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quality High voltage multi layer ceramic capacitors FH 0603B682K500NT suitable for surface mounting and high DC voltage circuits factory
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quality High voltage multi layer ceramic capacitors FH 0603B682K500NT suitable for surface mounting and high DC voltage circuits factory
>
Specifications
Voltage Rating:
50V
Capacitance:
6.8nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603B682K500NT
Model Number:
0603B682K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and are suitable for various high DC voltage circuits, offering improved circuit performance. These capacitors feature a monolithic structure of laminated layers for high reliability, excellent soldering capabilities for reflow and peak soldering, and provide high and stable capacitance. They are manufactured based on general MLCC technology and equipment, with special design considerations for high voltage reliability.

Product Attributes

  • Manufacturer: FENGHUA
  • Product Name: High-Voltage Multi-layer Ceramic Capacitors
  • Series: High Voltage Series Of Ceramic Chip Capacitors
  • Executive Standards: GB/T 21041-2007, GB/T 21042-2007

Technical Specifications

Section Details
Features
  • High voltage reliability
  • Suitable for surface mounting (SMT)
  • Applicable for direct high voltage circuits
  • Monolithic structure of laminated layers
  • Excellent soldering ability and resistance
  • High and stable capacitance
Application Scope
  • Analog & Digital Modems
  • LAN/WAN Interface
  • Lighting Ballast Circuits
  • Voltage Multipliers
  • DC-DC Converters
  • Back-lighting Inverters
Product Structure
  1. Ceramic dielectric
  2. Inner electrode
  3. Outer electrode
  4. Nickel Layer
  5. Tin Layer
Dimensions (EIA)
Size Code Length (L) mm Width (W) mm Thickness (T) mm (Refer to Capacitance Range & Voltage section) WB mm
0402 1.000.05 0.500.05 0.500.05 0.250.05
0603 1.600.10 0.800.10 0.800.10 0.350.20
0805 2.000.20 1.250.25 0.800.20 / 1.250.25 0.500.20
1206 3.200.30 1.600.30 0.800.20 / 1.250.25 / 1.600.30 0.600.30
1210 3.200.30 2.500.30 1.250.25 / 1.600.30 / 2.000.30 / 2.500.30 0.600.30
1808 4.600.40 2.000.30 1.600.30 / 2.00.30 0.600.30
1812 4.600.40 3.200.30 1.250.25 / 1.600.30 / 2.000.30 / 2.500.30 0.600.30
1825 4.600.40 6.300.50 1.600.30 / 2.000.30 / 2.500.30 0.600.30
2211 5.700.40 2.800.40 1.600.30 / 2.000.30 0.600.30
2220 5.700.40 5.000.40 1.600.30 / 2.000.30 / 2.500.30 0.600.30
2225 5.700.50 6.300.50 1.600.30 / 2.000.30 / 2.500.30 0.600.30
Temperature Coefficient / Characteristics
Dielectric Reference Temperature Point Nominal Temperature Coefficient Operation Temperature Range
C0G 25C 030ppm/ -55125
X7R 25C 15% -55125
Capacitance Range and Voltage (Detailed tables for Class I (C0G) and Class II (X7R) capacitors with specific voltage ratings, capacities, and corresponding thickness codes are provided in the original document. Due to length constraints, these are not fully reproduced here but are critical for detailed selection.)

Class I (C0G) Example:

Dimension Capacity/Voltage Code Thickness (T) mm
0402 (1.0mm*0.5mm) 100V DA 0.500.05
0603 (1.6mm*0.8mm) 250V EA 0.800.10
1206 (3.2mm*1.6mm) 1KV FC 1.600.30
2225 (5.7mm*6.3mm) 3KV MC 2.500.30

Class II (X7R) Example:

Dimension Capacity/Voltage Code Thickness (T) mm
0402 (1.0mm*0.5mm) 100V EA 0.800.20
0805 (2.0mm*1.2mm) 2000V EB 1.250.25
1206 (3.2mm*1.6mm) 2500V FC 1.600.30
2225 (5.7mm*6.3mm) 5000V MC 2.500.30
Measurement Method of Dielectric Withstanding Voltage
Rated Voltage Range Measuring Method
Vr=100V Force 250%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
100VVr500V Force 200%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
500VVr1000V Force 150%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
1000VVr2000V Force 120%Rated voltage for 5 seconds. Max. current should not exceed 50 mA.
2000VVr5000V Force 120%Rated voltage for 5 seconds. Max. current should not exceed 10 mA.
Reliability Test (Comprehensive reliability tests including Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test are detailed in the original document. Key parameters are summarized below.)
  • Aging for Class II: Heat treated at 150 for 1 hour, measured after 48 hours.
  • Insulation Resistance (IR) Example (Class I): C10 nF, Ri50000M; C10 nF, RiCR500S. Test Voltage: Rated Voltage (Max 500V).
  • Resistance to Soldering Heat: Solder Temp: 2655, Duration: 101s. Recovery: 242h.
  • Temperature Cycle: 5 cycles, -55 to +125.
  • Humidity Load: 402, 90-95%RH, 500 hours.
  • Life Test: 1000 hours at 125 with applied voltage (e.g., 1.5Ur for 100VVr200V).
Package
  • Available in Paper Taping (7" and 13" reels) and Embossed Taping (plastic reels).
  • Specific dimensions for paper and embossed taping are provided for various sizes (e.g., 0402, 0603, 0805, 1206, 1210, 1808, 1812, 2220, 2225).
  • Reel dimensions: 7" REEL (1782.0mm), 13" REEL (3302.0mm).
  • Taping specification: Top tape peeling strength standard: 0.1N < peeling strength < 0.7N.
  • Packing Quantity Example: 0402 size, 0.500.05mm thickness: 10000 pcs (7" Paper Tape Reel), 50000 pcs (13" Paper Tape Reel). Quantities vary by size, thickness, and reel type.
  • Outer packing includes labels with Part No., Quantity, and Date.
Storage Methods
  • Guaranteed solderability period: 12 months (under delivered package condition).
  • Storage Conditions: Temperature: 5~40, Relative Humidity: 20~70%.
Precautions Before Use
  • MLCCs may fail in short or open circuits. Severe operating conditions or external mechanical stress can lead to burn out, flaming, or explosion. Follow specifications and contact technical support for clarification.
  • Soldering Conditions: Adhere to recommended temperature profiles to avoid chip cracking or local explosion due to sudden temperature changes.
  • Manual Soldering: Handle with care to avoid thermal shock. Ensure proper soldering iron tip selection and temperature control. Avoid direct contact of the soldering iron tip with the ceramic body.
  • Recommended Soldering Methods: Reflow Soldering (R), Wave Soldering (W).
  • Recommended Soldering Temperature Profile: Specific profiles for Reflow and Wave soldering are provided, emphasizing temperature difference control (T150) during preheating.

2511191605_FH-0603B682K500NT_C1631.pdf

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