Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and offer excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, effectively enhancing electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, superior soldering and heat resistance suitable for reflow and wave soldering, and provide high and stable capacitance. These capacitors adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Certifications: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General | Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage Series Of Ceramic Chip Capacitors | |
| Dimensions | Size Code | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| EIA Dimensions (L x W) mm | 0402: 1.000.50, 0603: 1.600.80, 0805: 2.001.25, 1206: 3.201.60, 1210: 3.202.50, 1808: 4.602.00, 1812: 4.603.20, 1825: 4.606.30, 2211: 5.702.80, 2220: 5.705.00, 2225: 5.706.30 | |
| Thickness (T) | Varies by size and capacitance/voltage. Refer to detailed tables. | |
| Electrical Characteristics | Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Range & Voltage | Extensive range available for C0G and X7R dielectrics across various sizes and voltages (100V to 5000V). Refer to detailed tables. | |
| Ordering Code Components | Size Code, Nominal Capacitance, Dielectric Code, Capacitance Tolerance, Rated Voltage, Termination Material, Package Style | Detailed representation provided in the 'Ordering Code' section. |
| Termination Material | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) | |
| Package Style | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) | |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (Vr). Examples: Vr=100V: 250% Vr for 5s (max 50mA) 500VVr1000V: 150% Vr for 5s (max 50mA) 2000VVr5000V: 120% Vr for 5s (max 10mA) | |
| Reliability Tests | Capacitance, Dissipation Factor (DF), Insulation Resistance (IR) | Standards and test methods defined for Class I and Class II capacitors. Aging process required for Class II before measurement. |
| Solderability | Tin coverage > 95%. Visual inspection for damage. | |
| Resistance to Soldering Heat | Capacitance change, DF, IR, and visual appearance criteria defined. Specific preheating, soldering, and recovery conditions. | |
| Temperature Cycle | Capacitance change criteria defined for C0G and X7R. Specific temperature cycling steps and durations. | |
| Humidity Load / Life Test | Capacitance change, DF, and IR criteria defined. Specific temperature, humidity, voltage, and duration conditions. Special post-test treatment for Class II components. | |
| Packaging | Paper Taping / Embossed Taping | Dimensions and specifications for carrier tape, cover tape, chip holes, and reel sizes (7" and 13"). |
| Leader/End Part Structure | Specifications for vacant positions and leader tape. | |
| Packing Quantity | Varies by size, thickness, and reel type. Refer to detailed table. Customization available. | |
| Storage Conditions | Solderability guaranteed for 12 months. Storage Temperature: 5~40, Relative Humidity: 20~70%. | |
| Precautions for Use | Avoid short/open circuits, severe electrical/mechanical stress. Follow soldering profiles. Manual soldering requires careful handling. | Refer to detailed soldering profiles and guidelines. |
2511191605_FH-0603B103K101NT_C43253.pdf
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