Online Service

Online Service

Contact Person
+86 136 6733 2386
quality General Series Multi layer Ceramic Capacitors MLCC model FH 0402B103K250NT with monolithic laminated structure factory
<
quality General Series Multi layer Ceramic Capacitors MLCC model FH 0402B103K250NT with monolithic laminated structure factory
>
Specifications
Voltage Rating:
25V
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0402B103K250NT
Model Number:
0402B103K250NT
Package:
0402
Key Attributes
Product Description

General Series Multi-layer Ceramic Capacitors (MLCC)

Product Overview

The General Series MLCC offers high reliability through its monolithic structure of laminated layers. It features excellent soldering ability and resistance, making it suitable for reflow and wave soldering processes. These capacitors provide high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X7S, X7T, X6S, X6T, X5R) have a higher dielectric constant and capacitance compared to Class I, with stable temperature characteristics suitable for circuits requiring a wide capacitance range and less stringent stability, such as DC-blocking, coupling, bypassing, and frequency discrimination.

Product Attributes

  • Brand: Fenghua (implied by context and revision history)
  • Type: General Series Multi-layer Ceramic Capacitors (MLCC)
  • Dielectric Materials: Class I (C0G, C0H), Class II (X7R, X7S, X7T, X6S, X6T, X5R)
  • Executive Standards: GB/T 21041-2007, GB/T 21042-2007

Technical Specifications

Category Specification Details
Features Structure Monolithic structure of laminated layers
Soldering Excellent soldering ability and resistance, suitable for reflow and wave soldering
Capacitance High and stable capacitance
Application Scope All kinds of filter, coupled, harmonic vibration, by passing and high frequency circuits.
Class I (C0G, C0H) Low-loss, high stability requirement circuits. Stable performance with minimal change in temperature, voltage, and time.
Class II (X7R, X5R, X7S, X6S, X7T, X6T) Wide capacitance range, less stringent stability requirement circuits (e.g., DC-blocking, decoupling, bypassing, frequency discriminating).
Product Structure Components Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer
Dimensions (EIA) 01005 (0.40x0.20mm), 0201 (0.60x0.30mm), 0402 (1.00x0.50mm), 0603 (1.60x0.80mm), 0805 (2.00x1.25mm), 1206 (3.20x1.60mm), 1210 (3.20x2.50mm), 1808 (4.50x2.00mm), 1812 (4.50x3.20mm)
Dielectric Codes CG (C0G), X (X5R), B (X7R), BS (X7S), BT (X7T), DS (X6S), DT (X6T)
Terminal Material Styles Nickel Barrier Termination (N), Flexible Solderable Termination (A), Three-layer plating termination (T)
Capacitance Range & Voltage Class I (C0G) Refer to detailed tables for specific dimensions, voltages (10V to 50V), and capacitance values (0.1pF to 100nF).
Class II (X7R, X7S, X7T, X6S/X6T, X5R) Refer to detailed tables for specific dimensions (0201 to 1812), voltages (6.3V to 50V), and capacitance values (e.g., 100pF to 100F).
Temperature Coefficient/Characteristics C0G: 030ppm/ (-55125)
X7R: 15% (-55125)
X7S: 22% (-55125)
X7T: -33%~+22% (-55125)
X6S: 22% (-55105)
X6T: -33%~+22% (-55105)
X5R: 15% (-5585)
Reference Temperature Point: 25
Reliability Test Methods Capacitance, Insulation Resistance (IR), Dissipation Factor (DF), Dielectric Withstanding Voltage (DWV), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Termination Adhesion, Temperature Cycle, Humidity Load, Life Test. (Detailed specifications and test conditions provided in the source document).
Packaging Types Embossed Plastic Taping, Paper Taping, Embossed Taping (Plastic Reel)
Reel Sizes 7' REEL (1782.0mm), 13' REEL (3302.0mm)
Packing Quantity Varies by size code, thickness, and reel type (e.g., 7-inch paper tape reel: 1005 type 20000 pcs, 0201 type 15000 pcs). Refer to detailed tables.
Outer Packing Small package (10 reels), Large package (6 cases)
Storage Conditions Relative humidity: 20~70%, Storage temperature: 5~40 (recommended below 30). Avoid corrosive gases, direct sunlight, and high humidity.
Pre-installation Precautions Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment before measurement if stored for extended periods.
Application Restrictions Intended for general consumer electronic devices. Not recommended for high-reliability applications (aerospace, medical, military, etc.) without prior written consent.
Soldering Conditions Recommended for reflow soldering and wave soldering. Manual soldering requires careful operation to avoid thermal shock. Refer to recommended temperature profiles and pad sizes. (Specific temperature profiles and recommended pad sizes are detailed in the source document.)

2512241501_FH-0402B103K250NT_C284987.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max