Product Overview
This document details Multilayer Chip Ceramic Capacitors (MLCCs) designed for surface mounting. These capacitors are available in various dielectric types, including Class I (COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL) and Class II (X7R, X5R, X7S, X6S, Y5V, Z5U). They offer a wide range of capacitance values, voltage ratings, and operating temperature ranges, making them suitable for diverse electronic circuits such as DC-blocking, coupling, bypassing, and frequency discrimination. The product also includes a line of middle and high voltage MLCCs designed for reliable high-voltage applications.
Product Attributes
- Manufacturer: GH (Implied from document numbering and content)
- Product Type: Multilayer Chip Ceramic Capacitors
- Dielectric Types: Class I (COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL), Class II (X7R, X5R, X7S, X6S, Y5V, Z5U)
- Terminal Materials: Silver, Copper, Nickel Barrier
- Packaging Styles: Bulk Bag, Taping Package
- Executive Standards: GH/T 21041-2007, GH/T 21042-2007
Technical Specifications
| Section | Details |
|---|---|
| General Product Types | Multilayer Chip Ceramic Capacitors (0201 to 2225 type) |
| Dielectric Material & Capacitor Types |
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| Dimensions (Metric & Imperial) |
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| How to Order (Part Number Structure) | Format: [DIMENSIONS][DIELECTRIC STYLE][NOMINAL CAPACITANCE][CAPACITANCE TOLERANCE][RATED VOLTAGE][TERMINAL MATERIAL STYLES][PACKAGE STYLES]Example: 0805 CG 101 J 500 N T
|
| Temperature Coefficient/Characteristics |
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| Capacitance Range and Operating Voltage | Detailed tables provided for various size codes, dielectric types, rated voltages, and capacitance ranges (in pF, nF, F). Specific thickness values in mm are indicated in brackets `[]`. |
| Middle & High Voltage MLCC Applications | Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters. |
| Reliability Test Items | Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Termination Adhesion, Temperature Cycle, Humidity Load, Life Test. Detailed specifications and test methods are provided for each. |
| Packaging |
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| Storage Methods |
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| Precautions For Use |
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| Recommended Soldering Method | Reflow Soldering (R), Wave Soldering (W) are recommended based on size, temperature characteristics, rated voltage, and capacitance. |
| Recommended Soldering Temperature Profile | Detailed temperature profiles for Pb-Sn and Lead-free soldering (Reflow and Wave) are provided, including peak temperatures and preheating guidelines. Manual soldering conditions are also specified. |
Note: The latest version of the content is authoritative.
2410121228_FH-0201X104K160NT_C2846674.pdf
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