• 1. Ceramic dielectric
• 2. Inner electrode
• 3. Outer electrode
• 4. Nickel layer
• 5. Tin layer

Size Code: e.g., 0805

Dielectric Code: CG (C0G), X (X5R), B (X7R), BS (X7S), BT (X7T), DS (X6S), DT (X6T)

Nominal Capacitance: e.g., 102 (10 x 10^2 pF = 1000pF = 1nF). 'R' denotes decimal point (e.g., 0R5 = 0.5pF).

Capacitance Tolerance: A (0.05pF for 10pF), B (0.10pF), C (0.25pF), D (0.50pF), F (1%), G (2%), J (5%), K (10%), M (20%).

Rated Voltage: e.g., 500 (500V). 'R' denotes decimal point (e.g., 6R3 = 6.3V).

Terminal Material Styles: N (Nickel Barrier Termination), A (Flexible Solderable Termination)

Package Styles: T (Braided 7-inch reel packing), D (Braided 13-inch reel packing)

Aging for Class II Dielectrics: Heat treatment at 150C for 1 hour, then measure after 24 hours at 253 and <70% RH.

Capacitance Measurement: Class I: 1MHz10% for 1000pF, 1KHz10% for >1000pF, at 1.00.2Vrms. Class II: 1KHz10% at 1.00.2Vrms for C10F; 12024Hz at 0.50.1Vrms for C>10F, at 253.

Insulation Resistance (IR): Class I: Ri50000M for C10nF, RiCR500S for C>10nF. Class II: Ri10000M for C25nF, RiCR>100S for C>25nF. Tested at rated voltage (max 500V), 605s, 75% RH, 253.

Dissipation Factor (DF, tan): Class I: 1/(400+20C) for C<30pF, 0.1% for C30pF. Class II: Varies by voltage, capacitance, and size, with specific DF limits (e.g., 250 10 for 50V, 10nF).

Dielectric Withstanding Voltage (DWV): Class I: 300% rated voltage; Class II: 250% rated voltage, 1-5s duration.

Solderability: 95% tin coverage on terminal electrode. Visual appearance: no damage. Preheating: 80-120 for 10-30s. Lead-free: 2455 for 20.5s.

Resistance to Soldering Heat: C/C 2.5% or 0.25pF (whichever is larger) for Class I; 15% for Class II. DF and IR should be within initial standards. Appearance: no damage, 95% tin coverage. Preheating: 100-200 for 60-120s. Solder Temp: 2655 for 101s. Recovery: 242h.

Resistance to Flexure: C/C: Class I 5% or 0.5pF; Class II 10%. Appearance: no damage. Tested on PCB, 1mm warp, 1mm/sec speed.

Termination Adhesion: No visible damage. Force applied to capacitor side body.

Temperature Cycle: C/C: Class I 1% or 1pF; Class II: -15%~+15%. Appearance: no damage. 5 cycles of -55 to +125 (or lower for X5R, X6S/X6T) with 30min dwell at each extreme. Recovery: 242h.

Humidity Load: C/C: Class I 7.5% or 0.75pF; Class II 12.5%. DF 2x initial. IR: Class I Ri5000M or RiCR50S; Class II Ri1000M or RiCR10S. Tested at 402, 90-95% RH, rated voltage for 500h. Recovery: 242h. Class II requires 150 heat treatment for 1h post-test.

Life Test: C/C: Class I 3% or 0.3pF; Class II: -20%~+20%. DF 2x initial. IR: Class I Ri4000M or RiCR40S; Class II Ri2000M or RiCR50S. Tested at 2x rated voltage (for <100V), 1000h, at 125 (C0G, X7R, X7S), 85 (X5R), or 105 (X6S, X6T). Recovery: 242h. Class II requires 150 heat treatment for 1h post-test.

• Embossed Plastic Taping (for 1005, 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 2220, 2225 sizes)
• Paper Taping (for 1005, 0201, 0402, 0603, 0805, 1206 sizes)
• Reel Dimensions: 7-inch (1782.0mm), 13-inch (3302.0mm)
• Top tape peeling strength: 0.1N < peeling strength < 0.7N (Paper Taping)
• Packing Quantities vary by size, thickness, and tape type (e.g., 1005 size, 0.200.02mm thickness: 20000 pcs on 7-inch PT reel).
• Outer packing: 10 reels per case, 6 cases per carton.

• Relative humidity: 20-70%
• Storage temperature: 5-40 (recommended below 30)
• Use immediately after delivery. Avoid high temperature, high humidity, direct sunlight, and corrosive gases (HS, SO, Cl, NH).
• Check packaging, appearance, and solderability if stored for extended periods (over 6 months or 1 year).

• Do not reuse capacitors removed from equipment.
• Confirm electrical characteristics, applied voltage, and mechanical stress.
• Confirm solderability of long-term stored capacitors.
• Perform heat treatment on long-term stored capacitors before measurement.

Intended for general consumer electronic devices (household appliances, office equipment, information and communication devices, AV/OA equipment, mobile phones, PCs). Not recommended for high-reliability applications such as aerospace, medical, aviation, atomic energy, disaster/crime prevention, electric heating, combustion, public information networks, data processing, military, power generation control, safety, vehicle-mounted, traffic signal, transportation, or underwater equipment without prior written consent.

General: Follow recommended temperature profiles to avoid cracking. Temperature difference between soldering and chip surface should be 150 during preheating.

Manual Soldering: Use caution to avoid direct contact of soldering iron tip with ceramic body. Recommended tip diameter: 1mm, max power: 20W, max soldering time: 3s. Solder paste amount 1/2 chip thickness.

Recommended Soldering Method:

• Reflow Soldering (R): Suitable for most sizes and dielectrics.
• Wave Soldering (W): Recommended for specific sizes and capacitances (e.g., 0603 C1uF, 0805 C4.7uF, 1206 C10uF).

Recommended Reflow Pad Sizes (mm):

• A0001 (2024-1-15): Reorganized content per new version format.
• A0002 (2025-1-25): Reorganized content per new version format.
• A0003 (2025-8-29): Modified Dissipation Factor test content.
• A0004 (2025-10-31): Updated packaging paper tape illustration and aging condition.