Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mounting and suitable for various DC high-voltage circuits. Built on advanced MLCC technology, these components offer enhanced high-voltage reliability through special design and manufacturing. They feature a monolithic structure for high reliability, excellent soldering and resistance capabilities for reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA ()
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Compliance Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Type | High-Voltage Multi-layer Ceramic Capacitors (MLCC) |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Dimensions (mm) | See 'Product Dimensions' table for detailed L, W, T, WB values for each size code. |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Range & Voltage | Extensive range available for C0G and X7R dielectrics across various sizes and voltage ratings (100V to 5000V). Refer to detailed tables for specific combinations. |
| Ordering Code Structure | Size Code - Nominal Capacitance - Dielectric Code - Capacitance Tolerance - Rated Voltage - Termination Material - Package Style |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Dielectric Withstanding Voltage Test Method | Varies by rated voltage (Vr): 250% Vr for 5s (Vr=100V), 200% Vr for 5s (100V |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the document. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Recommendations | Recommended for Reflow Soldering (R) and Wave Soldering (W). Manual soldering requires careful handling. Temperature profiles and recommended solder amounts are provided. |
2511191605_FH-1206B105K101NT_C91151.pdf
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