Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Built upon advanced MLCC technology and equipment, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic laminated structure for high reliability, superior soldering capabilities for reflow and wave soldering, and high, stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Compliance Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors (HIGH VOLTAGE MLCC) |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Ordering Code Structure | Size Code + Nominal Capacitance + Dielectric Code + Capacitance Tolerance + Rated Voltage + Termination Material + Package Style |
| Dielectric Codes | B (X7R), C (C0G) |
| Capacitance Tolerance Codes | A (0.05pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%) |
| Termination Material Styles | N (Nickel Barrier Termination), A (MLCC with Flexible Solderable Termination) |
| Package Styles | T (Braided 7 inch disc packing), D (Braided 13 inch disc packing) |
| Product Structure Components | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel Layer, 5. Tin Layer |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Measurement Method of Dielectric Withstanding Voltage | Varies based on Rated Voltage (Vr), typically 120% to 250% of Vr for 5 seconds with max current of 10-50mA. |
| Reliability Test Highlights | Includes Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Humidity Load, Life Test. Specific parameters and conditions detailed in the document. |
| Packaging Types | Paper Taping (Reel), Embossed Taping (Reel) |
| Reel Dimensions | 7' REEL (1782.0mm), 13' REEL (3302.0mm) |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W) |
2511191605_FH-1206B103K500NT_C1846.pdf
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