Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for high-voltage DC circuits, offering enhanced reliability and performance for surface-mount applications. Built on advanced MLCC technology, these capacitors feature a monolithic laminated structure for robust performance. They exhibit excellent soldering capabilities, suitable for both reflow and wave soldering processes, and provide high and stable capacitance. These capacitors adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Product Attributes
- Brand: FENGHUA (implied from context)
- Product Type: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Application Scenarios
- Analog & Digital Modems
- LAN/WAN Interface
- Lighting Ballast Circuits
- Voltage Multipliers
- DC-DC Converters
- Back-lighting Inverters
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage MLCC |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Dielectric Types | C0G (Class I), X7R (Class II) |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Range & Voltage | Extensive range available for various voltage ratings (detailed in specification tables) |
| Termination Material | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Packaging Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Dimensions (Example: 0402) | L: 1.000.05mm, W: 0.500.05mm, T: 0.500.05mm, WB: 0.250.05mm |
| Dielectric Withstanding Voltage Test Method | Varies by rated voltage (e.g., 250% of rated voltage for 5s for Vr=100V, max 50mA) |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Guaranteed Solderability Period | 12 months (under delivered package condition) |
| Recommended Soldering Methods | Reflow Soldering (R), Wave Soldering (W), Manual Soldering (with precautions) |
2511191605_FH-0805B102K500NT_C46553.pdf
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