Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are specifically designed for high-voltage DC circuits, offering enhanced reliability and performance in surface-mount applications. Built upon advanced MLCC technology, these capacitors feature a monolithic laminated structure for robust performance. They exhibit excellent soldering capabilities suitable for both reflow and wave soldering processes, ensuring high and stable capacitance values. These components are ideal for demanding applications including analog/digital modems, LAN/WAN interfaces, lighting ballast circuits, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: FENGHUA (Implied from document context)
- Product Type: High-Voltage Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Capacitance Range | 0.5pF to 10F (Varies by dielectric, size, and voltage) |
| Rated Voltage Range | 6.3V to 5000V (Varies by dielectric, size, and capacitance) |
| Temperature Coefficient / Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Dimensions (mm) | L x W: e.g., 0402 (1.000.50), 0603 (1.600.80), 0805 (2.001.25), etc. (Detailed in table) |
| Thickness (T) | Refer to 'Capacity Range and Voltage' section for specific values. |
| Ordering Code Structure | Size Code, Nominal Capacitance, Dielectric Code, Capacitance Tolerance, Rated Voltage, Termination Material, Package Style |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 250% of rated voltage for 5 seconds for Vr=100V, max 50mA). |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test. |
| Packaging Options | Paper Taping (7" & 13" reels), Embossed Taping (7" & 13" reels) |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability for 12 months. |
| Recommended Soldering Methods | Reflow Soldering, Wave Soldering, Manual Soldering (with specific temperature profiles and precautions). |
2511191605_FH-0402CG180J500NT_C1549.pdf
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