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quality Multilayer Chip Ceramic Capacitors FH 0402X106M100NT Suitable for DC Blocking Coupling and Bypassing factory
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quality Multilayer Chip Ceramic Capacitors FH 0402X106M100NT Suitable for DC Blocking Coupling and Bypassing factory
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Specifications
Voltage Rating:
10V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0402X106M100NT
Model Number:
0402X106M100NT
Package:
0402
Key Attributes
Product Description

Product Overview

The GH-ZD4132E Multilayer Chip Ceramic Capacitors (MLCC) are designed for surface mounting and offer a wide range of dielectric materials, including Class I (High Frequency types like COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL) and Class II (X7R, X5R, X7S, X6S, Y5V, Z5U). These capacitors are suitable for various applications requiring stable electrical properties, temperature compensation, or high capacitance in diverse circuit types such as DC-blocking, coupling, bypassing, and frequency discrimination. The product line includes standard and middle-to-high voltage variants, engineered for reliability and performance in demanding electronic circuits.

Product Attributes

  • Manufacturer: Not specified (Implied from document context)
  • Product Type: Multilayer Chip Ceramic Capacitors (MLCC)
  • Dielectric Materials: COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL (Class I); X7R, X5R, X7S, X6S, Y5V, Z5U (Class II)
  • Terminal Material Styles: Pure Silver (S), Pure Copper (C), Nickel Barrier (N)
  • Packaging Styles: Bulk Bag (B), Taping Package (T)

Technical Specifications

Note: Detailed specifications for dimensions, capacitance ranges, and voltage ratings vary significantly by size code and dielectric type. The table below provides a representative overview of available sizes and general categories. Refer to the full document for comprehensive data.

Size Code (Metric) Size Code (Imperial) Dimensions (L x W x T) [mm] General Dielectric Types Voltage Range Capacitance Range (Example)
1005 0201 0.4 x 0.2 x 0.2 All Dielectric 50V 0.1pF - 220pF (COG)
1608 0603 0.6 x 0.3 x 0.3 All Dielectric 50V 0.1pF - 10F (Various Dielectrics)
2012 0805 1.0 x 0.5 x 0.5 Y5V/Z5U 50V 0.47F - 1F
2012 0805 1.0 x 0.5 x 0.5 Excluding Y5V/Z5U 50V 0.1F - 10F
2012 0805 2.0 x 1.25 x 0.8 (or 1.25) Excluding Y5V/Z5U > 50V (High Voltage) 0.1F - 4.7F
3216 1206 1.6 x 0.8 x 0.8 (or 1.25, 1.6) All Dielectric 50V 0.1F - 3.3F (Various Dielectrics)
3216 1206 3.2 x 1.6 x 0.8 (or 1.0, 1.25, 1.6) Excluding Y5V/Z5U > 50V (High Voltage) 0.1F - 0.47F
3225 1210 3.2 x 2.5 x 2.8 (or other thickness) All Dielectric 50V 0.1F - 10F (Various Dielectrics)
3225 1210 3.2 x 2.5 x 2.8 (or other thickness) NPO, X7R > 50V (High Voltage) 1.0F - 6.8F (NPO), 0.15F - 2.2F (X7R)
4520 1808 4.5 x 2.0 x 2.2 All Dielectric 50V 0.22nF - 4.7F (Various Dielectrics)
4520 1808 4.5 x 2.0 x 2.2 NPO, X7R > 50V (High Voltage) 2.0F - 4.7F (NPO), 0.22F - 2.2F (X7R)
4532 1812 4.5 x 3.2 x 3.5 All Dielectric 50V 0.47nF - 100F (Various Dielectrics)
4532 1812 4.5 x 3.2 x 3.5 NPO, X7R > 50V (High Voltage) 3.0F - 10F (NPO), 0.27F - 0.56F (X7R)
5750 2220 5.7 x 5.0 x 3.5 All Dielectric 50V 5.0F - 27F (NPO), 22nF - 2.2F (X7R)
5750 2220 5.7 x 5.0 x 3.5 NPO, X7R > 50V (High Voltage) 5.0F - 27F (NPO), 22nF - 2.2F (X7R)
5763 2225 5.7 x 6.3 x 6.2 All Dielectric 50V 5.0F - 27F (NPO), 2.2nF - 1.5F (X7R)
5763 2225 5.7 x 6.3 x 6.2 NPO, X7R > 50V (High Voltage) 5.0F - 27F (NPO), 2.2nF - 1.5F (X7R)

Reliability and Testing

The product undergoes various reliability tests including capacitance, dissipation factor (DF), insulation resistance (IR), dielectric withstanding voltage (DWV), solderability, resistance to soldering heat, flexure strength, termination adhesion, temperature cycling, humidity load, and life testing. Specific test methods and criteria are detailed in the document.

Storage and Handling

Storage Conditions: Temperature 5~40, Relative Humidity 20~70%. Guaranteed solderability period is 12 months under delivered package conditions.

Precautions for Use: MLCCs may fail in short or open circuit modes. Avoid operating beyond specified ratings. Follow recommended soldering profiles and techniques to prevent chip cracking, burning, or explosion. Ensure optimal solder amount and use appropriate soldering methods (Reflow, Wave, or Manual) with careful temperature control.


2209261001_FH-0402X106M100NT_C2846677.pdf

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