Product Overview
Fenghua Advanced Technology (Holding) CO., LTD. offers a comprehensive range of multi-layer ceramic capacitors (MLCCs) designed for diverse electronic applications. These capacitors are categorized by dielectric material type, including high-frequency (Class I) and X7R, X5R, X7S, X6S, Y5V, and Z5U (Class II) types, each offering distinct performance characteristics for various circuit requirements such as decoupling, coupling, bypassing, and frequency discrimination. The product line includes standard, high-Q, and high-voltage MLCCs, available in a wide array of standard sizes and configurations. These components are manufactured with advanced technology to ensure high reliability and performance in demanding applications. Custom design options are also available to meet specific customer requirements.
Product Attributes
- Brand: Fenghua ()
- Manufacturer: Guangdong Fenghua Advanced Technology (Holding) CO., LTD.
- Product Type: Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Material Types: COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL (Class I); X7R, X5R, X7S, X6S, Y5V, Z5U (Class II)
- Termination Styles: Silver Solderable, Copper Solderable, Nickel Barrier
- Packaging Styles: Bulk Bag, Taping Package
Technical Specifications
Dimensions (mm)
| Type | Dimensions (L x W x T) (mm) | WB (mm) |
|---|---|---|
| 0201 | 0.60 x 0.30 x 0.30 | 0.15 0.10 |
| 0402 | 1.00 x 0.50 x 0.50 | 0.25 0.10 |
| 0603 | 1.60 x 0.80 x 0.80 | 0.30 0.10 |
| 0805 | 2.00 x 1.25 x 0.55 | 0.50 0.20 |
| 1206 | 3.20 x 1.60 x 0.80 | 0.60 0.30 |
| 1210 | 3.20 x 2.50 x 2.80 | 0.60 0.30 |
| 1808 | 4.50 x 2.00 x 2.20 | 0.60 0.30 |
| 1812 | 4.50 x 3.20 x 3.50 | 0.60 0.30 |
| 2220 | 5.70 x 5.00 x 3.50 | 0.60 0.30 |
| 2225 | 5.70 x 6.30 x 6.20 | 0.60 0.30 |
| 3012 | 7.60 x 3.20 x 8.10 | 0.60 0.30 |
| 3035 | 7.60 x 9.00 x 8.10 | 0.60 0.30 |
How to Order (Example: 0805 CG 101 J 500 N T)
| Part | Description | Details |
|---|---|---|
| Dimensions | Size Code (e.g., 0805) | |
| Dielectric Style | Dielectric Code (e.g., CG for COG) | |
| Nominal Capacitance | Value (e.g., 101 for 10 x 10^1 pF = 100 pF) | |
| Capacitance Tolerance | Code (e.g., J for 5.0%) | |
| Rated Voltage | Value (e.g., 500 for 500V) | |
| Terminal Material | Code (e.g., N for Nickel Barrier) | |
| Package Style | Code (e.g., T for Taping Package) |
Temperature Coefficient / Characteristics
| Dielectric | Reference Temperature Point | Nominal Temperature Coefficient | Operation Temperature Range |
|---|---|---|---|
| COG | 20C | 0 30 ppm/ | -55125 |
| X7R | 20C | 15% | -55125 |
| Y5V | 20C | -80%+30% | -2585 |
| Z5U | 20C | -56%+22% | 1085 |
Capacitance Range and Operating Voltage (Example: 0805 Size)
| Size Code | Rated Voltage | COG (PF) | Y5V (Z5U) (PF) | X7R (PF) | X5R (uF) |
|---|---|---|---|---|---|
| 0805 | 4V | -- | 1,00022,000,000 | -- | -- |
| 6.3V | -- | 1,00022,000,000 | -- | -- | |
| 10V | -- | 1,00022,000,000 | -- | -- | |
| 16V | -- | 1,000 | -- | -- | |
| 25V | -- | 1,000 | -- | -- | |
| 0805 | 50V | 0.322,000 | 1,0004,700,000 | 150470,000 | 0.1~47 uF |
High-Q COG MLCC Specifications
| Capacitance (pF) | Q value at 300MHz (0805) | Q value at 300MHz (0603) |
