Product Overview
The High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface-mount applications, offering excellent high-voltage reliability. Built on advanced MLCC technology, these capacitors are suitable for various DC high-voltage circuits, enhancing electronic performance. They feature a monolithic structure for high reliability, superior soldering capabilities for reflow and wave soldering, and provide high and stable capacitance. These capacitors comply with GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Application Areas: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, and Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA
- Product Type: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage Series Of Ceramic Chip Capacitors |
| Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Capacitance Range | 0.5pF to 10F (Varies by dielectric, size, and voltage) |
| Rated Voltage Range | 6.3V to 5000V (Varies by dielectric, size, and capacitance) |
| Temperature Coefficient / Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Termination Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | 1. Ceramic dielectric, 2. Inner electrode, 3. Substrate electrode, 4. Nickel Layer, 5. Tin Layer |
| Dimensions (Example: 0805) | L: 2.000.20mm, W: 1.250.25mm, T: 0.800.20mm to 1.250.25mm, WB: 0.500.20mm |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 200% of rated voltage for 5 seconds for Vr < 500V, max 50mA current) |
| Reliability Tests | Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, Life Test |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Guaranteed Solderability Period | 12 months (in delivered package condition) |
2511191605_FH-0805B104M500NT_C286511.pdf
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