Product Overview
The High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for demanding high-voltage applications. Built on advanced MLCC technology, these capacitors offer excellent high-voltage reliability and are suitable for surface mounting. They are ideal for various DC high-voltage circuits, contributing to improved electronic circuit performance. Key features include a monolithic structure for high reliability, superior soldering and heat resistance suitable for reflow and wave soldering, and stable, high capacitance values. These products comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Product Attributes
- Manufacturer: FENGHUA
- Product Type: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Application Scope | Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient/Characteristics | C0G: 0 30ppm/ (-55 to 125) X7R: 15% (-55 to 125) |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | 1. Ceramic dielectric, 2. Inner electrode, 3. Substrate electrode, 4. Nickel Layer, 5. Tin Layer |
| Product Dimensions (Example: 0402) | L: 1.000.05mm, W: 0.500.05mm, T: 0.500.05mm, WB: 0.250.05mm |
| Capacitance Range and Voltage | Extensive range available for both C0G and X7R dielectrics across various sizes and voltages (Refer to detailed tables in datasheet for specific combinations). |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 200% of rated voltage for 5 sec for Vr < 500V, with max current limit of 50mA). |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the datasheet. |
| Packaging Options | Paper Taping (7" & 13" reels), Embossed Taping (7" & 13" reels). Specific quantities per reel/case depend on size and thickness. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Recommendations | Recommended for Reflow Soldering (R) and Wave Soldering (W). Specific temperature profiles and conditions provided for different sizes and dielectrics. Manual soldering requires careful operation to avoid thermal shock. |
2511191605_FH-0805B471K500NT_C1743.pdf
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