Product Overview
High-Voltage Multi-layer Ceramic Capacitors (MLCCs) are designed for surface mount applications, offering excellent high-voltage reliability for various DC high-voltage circuits. Built upon advanced MLCC technology, these capacitors feature a monolithic structure for high reliability, superior soldering performance suitable for reflow and wave soldering, and stable, high capacitance values. They adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, and Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA ()
- Product Type: High-Voltage Multi-layer Ceramic Capacitors
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Executive Standards: GB/T 21041-2007, GB/T 21042-2007
Technical Specifications
| Feature | Description |
|---|---|
| Series | High Voltage MLCC |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Capacitance Range | Refer to detailed tables for specific voltage and dielectric type. |
| Rated Voltage Range | 6.3V to 5000V (Varies by size, dielectric, and capacitance) |
| Temperature Coefficient / Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Tolerance | 0.05pF, 0.10pF, 0.25pF, 0.50pF, 1%, 2%, 5%, 10%, 20% (Tolerance A, B, C, D applicable for capacitance 10pF) |
| Termination Material Styles | Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A) |
| Package Styles | Braided 7 inch disc packing (T), Braided 13 inch disc packing (D) |
| Product Structure Components | Ceramic dielectric, Inner electrode, Substrate electrode, Nickel Layer, Tin Layer |
| Dimensions (mm) | See detailed table for L, W, T, WB values per size code. |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (e.g., 250% of Vr for 5s for Vr=100V, 120% of Vr for 5s for 2000V < Vr 5000V). |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Shelf Life (for Solderability) | 12 months (under delivered package condition) |
2511191605_FH-0402CG220J500NT_C1555.pdf
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