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Specifications
Voltage Rating:
16V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0402B224K160NT
Model Number:
0402B224K160NT
Package:
0402
Key Attributes
Product Description
Fenghua Advanced Technology (Holding) CO., LTD. - Ceramic Capacitors
Product Overview
Fenghua Advanced Technology offers a comprehensive range of ceramic capacitors designed for diverse electronic applications. These capacitors are categorized by dielectric material (Class I and Class II) and offer various characteristics including high frequency, temperature compensation, and high dielectric constant. They are suitable for applications ranging from general-purpose circuits to high-frequency, low-loss, and temperature-compensated circuits, as well as DC-blocking, decoupling, bypassing, and frequency discriminating functions. The product line includes High-Q COG capacitors for RF and microwave circuits, and Middle & High Voltage MLCCs for high-voltage DC applications.
Product Attributes
- Brand: Fenghua
- Manufacturer: Guangdong Fenghua Advanced Technology (Holding) CO., LTD.
- Product Type: Ceramic Capacitors (MLCC)
- Dielectric Types: Class I (COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL), Class II (X7R, X5R, X7S, X6S, Y5V, Z5U)
- Termination Styles: Silver Solderable, Copper Solderable, Nickel Barrier
- Packaging Styles: Bulk Bag, Taping Package
Technical Specifications
Capacitor Dielectric Types and Characteristics
| Dielectric Type | Class | Characteristics | Typical Applications |
|---|---|---|---|
| COG, COH | Class I | Most stable electrical properties, virtually unaffected by temperature, voltage, and time. Low loss. | Low-loss, high-stability high-frequency circuits. |
| HG, LG, PH, RH, SH, TH, UJ, SL | Class I | Capacitance varies with temperature. Low loss, temperature compensating circuits. | Low-loss, temperature compensating circuits. |
| X7R, X5R, X7S, X6S | Class II | High dielectric constant, higher capacitance than Class I. Semi-stable temperature characteristics. | Wide capacitance range circuits, DC-blocking, decoupling, bypassing, frequency discriminating. |
| Y5V | Class II | Highest dielectric constant. Unstable temperature coefficient, sensitive to temperature and voltage. Moderate losses and capacitance changes. | High capacitance requirements where moderate losses and capacitance changes are tolerated. |
| Z5U | Class II | Temperature characteristic between X7R and Y5V. Unstable capacitance, sensitive to temperature and voltage. | High capacitance, bypassing, decoupling circuits with low DC bias near room temperature. |
Dimensions (mm)
| Type Code | Dimensions (L x W x T) | WB (min) |
|---|---|---|
| 0201 (0603) | 0.6 x 0.3 x 0.3 | 0.15 |
| 0402 (1005) | 1.0 x 0.5 x 0.5 | 0.25 |
| 0603 (1608) | 1.6 x 0.8 x 0.8 | 0.30 |
| 0805 (2012) | 2.0 x 1.25 x 0.55 | 0.50 |
| 1206 (3216) | 3.2 x 1.6 x 0.8 | 0.60 |
