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Specifications
Voltage Rating:
25V
Capacitance:
10nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0201B103K250NT
Model Number:
0201B103K250NT
Package:
0201
Key Attributes
Product Description
Product Overview
General Series Multi-layer Ceramic Capacitors (MLCCs) are designed with a monolithic structure of laminated layers, offering high reliability. They feature excellent soldering and resistance properties, making them suitable for reflow and wave soldering processes. These capacitors provide high and stable capacitance. Class I dielectrics, such as C0G and C0H, offer the most stable electrical performance, with minimal change across temperature, voltage, and time, ideal for low-loss, high-stability high-frequency circuits. Class II dielectrics (X7R, X5R, X7S, X7T, X6S, X6T) offer higher capacitance due to their high dielectric constant and semi-stable temperature characteristics, suitable for DC-blocking, decoupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: GENERAL TYPE MLCC
- Dielectric Types: C0G, X7R, X7S, X7T, X6S, X6T, X5R
- Termination Styles: Nickel Barrier Termination, Flexible Solderable Termination
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
Product Structure
| No. | Name |
|---|---|
| Ceramic dielectric | |
| Inner electrode | |
| Substrate electrode | |
| Nickel Layer | |
| Tin Layer |
Product Dimensions
| Type | Size Code | L (mm) | W (mm) | T (mm) | WB (mm) |
|---|---|---|---|---|---|
| 1005 | 0402 | 0.400.02 | 0.200.02 | 0.200.02 | 0.100.03 |
| 0201 | 0603 | 0.600.03 | 0.300.03 | 0.300.03 | 0.150.05 |
| 0402 | 1005 | 1.000.05 | 0.500.05 | 0.500.05 | 0.250.05 |
| 0603 | 1608 | 1.600.10 | 0.800.10 | 0.800.10 | 0.350.20 |
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 | 3216 | 3.200.30 | 1.600.30 | 0.800.20 | 0.600.30 |
| 1210 | 3225 | 3.200.30 | 2.500.30 | 1.250.25 | 0.600.30 |
| 1808 | 4520 | 4.500.40 | 2.000.20 | 1.600.30 | 0.600.30 |
| 1812 | 4532 | 4.500.40 | 3.200.30 | 1.600.30 | 0.600.30 |
Temperature Coefficient / Characteristics
| Dielectric Type | Reference Temperature Point | Nominal Temperature Coefficient | Operation Temperature Range |
|---|---|---|---|
| C0G | 25 | 030ppm/ | -55125 |
| X7R | 25 | 15% | -55125 |
| X7S | 25 | 22% | -55125 |
| X7T | 25 | -33%~+22% | -55125 |
| X6S | 25 | 22% | -55105 |
| X6T | 25 | -33%~+22% | -55105 |
| X5R | 25 | 15% | -5585 |
Capacitance Range and Voltage (Class II Capacitors)
| Dimension | Dielectric | Voltage | Capacitance Code |
|---|---|---|---|
| 1005 (0.4mm*0.2mm) | X7R Series | 6.3V | AA |
| 10V | AA | ||
| 16V | AA | ||
| 25V | AA | ||
| 50V | AA | ||
| X7S Series | 6.3V | AA | |
| 10V | AA | ||
| 16V | AA | ||
| 25V | AA | ||
| 50V | AA | ||
| 0201 (0.6mm*0.3mm) | X7R Series | 6.3V | BA |
| 10V | BA | ||
| 16V | BA | ||
| 25V | BA | ||
| 50V | BA | ||
| X7S Series | 6.3V | BA | |
| 10V | BA | ||
| 16V | BA | ||
| 25V | BA | ||
| 50V | BA | ||
| 0402 (1.0mm*0.5mm) | X7R Series | 6.3V | CA |
| 10V | CA | ||
| 16V | CA | ||
| 25V | CA | ||
| 50V | CA | ||
| X7S Series | 6.3V | CA | |
| 10V | CA | ||
| 16V | CA | ||
| 25V | CA | ||
| 50V | CA | ||
| 0603 (1.6mm*0.8mm) | X7R Series | 6.3V | DA |
| 10V | DA | ||
| 16V | DA | ||
| 25V | DA | ||
| 50V | DA | ||
| X7S Series | 6.3V | DA | |
| 10V | DA | ||
| 16V | DA | ||
| 25V | DA | ||
| 50V | DA | ||
| 0805 (2.0mm*1.25mm) | X7R Series | 6.3V | EA |
| 10V | EA | ||
| 16V | EA | ||
| 25V | EA | ||
| 50V | EA | ||
| X7S Series | 6.3V | EA | |
| 10V | EA | ||
| 16V | EA | ||
| 25V | EA | ||
| 50V | EA | ||
| 1206 (3.2mm*1.6mm) | X7R Series | 6.3V | FA |
| 10V | FA | ||
| 16V | FA | ||
| 25V | FA | ||
| 50V | FA | ||
| X7S Series | 6.3V | FA | |
| 10V | FA | ||
| 16V | FA | ||
| 25V | FA | ||
| 50V | FA | ||
| 1210 (3.2mm*2.5mm) | X7R Series | 6.3V | GA |
| 10V | GA | ||
| 16V | GA | ||
| 25V | GA | ||
| 50V | GA | ||
| X7S Series | 6.3V | GA | |
| 10V | GA | ||
| 16V | GA | ||
| 25V | GA | ||
| 50V | GA | ||
| 1812 (4.5mm*3.2mm) | X7R Series | 6.3V | IB |
