Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Based on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure for high reliability, excellent soldering and resistance properties suitable for reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA ()
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Types | High Voltage Multi-layer Ceramic Capacitors (MLCC) |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient / Characteristics |
|
| Capacitance Range & Voltage | Refer to detailed tables for Class I (C0G) and Class II (X7R) capacitors, listing specific voltage ratings, capacities, and corresponding dimensions/thicknesses. |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (Vr), involving applying 120% to 250% of Vr for 5 seconds with specific current limits. |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed for Class I and Class II capacitors. |
| Package Styles |
|
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W), Manual Soldering. Specific temperature profiles and conditions are provided. |
2511191605_FH-0402B221K500NT_C1530.pdf
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