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quality High voltage MLCC AIDE CAPACITOR 0603X7R121K251NT used in DC DC power chargers and networking devices factory
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quality High voltage MLCC AIDE CAPACITOR 0603X7R121K251NT used in DC DC power chargers and networking devices factory
>
Specifications
Voltage Rating:
250V
Capacitance:
120pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R121K251NT
Model Number:
0603X7R121K251NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier
AC-DC power charger
DC-DC power charger
Networking/Communication interface
LCD backlight unit power supplier
Amperite of energy saving lamps
Part Number Description Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 25025V, 251250V, 2522500V
Terminal Composition Au/Ag-Ni-Sn (From the inside out)
Packing T Tape/Reel, P Bag packing(PE)
Dimensions (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Temperature Characteristic Item Specification/Requirement Testing Method
Temperature Range -55~+125 N/A
Static Capacity NPO Characteristic 1000pF: 1MHz10%, 1.00.2Vrms
>1000pF: 1KHz10%, 1.00.2Vrms
X7R/X7T/X7P Characteristic 10uF: 1KHz10%, 1.00.2Vrms
>10uF: 120Hz24, 0.50.1Vrms
Tolerance B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Initial Testing Condition Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature
Dissipation Factor (DF) NPO Characteristic DF0.56, Cr5 pF
DF1.5[(150/Cr)+7]10-4 (5pFCr50pF)
DF0.15%, (50pFCr)
Cr1000pF, 110%MHz, 1V0.2rms
Cr1000pF, 110%KHz, 1V0.2rms
X7R/X7T/X7P Characteristic See Note 1 Cr10uF, 110%KHz, 1V0.1rms
Cr10uF, 12024Hz, 0.5V0.1rms
Insulation Resistance (IR) NPO Characteristic IR50000M, C10nF
IR*Cr500S, C10nF
Rated voltage, 605s, Humidity:75%, Temperature:255, Current :50mA
X7R/X7T/X7P Characteristic IR10000M, C25nF
IR*Cr100S, C25nF
Hi-pot (DC) No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage
Ur=200V/250V: 2.0 x rated voltage
Ur=450/500/630V: 1.5 x rated voltage
1KVUr2KV: 1.2 x rated voltage
2KVUr: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time2S
Solderability Soldering area90% Pre-heating 80-120, 10-30s; Lead free solder, flux; Soldering temp 2455, Time 20.5s
Resistance to the heat of soldering No damage, soldering area90% Pre-heating 100-200, 102s; Soldering temp 2655, Time 51s. Cleaning with solvent. Room temp, 242 hours.
Electrostatic Capacity Change Rate NPO Characteristic C/C0.5% or 0.5pF (larger reading)
X7R C/C15%
X7T -33% C/C22%
X7P C/C10%
Flexural Strength No damage Base board: Al2O3 /PCB, PCB thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO Characteristic C/C2.5% or 0.25pF (larger reading) Pre-condition(X7R h characteristic): Upper limit temp 1hr, place 241 hrs, start testing. Run 5 cycles. Test after 242hrs normal temp & humidity.
X7R/X7P characteristic C/C0.5%
X7T characteristic C/C10%
Temperature Moisture Exposure Visual No visual damage Test after 242 hours normal temp & humidity. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours.
Electrostatic Capacitance Change Rate NPO: C/C2% or 1pF (larger reading)
X7R/X7T/X7P: C/C10%
DF 2 times initial standard
IR: NPO: IR2500M or IR*Cr25S (Lower reading)
X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
High Temperature Exposure Visual No visual damage Test after 48 hours under normal pressure & temperature. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
Electrostatic Capacitance Change Rate NPO: C/C2% or 1pF (larger reading)
X7R/X7T/X7P: C/C20%
DF 2 X initial standard
IR: NPO: IR4000M or IR*Cr40S (Lower reading)
X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing. See diagram for dimensions A, B, C for different sizes (0805 to 2220).
Embossed Plastic Taping Taping dimensions for 0805 to 1812 See detailed dimensions in table (A, B, C, D, E, F, G, H, J, T)
Paper Tape Reel Packing Taping dimensions for 1005, 0201, 0402, 0603, 0805, 1206 See detailed dimensions in table (W1, L1, D, C, B, P1, P2, P0, d, t)
Reel Dimensions 7REEL, 13REEL 1782.0 to 3302.0
Top Tape Peeling Strength Paper Taping, Embossed Taping 0.1N < peeling strength < 0.7N
Packing Quantity Paper T/R (Pcs), Plastic T/R (Pcs) Varies by size and type (e.g., 4000 pcs for 0603 Paper T/R)

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes:

  • Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully, and pay attention to tip selection and temperature contact.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts
  • Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific methods vary by size, temperature characteristic, rated voltage, and capacitance.
  • Temperature Profile for Soldering: Keep the temperature difference between soldering temperature and surface temperature of chips 150 during preheating.

2509251626_AIDE-CAPACITOR-0603X7R121K251NT_C48579286.pdf

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