| 10V | IB | ||
| 16V | IB | ||
| 25V | IB | ||
| 50V | IB | ||
| X7S Series | 6.3V | IB | |
| 10V | IB | ||
| 16V | IB | ||
| 25V | IB | ||
| 50V | IB |
Reliability Test Methods
| Item | Technical Specification | Test Method and Remarks |
|---|---|---|
| Capacitance | Class I: Should be within the specified tolerance. | Measuring Frequency: 1000pF: 1MHz10%; >1000pF: 1KHz10% Measuring Voltage: 1.00.2Vrms |
| Class II: Should be within the specified tolerance. | Test Temperature: 253 C10F: Test Frequency: 1KHz10%, Test Voltage: 1.00.2Vrms C>10F: Test Frequency: 12024 Hz, Test Voltage:0.50.1Vrms | |
| Aging for Class II dielectrics: Heat treated at 150 for 1 hour, measured after 24 hours. | Test Temperature: 253, Test Humidity: <70%RH | |
| Insulation Resistance (IR) | Class I: C10nF, Ri50000M; C>10nF, RiCR500S | Measuring Voltage: Rated Voltage (Max 500V), Duration: 605s, Test Humidity: 75%, Test Temperature: 253, Test Current: 50mA |
| Class II: C25nF, Ri10000M; C>25nF, RiCR100S | Note: S=F | |
| Dissipation Factor (DF, tan) | Class I: DF 1/(400+20C) | Measuring Frequency: C<30pF: 1MHz10% (C>1000pF, 1KHz10%), Measuring Voltage: 1.00.2Vrms |
| Class II: Varies by voltage and capacitance. | See detailed table in original document. | |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Measuring Voltage: Class I: 300% Rated Voltage; Class II: 250% Rated Voltage. Duration: 1~5s. Charge/ Discharge Current: 50mA max. (Excludes high-Voltage MLCCs) |
| Solderability | At least 95% of the terminal electrode is covered by new solder. Visual Appearance: No visible damage. | Preheating: 80 to 120; 10~30s. Lead-free soldering: Solder Temperature: 2455, Duration: 20.5s. |
| Resistance to Soldering Heat | C/C 2.5% or 0.25pF (whichever is larger) for Class I; 15% for Class II. DF and IR: same as initial standard. Appearance: No visible damage, at least 95% of the terminal electrode is covered by new solder. | Preheating: 100 to 200; 60-120 seconds. Solder Temperature: 2655, Duration: 101s. Recovery Time: 242h. Recovery condition: Room temperature. |
| Resistance to Flexure of Substrate (Bending Strength) | C/C: Class I: 5% or 0.5pF (whichever is larger); Class II: 10%. Appearance: No visible damage. | Test Board: PCB. Warp: 1mm. Speed: 1mm/sec. Measurement in bending position. |
| Termination Adhesion | No visible damage. | Apply a T force to the side of the capacitor for 60+1 seconds. Specification: 0402: 2N; 0603: 5N. |
| Temperature Cycle | C/C: Class I: 1% or 1pF (whichever is larger); Class II: -15% ~ +15%. Appearance: No visible damage. | Cycling Times: 5 cycles. Steps: -55 (30min), +20 (2-3min), High Temp (125/85/105) (30min), +20 (2-3min). Recovery Time: 242h. |
| Humidity Load | C/C: Class I: 7.5% or 0.75pF (whichever is larger); Class II: 12.5%. DF 2x initial. IR: Class I: Ri5000M or RiCR50S (whichever is smaller); Class II: Ri1000M or RiCR10S (whichever is smaller). Appearance: No visible damage. | Humidity: 90~95%RH, Voltage: Rated Voltage, Duration: 500h. Recovery Time: 24h2h. Class 2 requires heat treatment (150, 1h) after test. |
| Life Test | C/C: Class I: 3% or 0.3pF (whichever is larger); Class II: -20% ~ +20%. DF 2x initial. IR: Class I: Ri4000M or RiCR40S (whichever is smaller); Class II: Ri2000M or RiCR50S (whichever is smaller). Appearance: No visible damage. | Low-Voltage (<100V): Applied Voltage: 2*Ur. Duration: 1000h. Temperature: 125 (C0G, X7R, X7S), 85 (X5R), 105 (X6S, X6T). Class 2 requires heat treatment (150, 1h) after test. |
Packaging
| Package Type | Size Code | Thickness (T) | 7" PT Reel | 7" ET Reel | 13" PT Reel | 13" ET Reel |
|---|---|---|---|---|---|---|
| Embossed Plastic Taping | 1005 | 0.200.02 | 20000 | -- | -- | -- |
| 0201 | 0.300.03 | 15000 | -- | 70000 | -- | |
| Paper Taping | 0201 | 0.300.09 | 15000 | -- | 70000 | -- |
| 0201 | 0.500.05 | 15000 | -- | 70000 | -- | |
| 0402 | 0.500.05 | 10000 | -- | 50000 | -- | |
| Embossed Taping | 0402 | 0.500.15 | 10000 | -- | 50000 | -- |
| Embossed Taping | 0402 | 0.500.20 | 10000 | -- | 50000 | -- |
