Paper Taping (7" and 13" reels) and Embossed Taping (plastic reels). Specific dimensions and quantities per reel are provided for various sizes.
Storage Conditions Guaranteed solderability for 12 months under specified conditions: Temperature 5~40, Relative Humidity 20~70%.
Soldering Recommendations Recommended methods include Reflow Soldering (R) and Wave Soldering (W). Specific temperature profiles and conditions for reflow, wave, and manual soldering are provided.

2511191605_FH-0805B224K500NT_C163697.pdf

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