| 1210 (3225) | 3.2 x 2.5 x 2.80 | 0.60 |
| 1808 (4520) | 4.5 x 2.0 x 2.20 | 0.60 |
| 1812 (4532) | 4.5 x 3.2 x 3.50 | 0.60 |
| 2220 (5750) | 5.7 x 5.0 x 3.50 | 0.60 |
| 2225 (5763) | 5.7 x 6.3 x 6.20 | 0.60 |
| 3012 (7632) | 7.6 x 3.2 x 8.10 | 0.60 |
| 3035 (7690) | 7.6 x 9.0 x 8.10 | 0.60 |
How to Order (Part Number Structure Example: 0805 CG 101 J 500 N T)
| Position | Description | Example Code |
|---|---|---|
| 1 | Dimensions (Size Code) | 0805 |
| 2 | Dielectric Style | CG (COG) |
| 3 | Nominal Capacitance (pF) | 101 (10 x 10^1 pF = 100 pF) |
| 4 | Capacitance Tolerance | J (5.0%) |
| 5 | Rated Voltage (V) | 500 (500V) |
| 6 | Termination Material Styles | N (Nickel Barrier) |
| 7 | Package Style | T (Taping Package) |
Temperature Coefficient / Characteristics
| Dielectric Type | Reference Temp. Point | Nominal Temp. Coefficient | Operating Temp. Range |
|---|---|---|---|
| COG | 20C | 030 ppm/ | -55125 |
| COH | 20C | 060 ppm/ | -55125 |
| HG | 20C | -3330 ppm/ | -2585 |
| LG | 20C | -7530 ppm/ | -2585 |
| PH | 20C | -15060 ppm/ | -2585 |
| RH | 20C | -22060 ppm/ | -2585 |
| SH | 20C | -33060 ppm/ | -2585 |
| TH | 20C | -47060 ppm/ | -2585 |
| UJ | 20C | -750120 ppm/ | -2585 |
| SL | 20C | -1000+140 ppm/ | -2585 |
| X7R | 20C | 15% | -55125 |
| X5R | 20C | 15% | -5585 |
| X7S | 20C | 22% | -55125 |
| X6S | 20C | 22% | -55105 |
| Z5U | 20C | -56%+22% | 1085 |
| Y5V | 20C | -80%+30% | -2585 |
Capacitance Range and Operating Voltage (Example: COG)
| Size Code | Rated Voltage (V) | Capacitance Range (pF) |
|---|---|---|
| 0201 | 4 | -- |
| 6.3 | 10,000100,000 | |
| 10 | -- | |
| 16 | 10,000 | |
| 25 | -- | |
| 0402 | 4 | -- |
| 6.3 | 1,0001,000,000 | |
| 10 | 1,0001,000,000 | |
| 16 | 1,000220,000 | |
| 25 | 1,000220,000 | |
| 0603 | 4 | -- |
| 6.3 | 1,00010,000,000 | |
| 10 | 1,00010,000,000 | |
| 16 | 1,00022,000,000 | |
| 25 | 1,00022,000,000 | |
| 0805 | 4 | -- |
| 6.3 | 1,00047,000,000 | |
| 10 | 1,00047,000,000 | |
| 16 | 1,00047,000,000 | |
| 25 | 1,00010,000,000 |
High-Q COG MLCC Specifications
| Capacitance (pF) | Q Value at 300MHz (0603) | Q Value at 300MHz (0805) |
|---|---|---|
| 4.7 | 800 | 1000 |
| 5.2 | 720 | 900 |
| 5.6 | 680 | 850 |
| 6.2 | 640 | 800 |
| 6.8 | 560 | 700 |
| 7.5 | 520 | 650 |
| 8.2 | 460 | 575 |
| 9.1 | 420 | 525 |
| 10 | 400 | 500 |
| 11 | 360 | 450 |
| 12 | 320 | 400 |
| 13 | 300 | 375 |
| 14 | 280 | 350 |
| 15 | 260 | 325 |
| 16 | 240 | 300 |
| 18 | 200 | 250 |
| 20 | 180 | 225 |
| 22 | 172 | 215 |
| 24 | 160 | 200 |
| 27 | 140 | 175 |
| 30 | 120 | 150 |
| 33 | 112 | 140 |
| 36 | 104 | 130 |
| 39 | 96 | 120 |
| 43 | 88 | 110 |
| 47 | 80 | 100 |
| 56 | 80 | 80 |
| 62 | 80 | 80 |
| 68 | 80 | 80 |
| 82 | 80 | 80 |
Middle & High Voltage MLCC Capacitance Range and Voltage
| Size Code | Rated Voltage (V) | NPO Capacitance Range (pF) | X7R Capacitance Range (pF) | Y5V Capacitance Range (pF) |
|---|---|---|---|---|
| 0603 | 100 | 0.51,000 | 150100,000 | 2,200100,000 |
