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quality Compact high current chip ferrite bead BOURNS MH1005-471Y for noise suppression in electronic circuits factory
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quality Compact high current chip ferrite bead BOURNS MH1005-471Y for noise suppression in electronic circuits factory
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Specifications
DC Resistance(DCR):
180mΩ
Impedance @ Frequency:
470Ω@100MHz
Mfr. Part #:
MH1005-471Y
Model Number:
MH1005-471Y
Key Attributes
Product Description

Product Overview

The MH1005 Series High Current Chip Ferrite Beads are designed for efficient noise suppression in electronic circuits. These components offer a compact size, high current capability, and a wide impedance range, making them suitable for various applications requiring effective EMI/RFI filtering. They are RoHS compliant and halogen-free, adhering to modern environmental standards.

Product Attributes

  • Brand: Bourns
  • Series: MH1005 Series
  • Compliance: RoHS compliant, Halogen free
  • Core Material: Ferrite
  • Internal Conductor: Ag or Ag/Pd
  • Terminal: Ag/Ni/Sn
  • Packaging: 10,000 pcs./7-inch reel
  • Certifications: RoHS Directive 2015/863, Halogen free (Br content 900 ppm; Cl content 900 ppm; Total Br+Cl 1500 ppm)

Technical Specifications

Model Number Impedance () at 100 MHz RDC (m) Max. IDC (A) Max. Operating Temperature (C) Storage Temperature (Component Mounted) (C) Rated Current (Based on max temperature rise of +40 C) Moisture Sensitivity Level ESD Classification (HBM)
MH1005-300Y 30 25 % 22 3.0 -55 C to +125 C -55 C to +125 C Based on max temperature rise of +40 C 1 N/A
MH1005-800Y 80 25 % 38 2.3
MH1005-121Y 120 25 % 50 2.0
MH1005-221Y 220 25 % 95 1.5
MH1005-301Y 300 25 % 150 1.2
MH1005-471Y 470 25 % 180 1.1
MH1005-601Y 600 25 % 200 1.0

Product Dimensions

Dimension Value (mm) Value (inches)
Length 2.0 0.5 .079 .020
Width 1.00 0.10 .039 .004
Height 0.50 0.10 .020 .004
Terminal Width 0.50 0.10 .020 .004
Electrode Width 0.25 0.10 .010 .004

Soldering Profile

Parameter Value
Preheat - Temperature Min. (Tsmin) 150 C
Preheat - Temperature Max. (Tsmax) 200 C
Preheat - Time (ts) from Tsmin to Tsmax 60-120 seconds
Ramp-up Rate (TL to Tp) 3 C/second max.
Liquidous temperature (TL) 217 C
Time (tL) maintained above TL 60-150 seconds
Peak package body temperature (Tp) 260 C
Time within 5 C of Actual Peak Temperature (tp) < 30 seconds
Ramp-Down Rate (Tp to TL) 6 C/second max.
Time 25 C to Peak Temperature 8 minutes max.
Reflow Times 3 TIMES MAX.

Additional Information

  • PRODUCT SELECTOR
  • TECHNICAL LIBRARY
  • INVENTORY
  • SAMPLES
  • CONTACT

Note: Specifications are subject to change without notice. Users should verify actual device performance in their specific applications.

WARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov


2411280048_BOURNS-MH1005-471Y_C7301850.pdf

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