Online Service

Online Service

Contact Person
+86 136 6733 2386
quality High Impedance Chip Ferrite Beads Featuring BOURNS MG1608-400Y for Power Supply Signal Line Applications factory
<
quality High Impedance Chip Ferrite Beads Featuring BOURNS MG1608-400Y for Power Supply Signal Line Applications factory
>
Specifications
Number of Circuits:
1
DC Resistance(DCR):
300mΩ
Impedance @ Frequency:
40Ω@100MHz
Mfr. Part #:
MG1608-400Y
Model Number:
MG1608-400Y
Package:
0603
Key Attributes
Product Description

MG, MU, MZ Series High Impedance Chip Ferrite Beads

Product Overview

The MG, MU, MZ Series High Impedance Chip Ferrite Beads are designed to offer high resistance to heat, humidity, mechanical shock, and pressure. Featuring accurate dimensions for automatic surface mounting and a wide impedance range, these components are RoHS compliant and suitable for various applications including power supply lines, IC power lines, and signal lines. Their robust construction ensures reliable performance in demanding environments.

Product Attributes

  • Brand: Bourns
  • Series: MG, MU, MZ
  • Compliance: RoHS compliant (Directive 2015/863)
  • Core Material: Ferrite
  • Internal Conductor: Ag or Ag/Pd
  • Terminal Material: Ag/Ni/Sn

Technical Specifications

Model Number Impedance () at 100 MHz RDC () Max. IDC (mA) Max. Operating Temperature Storage Temperature
MG2029-100Y 10 25 % 0.20 400 -55 C to +125 C -55 C to +125 C
MG3261-301Y 300 25 % 0.15 700
MU3261-101Y 100 25 % 0.15 500
MU3261-300Y 30 25 % 0.20 500
MU3261-600Y 60 25 % 0.20 400
MU3261-750Y 75 25 % 0.20 400
MU3261-121Y 120 25 % 0.15 900
MU3261-221Y 220 25 % 0.35 700
MU3261-301Y 300 25 % 0.15 700
MU3261-471Y 470 25 % 0.35 400
MU3261-601Y 600 25 % 0.30 400
MU3261-801Y 800 25 % 0.60 300
MU3261-102Y 1000 25 % 0.60 300
MG2029-300Y 30 25 % 0.10 400
MG2029-400Y 40 25 % 0.20 300
MU2029-600Y 60 25 % 0.10 900
MG2029-800Y 80 25% 0.20 300
MG2029-101Y 100 25 % 0.20 400
MG3261-151Y 150 25 % 0.15 700
MG2029-121Y 120 25 % 0.25 300
MU2029-151Y 150 25 % 0.20 800
MU2029-221Y 220 25 % 0.30 500
MU2029-301Y 300 25 % 0.30 500
MU2029-471Y 470 25 % 0.35 700
MZ2029-601Y 600 25 % 0.40 100
MZ2029-601T 600 25 % 0.40 200 -55 C to +125 C -55 C to +125 C
MG1608-300Y 30 25 % 0.20 200
MG1608-400Y 40 25 % 0.30 300
MU1608-600Y 60 25 % 0.20 700
MG1608-800Y 80 25 % 0.30 300
MG1608-101Y 100 25 % 0.25 200
MG1608-121Y 120 25 % 0.30 200
MU1608-151Y 150 25 % 0.25 600
MU1608-221Y 220 25 % 0.30 200
MU1608-301Y 300 25 % 0.35 150
MU1608-471Y 470 25 % 0.45 350
MZ1608-601Y 600 25 % 0.45 100
MZ1608-102Y 1000 25 % 0.60 100
MU1005-100Y 10 25 % 0.10 500
MU1005-300Y 30 25 % 0.20 300
MU1005-600Y 60 25 % 0.25 300 -55 C to +125 C -55 C to +125 C
MU1005-121Y 120 25 % 0.30 100
MU1005-151Y 150 25 % 0.30 100
MU1005-221Y 220 25 % 0.40 100
MU1005-241Y 240 25 % 0.60 100
MU1005-301Y 300 25 % 0.50 100
MU1005-471Y 470 25 % 0.65 100
MU1005-601Y 600 25 % 0.80 80 -55 C to +125 C -55 C to +125 C
MU1005-102Y 1000 25 % 1.20 80

Dimensions

Series A (mm/in) B (mm/in) C (mm/in) D (mm/in) G (mm/in) H (mm/in) I (mm/in)
3261 3.2 0.2 (.126 .008) 1.6 0.2 (.063 .008) 1.1 0.2 (.043 .008) 0.5 0.2 (.020 .008) 2.2 (.087) 1.8 (.071) 1.05 (.041)
2029 2.0 0.2 (.079 .008) 1.2 0.2 (.047 .008) 0.9 0.2 (.035 .008) 0.5 0.2 (.020 .008) 1.0 (.040) 1.0 (.040) 1.0 (.040)
1608 1.6 0.15 (.063 .006) 0.8 0.2 (.031 .008) 0.8 0.2 (.031 .008) 0.3 0.2 (.012 .008) 0.7 (.028) 0.7 (.028) 0.7 (.028)
1005 1.0 0.10 (.039 .004) 0.5 0.1 (.020 .004) 0.5 0.1 (.020 .004) 0.25 0.1 (.010 .004) 0.5 (.020) 0.55 (.022) 0.7 (.028)

Reel Dimensions

Series Pcs. per Reel D (mm/in) P (mm/in) G (mm/in) T (mm/in)
3261 3,000 8.0 (.315) 4.0 (.157) 10.0 + 0 (.394 + 0) 12.5 (.492)
2029 4,000 4.0 (.157)
1608 4,000 4.0 (.157)
1005 10,000 2.0 (.079)

Applications

  • Power supply lines
  • IC power lines
  • Signal lines

Soldering Profile

Pb Free Assembly

Profile Feature Value
Preheat - Temperature Min. (Tsmin) 150 C
Preheat - Temperature Max. (Tsmax) 200 C
Preheat - Time (ts) from Tsmin to Tsmax 60-120 seconds
Ramp-up Rate (TL to Tp) 3 C/second max.
Liquidous temperature (TL) 217 C
Time (tL) maintained above TL 60-150 seconds
Peak package body temperature (Tp) 260 C
Time within 5 C of Actual Peak Temperature (tp) < 30 seconds
Ramp-Down Rate (Tp to TL) 6 C/second max.
Time 25 C to Peak Temperature 8 minutes max.

Soldering Profile Notes:

  • Reflow Times: 3 Times MAX.
  • Maximum Ramp Up Rate: 3 C/SEC.
  • Maximum Ramp Down Rate: 6 C/SEC.

2504101957_BOURNS-MG1608-400Y_C7226201.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max