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quality Multilayer Ceramic Capacitor FH 0805B102K101NT with Monolithic Structure and Excellent Solderability factory
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quality Multilayer Ceramic Capacitor FH 0805B102K101NT with Monolithic Structure and Excellent Solderability factory
>
Specifications
Voltage Rating:
100V
Capacitance:
1nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805B102K101NT
Model Number:
0805B102K101NT
Package:
0805
Key Attributes
Product Description

Product Overview

GENERAL MLCCs are multilayer ceramic capacitors featuring a monolithic structure for high reliability. They offer excellent solderability for reflow and wave soldering applications. These capacitors are available in Class I (COG, COH) and Class II (X7R, X7S, X7T, X6S, X6T, X5R) dielectric materials, catering to diverse circuit needs from stable high-frequency applications to general-purpose filtering, coupling, bypassing, and frequency discrimination. They adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.

Product Attributes

  • Brand: GENERAL MLCC
  • Dielectric Materials: COG, COH, X7R, X7S, X7T, X6S, X6T, X5R
  • Terminal Material: Pure Copper, Three-layer Plating
  • Packaging: Bulk, Tape & Reel

Technical Specifications

Feature Description
Structure Monolithic multilayer structure
Solderability Excellent, suitable for reflow and wave soldering
Class I Dielectrics (COG, COH) Highly stable with temperature, voltage, and time. Suitable for low-loss, high-stability high-frequency circuits.
Class II Dielectrics (X7R, X7S, X7T, X6S, X6T, X5R) High dielectric constant, higher capacitance than Class I. Stable temperature characteristics. Suitable for general-purpose circuits like DC blocking, coupling, bypassing, and frequency discrimination.
Standards GB/T 21041-2007, GB/T 21042-2007
Applications Filtering, coupling, resonance, bypassing, high-frequency electronic circuits.
Model Representation Size, Dielectric Type, Capacitance, Capacitance Tolerance, Rated Voltage, Terminal Material, Packaging Type
Product Structure Components 1. Ceramic Dielectric, 2. Inner Electrode, 3. Outer Electrode, 4. Nickel Layer, 5. Tin Layer
Temperature Coefficient/Characteristics (Example: COG) Reference Temp: 20C, Nominal Temp Coefficient: 0 30 ppm/C, Operating Temp Range: -55C to 125C
Temperature Coefficient/Characteristics (Example: X7R) Reference Temp: 20C, Nominal Temp Coefficient: 15%, Operating Temp Range: -55C to 125C
Size (Imperial/Metric) 1005 (0402), 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532)
Capacitance Range & Voltage (Example: C0G, 1005 size) 0.1pF (10V, 16V, 25V, 50V), 0.2pF (10V, 16V, 25V, 50V), ... 100pF (25V, 50V), ... 1nF (25V, 50V)
Capacitance Range & Voltage (Example: X7R, 0201 size) 120pF (6.3V, 10V, 16V, 25V, 50V), 180pF (6.3V, 10V, 16V, 25V, 50V), ... 1F (6.3V, 10V, 16V, 25V, 50V)
Reliability Test: Capacitance Specified Tolerance Level
Reliability Test: Insulation Resistance (IR) (Class I) C10 nF, Ri50000M; C10 nF, RiCR500S (Test Voltage: Rated Voltage)
Reliability Test: Dissipation Factor (DF, tan) (Class I) 1/(400+20C) (Test Frequency: 1MHz10% for C<30pF, 1KHz10% for C30pF)
Reliability Test: Dielectric Withstanding Voltage (DWV) No dielectric breakdown or damage. (Test Voltage: Class I: 300% rated voltage, Class II: 250% rated voltage)
Reliability Test: Soldering Heat Resistance C/C 2.5% or 0.25pF (whichever is larger); DF same as initial; IR same as initial; Appearance: No visible damage.
Reliability Test: Bending Strength C/C: Class I: 5% or 0.5pF (whichever is larger); Class II: 10%
Reliability Test: Terminal Strength No visible damage. Applied force T: 0402: 2N, 0603: 5N
Reliability Test: Temperature Cycling C/C: Class I: 1% or 1pF (whichever is larger); Class II: -15% ~+15%
Reliability Test: Damp Heat Load C/C: Class I: 7.5% or 0.75pF (whichever is larger); Class II: 12.5%; DF 2x initial; IR: Class I Ri5000M or RiCR50S; Class II Ri1000M or RiCR10S
Reliability Test: Life Test C/C: Class I: 3% or 0.3pF (whichever is larger); Class II: -20% ~ +20%; DF 2x initial; IR: Class I Ri4000M or RiCR40S; Class II Ri2000M or RiCR50S
Storage Conditions Temperature: 5~40, Relative Humidity: 20~70%
Shelf Life 12 months (for good solderability when properly packaged and delivered)
Recommended Soldering Method Reflow Soldering (R), Wave Soldering (W)
Recommended Reflow Soldering Peak Temp (Pb-Sn) 230250
Recommended Reflow Soldering Peak Temp (Lead-free) 240260
Recommended Wave Soldering Peak Temp (Pb-Sn) 230260
Recommended Wave Soldering Peak Temp (Lead-free) 240270

Note: All specifications are subject to change without notice. Please refer to the latest version.


2411061811_FH-0805B102K101NT_C285098.pdf

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