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Specifications
Voltage Rating:
50V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0402B104K500NT
Model Number:
0402B104K500NT
Package:
0402
Key Attributes
Product Description
Product Overview
General Series Multi-layer Ceramic Capacitors (MLCCs) designed with a monolithic structure of laminated layers for high reliability. These capacitors offer excellent soldering ability and resistance, making them suitable for reflow and wave soldering processes. They provide high and stable capacitance. Class I capacitors (C0G, C0H) offer the most stable electrical performance, ideal for low-loss, high-stability high-frequency circuits. Class II capacitors (X7R, X5R, X7S, X7T, X6S, X6T) feature a higher dielectric constant and capacitance compared to Class I, with stable temperature characteristics suitable for DC-blocking, coupling, bypassing, and frequency discriminating circuits.
Product Attributes
- Brand: Fenghua (implied from context)
- Type: General Series Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Material Types: C0G, X7R, X7S, X7T, X6S, X6T, X5R
- Termination Styles: Nickel Barrier Termination, Flexible Solderable Termination
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Structure | Ceramic dielectric | |
| Inner electrode | ||
| Substrate electrode | ||
| Nickel Layer | ||
| Tin Layer | ||
| Product Dimensions | Size Code | EIA LW (mm) |
| 1005 | 0.400.20 | |
| 0201 | 0.600.30 | |
| 0402 | 1.000.50 | |
| 0603 | 1.600.80 | |
| 0805 | 2.001.25 | |
| 1206 | 3.201.60 | |
| 1210 | 3.202.50 | |
| 1808 | 4.502.00 | |
| 1812 | 4.503.20 | |
| Temperature Coefficient / Characteristics | Dielectric | Reference Temperature Point |
| C0G | 25 | |
| X7R | 25 | |
| X7S | 25 | |
| X7T | 25 | |
| X6S | 25 | |
| X6T | 25 | |
| X5R | 25 | |
| Capacitance Range and Voltage | Class I (C0G) | Available in various dimensions and voltages (e.g., 0.1pF to 100nF across 10V to 50V for 1005 size) |
| Class II (X7R, X5R, etc.) | Available in various dimensions and voltages (e.g., 120pF to 100F across 6.3V to 50V for 1005 size) | |
| Note | Specific thickness 'T' should be checked in the 'capacity range and Voltage' section. Custom designs are available. | |
| Reliability Test Methods | Aging for Class II Dielectrics | Heat treatment at 150 for 1 hour, measure after 24 hours. |
| General Tests | Capacitance, Insulation Resistance (IR), Dissipation Factor (DF), Dielectric Withstanding Voltage (DWV), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Termination Adhesion, Temperature Cycle, Humidity Load, Life Test. | |
| Packaging | Embossed Plastic Taping | Available for various sizes (e.g., 1005, 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 2220, 2225) |
| Paper Taping | Available for 1005, 0201, 0402, 0603, 0805, 1206 sizes. | |
| Reel Dimensions | 7' REEL (1782.0 mm), 13' REEL (3302.0 mm) | |
| Packing Quantity | Varies by size, thickness, and reel type (e.g., 7" paper taping for 0201: 70000 pcs). Quantities can be customized. | |
| Storage Methods | Relative humidity: 20~70%, Storage temperature: 5~40 (recommended below 30). Avoid corrosive gases, direct sunlight, and high humidity. Use promptly after delivery. Check solderability if stored for over a year. | |
| Precautions Before Use | Do not reuse removed capacitors. Confirm electrical characteristics, applied voltage, mechanical stress, and solderability of long-stored capacitors. Perform heat treatment before measuring capacitance for long-stored units. | |
| Application Restrictions | Intended for general consumer electronics. Not recommended for high-reliability applications (aerospace, medical, military, etc.) without prior written consent. | |
| Soldering Conditions | Reflow Soldering | Temperature difference between soldering temperature and chip surface temperature should be T150 during preheating. Recommended pad sizes provided. |
| Wave Soldering | Temperature difference between soldering temperature and chip surface temperature should be T150 during preheating. | |
| Manual Soldering | Avoid direct contact between soldering iron tip and ceramic body. Maximum tip temperature 350, power 20W, time max 3s. |
2512241501_FH-0402B104K500NT_C110251.pdf
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