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quality Multilayer Chip Ceramic Capacitors FH 0201X104K160NT for Surface Mount Applications in Electronic Devices factory
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quality Multilayer Chip Ceramic Capacitors FH 0201X104K160NT for Surface Mount Applications in Electronic Devices factory
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Specifications
Voltage Rating:
16V
Capacitance:
100nF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0201X104K160NT
Model Number:
0201X104K160NT
Package:
0201
Key Attributes
Product Description

Product Overview

This document details Multilayer Chip Ceramic Capacitors (MLCCs) designed for surface mounting. These capacitors are available in various dielectric types, including Class I (COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL) and Class II (X7R, X5R, X7S, X6S, Y5V, Z5U). They offer a wide range of capacitance values, voltage ratings, and operating temperature ranges, making them suitable for diverse electronic circuits such as DC-blocking, coupling, bypassing, and frequency discrimination. The product also includes a line of middle and high voltage MLCCs designed for reliable high-voltage applications.

Product Attributes

  • Manufacturer: GH (Implied from document numbering and content)
  • Product Type: Multilayer Chip Ceramic Capacitors
  • Dielectric Types: Class I (COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL), Class II (X7R, X5R, X7S, X6S, Y5V, Z5U)
  • Terminal Materials: Silver, Copper, Nickel Barrier
  • Packaging Styles: Bulk Bag, Taping Package
  • Executive Standards: GH/T 21041-2007, GH/T 21042-2007

Technical Specifications

Section Details
General Product Types Multilayer Chip Ceramic Capacitors (0201 to 2225 type)
Dielectric Material & Capacitor Types
  • Class I (High Frequency Type): COG, COH (most stable), HG, LG, PH, RH, SH, TH, UJ, SL (temperature compensating)
  • Class II: X7R, X5R, X7S, X6S (high dielectric constant, semi-stable temperature characteristic), Y5V (highest dielectric constant, unstable temperature coefficient), Z5U (temperature characteristic between X7R and Y5V, unstable)
Dimensions (Metric & Imperial)
  • 50V General Products: 1005 (0402), 0603 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532), 2220 (5750), 2225 (5763)
  • >50V Middle & High Voltage Products: 1005 (0402), 1608 (0603), 2012 (0805), 3216 (1206), 3225 (1210), 4520 (1808), 4532 (1812), 5750 (2220), 5763 (2225)
  • Specific dimensions (L, W, T, WB) are detailed for each size code and dielectric type, with variations based on capacitance values.
How to Order (Part Number Structure) Format: [DIMENSIONS][DIELECTRIC STYLE][NOMINAL CAPACITANCE][CAPACITANCE TOLERANCE][RATED VOLTAGE][TERMINAL MATERIAL STYLES][PACKAGE STYLES]
Example: 0805 CG 101 J 500 N T
  • Dimensions (Size Code): 1005 (0.4x0.2mm), 0201 (0.6x0.3mm), 0402 (1.0x0.5mm), 0603 (1.6x0.8mm), 0805 (2.0x1.25mm), 1206 (3.2x1.6mm), 1210 (3.2x2.5mm), 1808 (4.5x2.0mm), 1812 (4.5x3.2mm), 2220 (5.7x5.0mm), 2225 (5.7x6.3mm)
  • Dielectric Style Codes: CG (COG), CH (COH), HG, LG, PH, RH, SH, TH, UJ, SL, X (X5R), B (X7R), BS (X7S), DS (X6S), E (Y5V), F (Z5U)
  • Nominal Capacitance: pF (e.g., 101 = 10 x 10^1 pF = 100pF; R=decimal point, e.g., 0R5 = 0.5pF)
  • Capacitance Tolerance Codes: A (0.05pF), B (0.10pF), C (0.25pF), D (0.5pF), F (1.0%), G (2.0%), J (5.0%), K (10%), M (20%), S (+50%/-20%), Z (+80%/-20%)
  • Rated Voltage (V): e.g., 6R3 (6.3V), 500 (500V), 201 (200V), 102 (1000V)
  • Terminal Material Styles: S (Silver), C (Copper), N (Nickel Barrier)
  • Package Styles: B (Bulk Bag), T (Taping Package)
Temperature Coefficient/Characteristics
  • Class I: COG (030 ppm/), COH (060 ppm/), HG (-3330 ppm/), LG (-7530 ppm/), PH (-15060 ppm/), RH (-22060 ppm/), SH (-33060 ppm/), TH (-47060 ppm/), UJ (-750120 ppm/), SL (-1000+140 ppm/). Operating Temp: -55 to 125 (COG, COH), -25 to 85 (others).
  • Class II: X7R (15%), X5R (15%), X7S (22%), X6S (22%), Z5U (-56%+22%), Y5V (-80%+30%). Operating Temp: Varies by type (-55 to 125, -55 to 85, -55 to 105, 10 to 85, -25 to 85).
Capacitance Range and Operating Voltage Detailed tables provided for various size codes, dielectric types, rated voltages, and capacitance ranges (in pF, nF, F). Specific thickness values in mm are indicated in brackets `[]`.
Middle & High Voltage MLCC Applications Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Reliability Test Items Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Termination Adhesion, Temperature Cycle, Humidity Load, Life Test. Detailed specifications and test methods are provided for each.
Packaging
  • Embossed Plastic Taping (EPT)
  • Paper Taping (PT)
  • Embossed Taping (ET)
  • Bulk Case Package (BC)
  • General Bulk Package (BP)
  • Reel dimensions (7' and 13') and taping specifications (dimensions, leader/end parts, tape peeling strength) are detailed.
Storage Methods
  • Guaranteed solderability period: 12 months (under delivered package condition).
  • Storage Conditions: Temperature 5~40, Relative Humidity 20~70%.
Precautions For Use
  • Potential for failure in short or open circuits. Risk of fire, burning, or explosion under severe conditions.
  • Adherence to specified ratings and conditions is crucial.
  • Soldering conditions (profile, manual soldering, solder amount) must be carefully managed to prevent damage.
Recommended Soldering Method Reflow Soldering (R), Wave Soldering (W) are recommended based on size, temperature characteristics, rated voltage, and capacitance.
Recommended Soldering Temperature Profile Detailed temperature profiles for Pb-Sn and Lead-free soldering (Reflow and Wave) are provided, including peak temperatures and preheating guidelines. Manual soldering conditions are also specified.

Note: The latest version of the content is authoritative.


2410121228_FH-0201X104K160NT_C2846674.pdf

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