|---|---|---|
| 4.7 | 1000 | 800 |
| 10 | 500 | 400 |
| 27 | 175 | 140 |
| 82 | 80 | 80 |
High Voltage MLCC Capacitance Range and Operating Voltage (Example: 0805 Size)
| Size Code | Rated Voltage | NPO (pF) | X7R (pF) | Y5V (pF) |
|---|---|---|---|---|
| 0805 | 100V | 0.53,300 | 1501,000,000 | 15,000470,000 |
| 200V | 0.12,700 | 150220,000 | 10,000220,000 | |
| 250V | 0.12,700 | 150220,000 | 10,000220,000 | |
| 500V | 0.11,500 | 15033,000 | -- | |
| 630V | 0.11,500 | 15033,000 | -- |
Reliability Test Summary
| Item | Specification | Test Method |
|---|---|---|
| Capacitance | Within specified tolerance | Frequency and voltage as per spec |
| Dissipation Factor (DF) | As per spec | Frequency and voltage as per spec |
| Insulation Resistance (IR) | As per spec | Test voltage: Rated Voltage (Max 500V), Duration: 605s |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage | Voltage: 250%-300% of rated voltage, Duration: 1-5s |
| Solderability | 95% solder coverage | Lead-free: 2455 for 20.5s |
| Resistance to Soldering Heat | Appearance: No damage; Solderability: 95% | Solder Temp: 2655 for 101s; Recovery: 24h |
| Resistance to Flexure of Substrate | C/C 10% | Warp: 1mm; Speed: 0.5mm/sec |
| Termination Adhesion | No visible damage | Applied Force: 5N; Duration: 101S |
| Temperature Cycle | C/C: Class I 1% or 1pF; Class II 10% to 20% | 5 cycles; Temp range: -55 to +125 (Class I/II) |
| Moisture Resistance | C/C: Class I 2% or 1pF; Class II 20% to 30% | 402, 90-95% RH for 500h; Recovery: 24-48h |
| Life Test (Low Voltage 100V) | C/C: Class I 2% or 1pF; Class II 20% to 30% | 1.5x Rated Voltage, 1000h, 85-125 |
Packaging Specifications
| Package Style | Dimensions (mm) | Typical Quantity (pcs) |
|---|---|---|
| Paper Taping (PT) | Reel Diameter: 7" (1782.0) or 13" (3302.0) | 0201: 15000; 0402: 10000; 0603: 4000; 0805: 4000; 1206: 4000 |
| Embossed Taping (ET) | Reel Diameter: 7" (1782.0) or 13" (3302.0) | 0805: 3000; 1206: 3000 (T1.35mm), 2000 (T>1.35mm) |
| Bulk Case (BC) | Approx. 31.50 x 36.00 x 19.00 | 0201: 20000; 0402: 20000; 0603: 15000; 0805: 10000 |
Storage Conditions
- Storage Temperature: 5~40
- Relative Humidity: 20~70%
- Guaranteed Solderability Period: 6 months (in delivered package)
Recommended Soldering Methods
- Reflow Soldering (R): Recommended for most sizes and dielectrics.
- Wave Soldering (W): Recommended for specific larger sizes and higher capacitance values.
Recommended Soldering Temperature Profiles
- Reflow Soldering (Pb-Sn): Peak Temp: 230-250; Preheating Temp Difference T 150.
- Reflow Soldering (Lead-free): Peak Temp: 240-260; Preheating Temp Difference T 150.
- Wave Soldering (Pb-Sn): Peak Temp: 230-260; Preheating Temp Difference T 150.
- Wave Soldering (Lead-free): Peak Temp: 240-270; Preheating Temp Difference T 150.
Precautions for Use
- Avoid sudden temperature changes to prevent chip cracking or explosion.
- Use appropriate soldering iron tip size and temperature for manual soldering.
- Ensure optimal solder amount for reflow and wave soldering to avoid stress or poor connection.
2304140030_FH-0805B105K500NT_C215803.pdf
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