General Series Multi-layer Ceramic Capacitors (MLCC)
Product Overview
This series of General Type MLCCs features a monolithic structure of laminated layers, offering high reliability and excellent soldering and solder resistance capabilities suitable for reflow and wave soldering. They provide high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability, high-frequency circuits. Class II capacitors (X7R, X5R, X7S, X7T, X6S, X6T) offer higher capacitance with stable temperature characteristics, suitable for DC-blocking, coupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: Fenghua (implied by context)
- Type: General Series Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Materials: Class I (C0G, C0H), Class II (X7R, X7S, X7T, X6S, X6T, X5R)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Features | Structure | Monolithic structure of laminated layers |
| Soldering Capability | Excellent soldering and solder resistance, suitable for reflow and wave soldering | |
| Capacitance | High and stable capacitance | |
| Application Scope | General | Filtering, coupling, harmonic vibration, bypassing, high-frequency circuits |
| Class I (C0G, C0H) | Low-loss, high-stability, high-frequency circuits | |
| Class II (X7R, X5R, etc.) | General | DC-blocking, coupling, bypassing, frequency discriminating circuits |
| Characteristics | Higher dielectric constant, higher capacitance than Class I, semi-stable temperature characteristics, wide operating temperature range | |
| Product Structure | Components | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Dimensions (EIA) | 01005 (0.40x0.20mm), 0201 (0.60x0.30mm), 0402 (1.00x0.50mm), 0603 (1.60x0.80mm), 0805 (2.00x1.25mm), 1206 (3.20x1.60mm), 1210 (3.20x2.50mm), 1808 (4.50x2.00mm), 1812 (4.50x3.20mm) | |
| Dielectric Codes | CG (C0G), X (X5R), B (X7R), BS (X7S), BT (X7T), DS (X6S), DT (X6T) | |
| Capacitance Tolerance Codes | A (0.05pF for 10pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) | |
| Terminal Material Styles | N (Nickel Barrier Termination), T (Flexible Solderable Termination) | |
| Package Styles | Code | T (Braided 7 inch disc packing), D (Braided 13 inch disc packing) |
| Dimensions | Refer to specific tables for detailed dimensions (e.g., 01005, 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812) | |
| Temperature Coefficient / Characteristics | Dielectric | C0G, X7R, X7S, X7T, X6S, X6T, X5R |
| Reference Temperature Point | 25C | |
| Temperature Coefficient (C0G) | 0 30ppm/C | |
| Operating Temperature Range | -55C to 125C (for C0G, X7R, X7S, X7T); -55C to 105C (for X6S, X6T); -55C to 85C (for X5R) | |
| Temperature Variation (Class II) | X7R/X7S: 15%; X7T: -33% to +22%; X6S: 22%; X6T: -33% to +22%; X5R: 15% | |
| Aging (Class II) | Requires aging treatment before capacity measurement (150C for 1 hour, then 24 hours rest) | |
| Capacitance Range and Voltage | Class I (C0G) | Refer to detailed tables for specific voltage ratings (10V, 16V, 25V, 50V) and corresponding dimensions/capacitance values. |
| Class II (X7R, X7S, X7T, X6S/X6T, X5R) | Refer to detailed tables for specific voltage ratings (6.3V to 50V) and corresponding dimensions/capacitance values. | |
| High Voltage Capacitors | High voltage models can cover low voltage models; X7R can cover X7S, X7T, X6S, X5R for same spec/capacity/voltage. | |
| Reliability Test Methods | Capacitance | Class I: Specified tolerance. Class II: Specified tolerance (with aging). |
| Insulation Resistance (IR) | Class I & II: Specified values based on capacitance and voltage. | |
| Dissipation Factor (DF, tan) | Class I & II: Specified values based on capacitance, voltage, and frequency. | |
| Dielectric Withstanding Voltage (DWV) | Class I: 300% Rated Voltage. Class II: 250% Rated Voltage. | |
| Solderability | >95% tin coverage, no visible damage. | |
| Soldering Conditions | Reflow Soldering | Refer to recommended temperature profile. Preheating temperature difference T 150C. |
| Wave Soldering | Refer to recommended temperature profile. Preheating temperature difference T 150C. | |
| Manual Soldering | Careful operation recommended. Avoid direct contact with ceramic. Max temp 350C, Max power 20W, Max time 3s. | |
| Storage Precautions | Conditions | Relative humidity 20-70%, temperature 5-40C (recommended <30C). Avoid corrosive gases, direct sunlight, and high humidity. Use promptly after delivery. Check solderability if stored for over a year. |
| Pre-installation Precautions | General | Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Heat treat long-stored capacitors before measurement. |
| Application Restrictions | General Consumer Electronics | Intended for household appliances, office equipment, information and communication devices, AV equipment, OA equipment, mobile phones, PCs, etc. |
| High-Reliability Applications | Not Recommended | Aerospace, medical, aviation, atomic energy, disaster prevention, crime prevention, electric heating, combustion, public information network, data processing, military, power generation control, safety, vehicle-mounted, traffic signal, transportation, and underwater equipment. Fenghua is not liable for damages if used in these applications without prior written consent. |
2512241501_FH-0402CG200J500NT_C1554.pdf
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