| 200 | 0.5470 | 15010,000 | -- | |
| 250 | 0.5470 | 15010,000 | -- | |
| 500 | 0.1470 | 15010,000 | -- | |
| 630 | 0.1470 | 15010,000 | -- | |
| 0805 | 100 | 0.53,300 | 1501,000,000 | 15,000470,000 |
| 200 | 0.11,500 | 150220,000 | 10,00047,000 | |
| 250 | 0.11,500 | 150220,000 | 10,00047,000 | |
| 500 | 0.11,500 | 15033,000 | -- | |
| 630 | 0.11,500 | 15033,000 | -- | |
| 1000 | 0.11,000 | 15010,000 | -- | |
| 2000 | 0.1270 | 1502,700 | -- | |
| 1206 | 100 | 1.06,800 | 1502,200,000 | 15,0001,000,000 |
| 200 | 1.03,300 | 150220,000 | 15,000470,000 | |
| 250 | 1.03,300 | 150220,000 | 15,000470,000 | |
| 500 | 1.02,200 | 15068,000 | -- | |
| 630 | 1.02,200 | 15068,000 | -- | |
| 1000 | 1.01,000 | 15022,000 | -- | |
| 2000 | 1.0470 | 15010,000 | -- | |
| 3000 | -- | 150680 | -- |
Reliability Test Standards
| Item | Technical Specification | Test Method |
|---|---|---|
| Capacitance | Within specified tolerance | Class I: 1MHz10% (1000pF), 1kHz10% (>1000pF) at 1.00.2Vrms. Class II: 1kHz10% (C10F) at 1.00.2Vrms; 12024Hz (C>10F, X7R/X5R/X7S/X6S/Y5V) at 0.50.1Vrms; 10.1kHz (Z5U) at 0.50.05Vrms. Test Temp: 253. |
| Dissipation Factor (DF, tan) | See table | Class I: 1MHz10% (1000pF), 1kHz10% (>1000pF) at 1.00.2Vrms. Class II: 1kHz10% (C10F) at 1.00.2Vrms; 12024Hz (C>10F, X7R/X5R/X7S/X6S/Y5V) at 0.50.1Vrms; 10.1kHz (Z5U) at 0.50.05Vrms. |
| Insulation Resistance (IR) | Class I: Ri50000M (C10nF), RiCR500S (C>10nF). Class II: X7R/X5R/X7S/X6S: Ri10000M (C25nF), RiCR>100S (C>25nF). Y5V/Z5U: Ri4000M (C25nF), RiCR>100S (C>25nF). | Test Voltage: Rated Voltage (Max 500V). Duration: 605s. Test Humidity: 75%. Test Temp: 255. |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Class I: 300% Rated Voltage. Class II: 250% Rated Voltage. Duration: 15s. Charge/Discharge Current: 50mA. |
| Solderability | 95% solder coverage. No visible damage. | Preheating: 80~120, 10~30s. Lead-free: 2455, 20.5s. Leaded: 2355, 20.5s. |
| Resistance to Soldering Heat | Appearance: No visible damage. Solderability: 95%. | Preheating: 100~200, 102min. Solder Temp: 2655, 101s. Recovery: 242h at room temp. |
| Resistance to Flexure of Substrate | C/C 10% | Test Board: Al2O3 or PCB. Warp: 1mm. Speed: 0.5mm/sec. Measured in bent state. |
| Termination Adhesion | No visible damage. | Applied Force: 5N. Duration: 101S. |
| Temperature Cycle | C/C: Class I: 1% or 1pF. Class II: B,X,BS,DS: 10%; E,F: 20%. DF: 2x initial value. IR: Class I: Ri2500M or RiCR25S. Class II: Ri1000M or RiCR25S. | 5 cycles. Temp range: -55 to +125 (Class I/II). Recovery: 242h. |
| Moisture Resistance | C/C: Class I: 2% or 1pF. Class II: B,X,BS,DS: 20%; E,F: 30%. DF: 2x initial value. IR: Class I: Ri4000M or RiCR40S. Class II: Ri2000M or RiCR50S. | 402, 90~95%RH, 500h. Recovery: 24h (Class 1) / 48h (Class 2). |
