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quality Chip ferrite bead BOURNS MH1005-121Y ideal for noise suppression in compact electronic circuit designs factory
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quality Chip ferrite bead BOURNS MH1005-121Y ideal for noise suppression in compact electronic circuit designs factory
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Specifications
DC Resistance(DCR):
50mΩ
Impedance @ Frequency:
120Ω@100MHz
Mfr. Part #:
MH1005-121Y
Model Number:
MH1005-121Y
Key Attributes
Product Description

Product Overview

The MH1005 Series High Current Chip Ferrite Beads are designed for applications requiring compact size and high current handling capabilities across a wide impedance range. These components are RoHS compliant and halogen-free, making them suitable for environmentally conscious designs. They are ideal for filtering and noise suppression in various electronic circuits.

Product Attributes

  • Brand: Bourns
  • Series: MH1005 Series
  • Compliance: RoHS compliant, Halogen Free
  • Core Material: Ferrite
  • Internal Conductor: Ag or Ag/Pd
  • Terminal: Ag/Ni/Sn
  • Packaging: 10,000 pcs./7-inch reel

Technical Specifications

Model Number Impedance () at 100 MHz RDC (m) Max. IDC (A) Max.
MH1005-300Y 30 25 % 22 3.0
MH1005-800Y 80 25 % 38 2.3
MH1005-121Y 120 25 % 50 2.0
MH1005-221Y 220 25 % 95 1.5
MH1005-301Y 300 25 % 150 1.2
MH1005-471Y 470 25 % 180 1.1
MH1005-601Y 600 25 % 200 1.0

General Specifications

Specification Value
Operating Temperature -55 C to +125 C
Storage Temperature (Component Mounted) -55 C to +125 C
Rated Current Based on max temperature rise of +40 C
Moisture Sensitivity Level 1
ESD Classification (HBM) N/A

Product Dimensions

Dimension Value (mm) Value (inches)
Length 2.0 0.5 (.079 .020)
Width 1.0 0.10 (.039 .004)
Height 0.50 0.10 (.020 .004)
Terminal Width 0.50 0.10 (.020 .004)
Terminal Length 0.50 0.10 (.020 .004)

Reel Dimensions

Dimension Value (mm) Value (inches)
Reel Diameter 178.0 (7.00)
Hub Diameter 13.0 0.5 (.512 .020)
Pocket Width 8.0 (.315)
Pocket Pitch 4.0 (.157)
Carrier Tape Thickness 0.10 MAX. (.004)

Soldering Profile

Stage Parameter Value
Preheat Temperature Min. (Tsmin) 150 C
Temperature Max. (Tsmax) 200 C
Time (ts) from Tsmin to Tsmax 60-120 seconds
Ramp-up Rate 3 C/second max.
Reflow Liquids temperature (TL) 217 C
Time (tL) maintained above TL 60-150 seconds
Peak package body temperature (Tp) 260 C
Time within 5 C of Actual Peak Temperature (tp) < 30 seconds
Ramp-Down Rate 6 C/second max.
Time 25 C to Peak Temperature 8 minutes max.
REFLOW TIMES: 3 TIMES MAX.

2411280048_BOURNS-MH1005-121Y_C5796150.pdf

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