Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mount applications, offering reliable performance in various high-voltage DC circuits. Built on advanced MLCC technology with special design considerations, these capacitors provide excellent high-voltage reliability, monolithic laminated structure for enhanced durability, and superior soldering capabilities suitable for reflow and wave soldering processes. They deliver high and stable capacitance, making them ideal for applications requiring robust high-voltage handling and circuit performance improvement.
Product Attributes
- Brand: FENGHUA (Implied from context)
- Product Type: High-Voltage Multi-layer Ceramic Capacitors (MLCC)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Application Areas | Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters |
| Product Structure | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Range & Voltage | Detailed listings for C0G and X7R dielectrics across various sizes and voltage ratings (e.g., 100V to 5000V) are provided in the original document. |
| Termination Material | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Packaging Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Measurement Method of Dielectric Withstanding Voltage | Varies based on rated voltage (Vr), typically 120% to 250% of rated voltage for 5 seconds, with current limitations. |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and conditions are detailed in the original document. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability for 12 months. |
| Soldering Methods Recommended | Reflow Soldering (R), Wave Soldering (W), Manual Soldering. Specific temperature profiles and conditions are provided. |
2511191605_FH-0402X225K160NT_C501836.pdf
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