| Embossed Taping | 0603 | 0.800.10 | 4000 | -- | 15000 | -- |
| Embossed Taping | 0603 | 0.800.20 | 4000 | -- | 15000 | -- |
| Embossed Taping | 0805 | 0.800.20 | 4000 | -- | 15000 | -- |
| Embossed Taping | 0805 | 1.250.25 (T1.35mm) | 3000 | -- | 10000 | -- |
| Embossed Taping | 0805 | 1.250.25 (T>1.35mm) | 2000 | -- | 10000 | -- |
| Embossed Taping | 1206 | 0.800.20 | 4000 | -- | 15000 | -- |
| Embossed Taping | 1206 | 1.250.25 (T1.35mm) | 3000 | -- | 10000 | -- |
| Embossed Taping | 1206 | 1.250.25 (T>1.35mm) | 2000 | -- | 10000 | -- |
| Embossed Taping | 1206 | 1.600.30 | -- | 2000 | -- | 8000 |
| Embossed Taping | 1210 | 1.250.25 | -- | 2000 | -- | 8000 |
| Embossed Taping | 1210 | 1.600.30 | -- | 2000 | -- | 8000 |
| Embossed Taping | 1210 | 2.500.30 | -- | 1000 | -- | 8000 |
| Embossed Taping | 1808 | 1.600.30 | -- | 2000 | -- | 8000 |
| Embossed Taping | 1808 | 2.000.30 | -- | 2000 | -- | 8000 |
| Embossed Taping | 1812 | 1.600.30 (T1.85mm) | -- | 1000 | -- | 3000 |
| Embossed Taping | 1812 | 1.600.30 (T>1.85mm) | -- | 500 | -- | 3000 |
| Embossed Taping | 1812 | 2.000.30 | -- | -- | 3000 | -- |
Storage Precautions
- Storage Conditions: Relative humidity: 20-70%, storage temperature: 5-40 (recommended below 30).
- Usage Recommendation: Use immediately after delivery. High temperature/humidity or long-term storage may cause packaging deterioration and electrode oxidation. Check packaging/appearance if delivered over six months ago. Check solderability if delivered over one year ago.
- Environment: Do not store in environments with corrosive gases (e.g., HS, SO, Cl, NH).
- Conditions: Do not store under direct sunlight or in high humidity.
Precautions Before Use (Pre-installation)
- Do not reuse capacitors removed from equipment.
- Confirm electrical characteristics (rated capacitance, voltage).
- Confirm capacitor characteristics under applied voltage.
- Confirm mechanical stress under use conditions.
- Confirm solderability of capacitors stored for long periods.
- Perform heat treatment on long-term stored capacitors before measuring capacitance.
Application Restrictions
- Intended Use: General consumer electronic devices (household appliances, office equipment, information and communication devices, AV equipment, OA equipment, mobile phones, PCs, etc.) under normal operating and usage conditions.
- Not Recommended For: High-reliability applications including but not limited to aerospace, medical, aviation, atomic energy, disaster prevention, crime prevention, electric heating, combustion, public information network, data processing, military, power generation control, safety, vehicle-mounted, traffic signal, transportation, and underwater equipment.
- Liability: Fenghua is not liable for damages resulting from the use of products in restricted applications without prior written consent.
Soldering Conditions and Recommended Methods
- General: Follow temperature profile charts to avoid cracking or local explosion due to sudden temperature changes.
- Manual Soldering: Handle with care to avoid thermal shock. Avoid direct contact of the soldering iron tip with the ceramic body.
- Recommended Soldering Methods: Reflow soldering (R) and Wave soldering (W) are recommended based on size, temperature characteristics, and capacitance.
- Recommended Reflow Pad Size (Unit: mm): Varies by capacitor product size.
Recommended Soldering Temperature Profile
Re-flow soldering: Keep temperature difference between soldering temperature and chip surface temperature 150 during preheating.
Wave soldering: Keep temperature difference between soldering temperature and chip surface temperature 150 during preheating.
Hand soldering: Preheating 130; Soldering iron head temperature: Max 350; Power: Max 20W; Diameter: Recommended 1mm; Time: Max 3s; Solder paste amount: 1/2 chip thickness. Avoid direct contact between soldering iron head and ceramic components.
2512241501_FH-0201B103K250NT_C285010.pdf
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