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Specifications
Voltage Rating:
6.3V
Capacitance:
2.2uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0201X225M6R3NT
Model Number:
0201X225M6R3NT
Package:
0201
Key Attributes
Product Description
Product Overview
This General Series Multi-layer Ceramic Capacitor (MLCC) offers high reliability through its monolithic structure of laminated layers. It features excellent soldering and solder resistance capabilities, making it suitable for reflow and wave soldering processes. The MLCC provides high and stable capacitance. Class I dielectrics (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II dielectrics (X7R, X7S, X7T, X6S, X6T, X5R) offer higher capacitance than Class I with stable temperature characteristics, suitable for DC-blocking, decoupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: Fenghua (implied by Revision History and Application Restrictions)
- Type: General Series Multi-layer Ceramic Capacitor (MLCC)
- Dielectric Types: C0G, C0H (Class I); X7R, X7S, X7T, X6S, X6T, X5R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
Product Structure
| No. | Name |
|---|---|
| Ceramic dielectric | |
| Inner electrode | |
| Substrate electrode | |
| Nickel Layer | |
| Tin Layer |
Product Dimensions (EIA Size Code)
| Size Code | Metric (LW) mm | Thickness (T) mm |
|---|---|---|
| 01005 | 0.400.20 | 0.200.02 |
| 0201 | 0.600.30 | 0.300.03 / 0.300.09 / 0.500.05 |
| 0402 | 1.000.50 | 0.500.05 / 0.500.15 / 0.500.20 |
| 0603 | 1.600.80 | 0.800.10 / 0.800.20 |
| 0805 | 2.001.25 | 0.800.20 / 1.250.25 |
| 1206 | 3.201.60 | 0.800.20 / 1.250.25 / 1.600.30 |
| 1210 | 3.202.50 | 1.250.25 / 1.600.30 / 2.500.30 |
| 1808 | 4.502.00 | 1.600.30 / 2.000.30 |
| 1812 | 4.503.20 | 1.600.30 / 2.000.30 |
Temperature Coefficient / Characteristics
| Dielectric | Reference Temp. Point | Temp. Coefficient | Operation Temp. Range |
|---|---|---|---|
| C0G | 25 | 030ppm/ | -55125 |
| X7R | 25 | 15% | -55125 |
| X7S | 25 | 22% | -55125 |
| X7T | 25 | -33%~+22% | -55125 |
| X6S | 25 | 22% | -55105 |
| X6T | 25 | -33%~+22% | -55105 |
| X5R | 25 | 15% | -5585 |
Capacitance Range and Voltage (Partial Data for Class II)
| Dimension | Dielectric | Voltage | Capacitance Code |
|---|---|---|---|
| 1005 (0.4mm*0.2mm) | X7R Series | 6.3V | AA |
| 1005 (0.4mm*0.2mm) | X7R Series | 50V | AA |
| 0201 (0.6mm*0.3mm) | X7R Series | 6.3V | BA |
| 0201 (0.6mm*0.3mm) | X7R Series | 50V | BA |
| 0402 (1.0mm*0.5mm) | X7R Series | 6.3V | CA |
| 0402 (1.0mm*0.5mm) | X7R Series | 50V | CA |
| 0603 (1.6mm*0.8mm) | X7R Series | 6.3V | DA |
| 0603 (1.6mm*0.8mm) | X7R Series | 50V | DA |
| 0805 (2.0mm*1.25mm) | X7R Series | 6.3V | EA |
| 0805 (2.0mm*1.25mm) | X7R Series | 50V | EA |
| 1206 (3.2mm*1.6mm) | X7R Series | 6.3V | FA |
| 1206 (3.2mm*1.6mm) | X7R Series | 50V | FA |
| 1210 (3.2mm*2.5mm) | X7R Series | 6.3V | GA |
| 1210 (3.2mm*2.5mm) | X7R Series | 50V | GA |
| 1812 (4.5mm*3.2mm) | X7R Series | 6.3V | IB |
| 1812 (4.5mm*3.2mm) | X7R Series | 50V | IB |
Reliability Test Methods (Summary)
| Item | Technical Specification | Test Method and Remarks |
|---|---|---|
| Capacitance | Class I: Specified tolerance Class II: Specified tolerance | Class I: 1MHz10% (1000pF), 1KHz10% (>1000pF) Class II: 253, <70%RH; C10F: 1KHz10% (1.00.2Vrms); C>10F: 120Hz24Hz (0.50.1Vrms) |
| Insulation Resistance (IR) | Class I: Ri50000M (C10nF), RiCR500S (C>10nF) Class II: Ri10000M (C25nF), RiCR100S (C>25nF) | Rated Voltage, 605s, 75%RH, 253 |
| Dissipation Factor (DF, tan) | Class I: 1/(400+20C) (C<30pF), 0.1% (C30pF) Class II: Varies by voltage and capacitance (see document for details) | Class I: 1MHz10% (1000pF), 1KHz10% (>1000pF) (1.00.2Vrms) Class II: Varies by voltage and capacitance (see document for details) |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage | Class I: 300% Rated Voltage; Class II: 250% Rated Voltage, 1~5s |
| Solderability | 95% solder coverage | Preheating: 80~120, 10~30s; Lead-free: 2455, 20.5s |
| Resistance to Soldering Heat | C/C 2.5% or 0.25pF; DF same as initial; IR same as initial; Appearance: No visible damage, 95% solder coverage | Preheating: 100~200, 60-120s; Solder Temp: 2655, 101s; Recovery: 242h |
| Resistance to Flexure | C/C: Class I: 5% or 0.5pF; Class II: 10%; Appearance: No visible damage | PCB warp: 1mm, Speed: 1mm/sec, measurement under bending |
| Termination Adhesion | No visible damage | Apply T force to side, hold 60+1s (Force varies by size) |
