SRF4532TA Series Common Mode Chip Inductor
Product Overview
The SRF4532TA Series is a common mode chip inductor designed for EMI suppression and noise filtering applications. Featuring a shielded construction for low radiation, a wide impedance range from 90 to 2800 @ 100 MHz, and high current capability up to 4 A, these inductors offer a compact solution. They are RoHS compliant, halogen-free, and AEC-Q200 compliant, making them suitable for demanding applications.
Product Attributes
- Brand: Bourns
- Series: SRF4532TA
- Certifications: RoHS COMPLIANT, HALOGEN FREE, AEC-Q200 COMPLIANT
- Construction: Shielded
- Materials: Core - Ferrite, Wire - Enameled copper, Terminal Finish - Sn
- Packaging: 500 pcs. per 7-inch reel
Technical Specifications
| Bourns Part Number | Impedance () @ 100 MHz (Typ.) | Inductance @ 100 kHz / 0.1 V (Typ.) (L H) | DCR () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| SRF4532TA-900Y | 90 | 0.35 | 0.050 | 4000 |
| SRF4532TA-231Y | 230 | 0.85 | 0.050 | 3500 |
| SRF4532TA-421Y | 420 | 1.50 | 0.055 | 3200 |
| SRF4532TA-601Y | 600 | 1.70 | 0.060 | 2500 |
| SRF4532TA-901Y | 900 | 3.20 | 0.070 | 2300 |
| SRF4532TA-142Y | 1400 | 4.00 | 0.100 | 2000 |
| SRF4532TA-282Y | 2800 | 10.00 | 0.350 | 900 |
General Specifications
- Withstand Voltage: 125 VDC
- Rated Voltage: 50 VDC
- Insulation Resistance: 10 M (min.)
- Operating Temperature: -55 C to +125 C (Temperature rise included)
- Storage Temperature: -55 C to +125 C
- Temperature Rise: 40 C at rated current
Product Dimensions
- Length: 4.5 0.2 mm (.177 .008 in)
- Width: 3.20 0.20 mm (.126 .008 in)
- Height: 2.8 0.2 mm (.110 .008 in)
- Terminal Dimensions: 1.05 0.15 mm (.041 .006 in) (2 PLCS.)
- Terminal Dimensions: 0.9 0.15 mm (.035 .006 in) (2 PLCS.)
- Terminal Spacing: 0.4 mm ( .016 in)
Recommended Layout
- Pad Size: 5.00 mm (.197 in)
- Pad Size: 3.00 mm (.118 in)
- Pad Size: 3.60 mm (.142 in)
- Pad Size: 1.20 mm (.047 in)
Electrical Schematic
Pin Configuration: 1, 2, 4, 3
How to Order
SRF4532TA - [Value Code] Y
Example: SRF4532TA-900Y
Soldering Profile
Profile Feature | Value
Preheat - Temperature Min. (Tsmin) | 150 C
Preheat - Temperature Max. (Tsmax) | 200 C
Preheat - Time (ts) from Tsmin to Tsmax | 60-120 seconds
Ramp-up Rate (TL to Tp) | 3 C/second max.
Liquidous temperature (TL) | 217 C
Time (tL) maintained above TL | 60-150 seconds
Peak package body temperature (Tp) | 250 C
Time (tp) at Tc - 5 C (Tp should be equal to or less than Tc) | < 30 seconds
Ramp-Down Rate (Tp to TL) | 6 C/second max.
Time 25 C to Peak Temperature | 8 minutes max.
Reflow Times: 3 times max.
Applications
- EMI suppression
- Noise filters
Additional Information
2412041606_BOURNS-SRF4532TA-601Y_C24288288.pdf
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