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quality High capacitance multi layer ceramic capacitors FH 0402CG101J500NT designed for stable and operation factory
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quality High capacitance multi layer ceramic capacitors FH 0402CG101J500NT designed for stable and operation factory
>
Specifications
Voltage Rating:
50V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0402CG101J500NT
Model Number:
0402CG101J500NT
Package:
0402
Key Attributes
Product Description

General Series Multi-layer Ceramic Capacitors (MLCC)

Product Overview

This General Series Multi-layer Ceramic Capacitor (MLCC) features a monolithic structure of laminated layers, offering high reliability. It boasts excellent soldering and solder resistance capabilities, making it suitable for both reflow and wave soldering processes. The MLCC provides high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, virtually unaffected by temperature, voltage, or time, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X7S, X7T, X6S, X6T, X5R) utilize materials with higher dielectric constants, providing higher capacitance than Class I. They exhibit relatively stable temperature characteristics and are suitable for circuits requiring a wide capacitance range and less stringent stability, such as DC-blocking, coupling, bypassing, and frequency discriminating applications.

Product Attributes

  • Brand: Fenghua (implied by context and revision history)
  • Type: General Series Multi-layer Ceramic Capacitors (MLCC)
  • Dielectric Materials: C0G, X7R, X7S, X7T, X6S, X6T, X5R
  • Standards: GB/T 21041-2007, GB/T 21042-2007