| Temperature Cycle | C/C: Class I: 1% or 1pF; Class II: -15%~+15%; Appearance: No visible damage | 5 cycles (-55 to +125/85/105), 30min each step, recovery 242h |
| Humidity Load | C/C: Class I: 7.5% or 0.75pF; Class II: 12.5%; DF 2x initial; IR varies by class | 402, 90~95%RH, Rated Voltage, 500h, recovery 242h (Specific post-test treatment for Class II) |
| Life Test | C/C: Class I: 3% or 0.3pF; Class II: -20%~+20%; DF 2x initial; IR varies by class | Low-Voltage (<100V): 1000h, 2x Ur, specified temperatures, recovery 242h (Specific post-test treatment for Class II) |
Packaging
| Package Type | Description |
|---|---|
| Embossed Plastic Taping | Applies to various sizes, with detailed dimensions provided. |
| Paper Taping | Suitable for 1005, 0201, 0402, 0603, 0805, 1206 types, with detailed dimensions provided. |
| Reel Dimensions | 7' REEL (1782.0) and 13' REEL (3302.0) |
| Taping Specification | Top tape peeling strength: 0.1N < strength < 0.7N |
| Packing Quantity | Varies by size, thickness, and reel type (7-inch or 13-inch, paper or embossed tape). |
| Outer Packing | Small package (10 reels), Large package (6 cases). |
Storage Precautions
- Relative humidity: 20~70%
- Storage temperature: 5~40 (recommended below 30)
- Avoid corrosive gases (H2S, SO2, Cl2, NH3, etc.)
- Do not store under direct sunlight or high humidity.
- Use immediately after delivery; check packaging and appearance after 6 months; check solderability after 1 year if stored.
Precautions Before Use (Pre-installation)
- Do not reuse capacitors removed from equipment.
- Confirm electrical characteristics (capacitance, voltage).
- Confirm characteristics under applied voltage.
- Confirm mechanical stress during use.
- Confirm solderability of long-stored capacitors.
- Perform heat treatment on long-stored capacitors before measurement.
Application Restrictions
- Intended for general consumer electronic devices (household appliances, office equipment, IT/communication devices, AV/OA equipment, mobile phones, PCs, etc.) under normal operating conditions.
- Not recommended for high-reliability applications such as aerospace, medical, aviation, atomic energy, disaster/crime prevention, electric heating, combustion, public information networks, data processing, military, power generation control, safety equipment, vehicle-mounted, traffic signals, transportation, and underwater equipment.
- Fenghua is not liable for damages resulting from use in restricted applications without prior written consent.
Soldering Conditions and Recommended Methods
| Soldering Method | Recommended Sizes & Capacitance | Notes |
|---|---|---|
| Reflow Soldering (R) | All sizes for C0G. 0201, 0402 for X7R/X5R/X7T/X6S. 0603: C<1uF. 0805: C<4.7uF. 1206: C<10uF. 1210 for X7R/X5R/X7T/X6S. | Temperature difference T 150 during preheating. Recommended pad sizes provided. |
| Wave Soldering (W) | 0603: C1uF. 0805: C4.7uF. 1206: C10uF. | Temperature difference T 150 during preheating. |
| Manual Soldering | All sizes. | Avoid direct contact of soldering iron tip with ceramic body. Max temp: 350, Max power: 20W, Max time: 3s, Solder amount 1/2 chip thickness. |
Recommended Reflow Pad Size (Unit: mm)
| Capacitor Size Code | L | W | A | B | C |
|---|---|---|---|---|---|
| 1005 | 0.400.02 | 0.200.02 | 0.16~0.20 | 0.12~0.18 | 0.20~0.23 |
| 0201 | 0.600.03 | 0.300.03 | 0.20~0.25 | 0.20~0.30 | 0.20~0.35 |
| 0201 (0.600.09) | 0.600.09 | 0.300.09 | 0.23~0.30 | 0.25~0.35 | 0.30~0.40 |
| 0402 | 1.000.05 | 0.500.05 | 0.30~0.50 | 0.35~0.45 | 0.40~0.60 |
| 0402 (1.000.15) | 1.000.15 | 0.500.15 | 0.40~0.60 | 0.40~0.50 | 0.50~0.70 |
| 0402 (1.000.20) | 1.000.20 | 0.500.20 | - | - | - |
| 0603 | 1.600.10 | 0.800.10 | 0.60~0.80 | 0.60~0.70 | 0.60~0.80 |
| 0603 (1.600.20) | 1.600.20 | 0.800.20 | 0.70~0.90 | 0.70~0.80 | 0.80~1.00 |
| 0805 | 2.000.20 | 1.250.25 | 1.00~1.40 | 0.60~0.80 | 1.20~1.40 |
| 1206 | 3.200.30 | 1.600.30 | 1.90~2.10 | 1.00~1.30 | 1.60~1.90 |
| 1210 | 3.200.30 | 2.500.30 | 2.00~2.40 | 1.00~1.30 | 2.50~2.80 |
| 1808 | 4.500.40 | 2.000.20 | 2.50~3.50 | 1.00~1.80 | 2.30~3.50 |
| 1812 | 4.500.40 | 3.200.30 | 2.50~3.50 | 1.00~1.80 | 2.30~3.50 |
Recommended Soldering Temperature Profile (Re-flow)
Temperature difference between soldering temperature and chip surface temperature should be kept at T 150 during preheating.
2512241501_FH-0201X225M6R3NT_C285111.pdf
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