| Life Test (Low Voltage 100V) | C/C: Class I: 2% or 1pF. Class II: B,X,BS,DS: 20%; E,F: 30%. DF: 2x initial value. IR: Class I: Ri4000M or RiCR40S. Class II: Ri2000M or RiCR50S. | 1.5x Rated Voltage, 1000h. Temp: 125 (NPO/X7R/X7S), 85 (X5R/Y5V), 105 (X6S). Recovery: 24h (Class 1) / 48h (Class 2). |
Packaging Information
| Package Style | Dimensions (mm) | Quantity (pcs) |
|---|---|---|
| Paper Taping (PT) | See detailed drawings for 0201, 0402, 0603, 0805, 1206 | 0201: 15000, 0402: 10000, 0603: 4000, 0805: 4000, 1206 (T1.35mm): 4000, 1206 (T>1.35mm): 2000 |
| Embossed Taping (ET) | See detailed drawings for 0805~1812 | 0805: 3000, 1206 (T1.35mm): 3000, 1206 (T>1.35mm): 2000, 1210 (T1.80mm): 2000, 1210 (T>1.80mm): 1000, 1808: 2000, 1812 (T1.85mm): 1000, 1812 (T>1.85mm): 500 |
| Bulk Case (BC) | See detailed drawings | 0201: 20000, 0402: 20000, 0603: 15000, 0805: 10000, 1206: 5000, 1210: 2000, 1808: 2000, 1812: 1000 |
| General Bulk (BP) | N/A | 0201: 5000, 0402: 5000, 0603: 5000, 0805: 5000, 1206: 5000, 1812: 2000, 1825/2220/2025/2225/3035: 500 |
Storage Conditions
- Storage Temperature: 5~40
- Relative Humidity: 20~70%
- Guaranteed Solderability Period: 6 months (in delivered package condition)
Precautions for Use
MLCCs may fail in short or open circuits. Severe electrical or mechanical stress beyond specified ratings can lead to burnout, flaming, or explosion. Always follow safety precautions and application notes. Manual soldering requires careful handling to avoid thermal shock and damage. Use optimal solder amounts for reflow, wave, and rework soldering to ensure proper connection and prevent stress-induced cracks.
Recommended Soldering Methods
| Size | Temperature Characteristics | Rated Voltage | Capacitance Range | Soldering Method |
|---|---|---|---|---|
| 0201 | NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R | All | All | R |
| 0402 | NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R | All | All | R |
| 0603 | NPO/R, X7R/X5R/X7S/X6S/R (C1uf), Y5V/R (C1uf) | All | All | R/W |
| 0805 | NPO/R, X7R/X5R/X7S/X6S/R (C4.7uf), Y5V/R (C1uf) | All | All | R/W |
| 1206 | NPO/R, X7R/X5R/X7S/X6S/R (C10uf), Y5V/R (C10uf) | All | All | R/W |
| 1210 | NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R | All | All | R |
Soldering Method Key: RReflow Soldering, WWave Soldering
Recommended Soldering Temperature Profiles
Reflow Soldering:
- Pb-Sn: Peak Temp 230250.
- Lead-free: Peak Temp 240260.
- Preheating Temp difference (Soldering Temp - Chip Surface Temp) 150.
Wave Soldering:
- Pb-Sn: Peak Temp 230260.
- Lead-free: Peak Temp 240270.
- Preheating Temp difference (Soldering Temp - Chip Surface Temp) 150.
Hand Soldering:
- Preheating: Temp difference 130.
- Soldering Iron Head Temp: Max 300.
- Power: Max 20W.
- Diameter: Recommended 1mm.
- Soldering Time: Max 3s.
- Solder Paste Amount: 1/2 chip thickness.
- Avoid direct contact between soldering iron head and ceramic components.
1811141751_FH-0402B224K160NT_C192432.pdf
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