Technical Specifications

Category Specification Details
Features Structure Monolithic structure of laminated layers
Soldering Capability Excellent soldering and solder resistance, suitable for reflow and wave soldering
Capacitance High and stable capacitance
Dielectric Characteristics Class I (C0G, C0H) Most stable electrical performance, virtually unaffected by temperature, voltage, or time. Suitable for low-loss, high-stability high-frequency circuits.
Class II (X7R, X7S, X7T, X6S, X6T, X5R) High dielectric constant, higher capacitance than Class I, relatively stable temperature characteristics. Suitable for circuits requiring wide capacitance range and less stringent stability (DC-blocking, coupling, bypassing, frequency discriminating).
Product Structure Components Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer
Dimensions (EIA) 01005 (0.40x0.20mm), 0201 (0.60x0.30mm), 0402 (1.00x0.50mm), 0603 (1.60x0.80mm), 0805 (2.00x1.25mm), 1206 (3.20x1.60mm), 1210 (3.20x2.50mm), 1808 (4.50x2.00mm), 1812 (4.50x3.20mm)
Nominal Capacitance Expression First two digits are significant figures, third digit denotes number of zeros; R for decimal point.
Capacitance Tolerance Codes A (0.05pF for 10pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%)
Rated Voltage Expression First two digits are significant figures, third digit denotes number of zeros; R for decimal point. (e.g., 6R3 = 6.3V, 500 = 500V)
Terminal Material Styles Nickel Barrier Termination N
Flexible Solderable Termination A, T
Package Styles Braided 7 inch disc packing T
Braided 13 inch disc packing D
Product Dimensions (mm) Size Code AA (1005) L: 0.400.02, W: 0.200.02, T: 0.200.02, WB: 0.100.03
Size Code BA (0201) L: 0.600.03, W: 0.300.03, T: 0.300.03, WB: 0.150.05
Size Code BB (0201) L: 0.600.09, W: 0.300.09, T: 0.300.09, WB: 0.150.05
Size Code BC (0201) L: 0.600.09, W: 0.300.09, T: 0.500.05, WB: 0.150.10
Size Code CA (0402) L: 1.000.05, W: 0.500.05, T: 0.500.05, WB: 0.250.05
Size Code CB (0402) L: 1.000.15, W: 0.500.15, T: 0.500.15, WB: 0.250.05
Size Code CC (0402) L: 1.000.20, W: 0.500.20, T: 0.500.20, WB: 0.250.05
Size Code DA (0603) L: 1.600.10, W: 0.800.10, T: 0.800.10, WB: 0.350.20
Size Code DB (0603) L: 1.600.20, W: 0.800.20, T: 0.800.20, WB: 0.350.20
Size Code EA (0805) L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 0.500.20
Size Code EB (0805) L: 2.000.20, W: 1.250.25, T: 1.250.25, WB: 0.500.20
Size Code FA (1206) L: 3.200.30, W: 1.600.30, T: 0.800.20, WB: 0.600.30
Temperature Coefficient / Characteristics Dielectric Reference Temperature Point Temperature Coefficient Operation Temperature Range
C0G 25 030ppm/ -55125
X7R 25 15% -55125
X7S 25 22% -55125
X7T 25 -33%~+22% -55125
X6S 25 22% -55105
X6T 25 -33%~+22% -55105
X5R 25 15% -5585
Application Filtering, coupling, resonance, bypassing, high-frequency electronic circuits
General consumer electronic devices (household appliances, office equipment, information and communication devices, AV equipment, OA equipment, mobile phones, PCs)
Application Restrictions Not recommended for high-reliability applications such as aerospace, medical, aviation, atomic energy, disaster prevention, crime prevention, electric heating, combustion, public information network, data processing, military, power generation control, safety equipment, vehicle-mounted, traffic signal, transportation, and underwater equipment.
Fenghua is not liable for damages resulting from use in restricted applications without prior written consent.
Reliability Test Methods Aging Treatment (Class II) Heat treatment at 150 for 1 hour, then measure after 24 hours at 253, <70%RH.
Capacitance Measurement Class I: Specified tolerance, 1MHz10% for 1000pF, 1KHz10% for >1000pF. Class II: Specified tolerance, 1KHz10% for C10F, 12024 Hz for C>10F. Test voltage: 1.00.2Vrms (10F), 0.50.1Vrms (>10F).
Insulation Resistance (IR) Class I: C10nF, Ri50000M; C>10nF, RiCR500S. Class II: C25nF, Ri10000M; C>25nF, RiCR>100S. Test voltage: Rated voltage (Max 500V), 605s, 75%RH, 253.
Dissipation Factor (DF, tan) Class I: 1/(400+20C) for C<30pF, 0.1% for C30pF. Class II: Varies by voltage and capacitance (detailed in datasheet).
Dielectric Withstanding Voltage (DWV) Class I: 300% rated voltage; Class II: 250% rated voltage. Duration: 1~5s. Charge/Discharge Current: 50mA max. (Excludes high-voltage MLCCs).
Solderability 95% tin coverage on terminal electrode. No visible damage. Preheating: 80-120 for 10-30s. Lead-free: 2455 for 20.5s.
Resistance to Soldering Heat C/C: Class I: 2.5% or 0.25pF; Class II: 15%. DF and IR: Same as initial. Appearance: No visible damage, 95% tin coverage. Preheating: 100-200 for 60-120s. Solder Temp: 2655 for 101s. Recovery: 242h.
Resistance to Flexure C/C: Class I: 5% or 0.5pF; Class II: 10%. Appearance: No visible damage. Test Board: PCB, Warp: 1mm, Speed: 1mm/sec. Measurement during bending.
Termination Adhesion No visible damage. Apply T force to capacitor side body for 601s. Force: 0402: 2N, 0603: 5N.
Temperature Cycle C/C: Class I: 1% or 1pF; Class II: -15%~+15%. Appearance: No visible damage. 5 cycles: -55 (30min), +20 (2-3min), High Temp (30min), +20 (2-3min). Recovery: 242h.
Humidity Load C/C: Class I: 7.5% or 0.75pF; Class II: 12.5%. DF: 2x initial. IR: Class I: Ri5000M or RiCR50S; Class II: Ri1000M or RiCR10S. Temp: 402, Humidity: 90-95%RH, Voltage: Rated, Duration: 500h. Recovery: 242h. Class II requires 150/1h heat treatment before recovery.
Life Test C/C: Class I: 3% or 0.3pF; Class II: -20%~+20%. DF: 2x initial. IR: Class I: Ri4000M or RiCR40S; Class II: Ri2000M or RiCR50S. Duration: 1000h. Voltage: 2x rated (except table 1). Temp: 125 (C0G, X7R, X7S), 85 (X5R), 105 (X6S, X6T). Recovery: 242h. Class II requires 150/1h heat treatment before recovery.
Packaging Embossed Plastic Taping, Paper Taping, Reel dimensions (7', 13'), Top tape peeling strength (0.1N-0.7N).
Packing Quantity Varies by size code, thickness, and reel type (e.g., 1005, 0.200.02mm, 7' PT: 20000 pcs). Quantities can be customized.
Storage Conditions Relative humidity: 20-70%, Temperature: 5-40 (recommended <30). Avoid corrosive gases, direct sunlight, and high humidity. Use promptly after delivery. Check solderability if stored for over a year.
Pre-installation Precautions Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment before measurement if stored long-term.
Soldering Conditions Reflow soldering (temperature difference T150). Wave soldering (temperature difference T150). Manual soldering: Max 350 tip temp, Max 20W, 1mm tip diameter, max 3s, avoid direct contact with ceramic. Recommended pad sizes provided.
Revision History Version A0001 (2024-1-15), A0002 (2025-1-25), A0003 (2025-8-29), A0004 (2025-10-31) detailing format updates, DF test changes, and illustration/condition updates.

2512241501_FH-0402CG101J500NT_C1546.pdf

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