Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface | |||||
| LCD backlight unit power supplier | |||||
| Amperite of energy saving lamps | |||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 25025V, 251250V, 2522500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T Tape/Reel, P Bag packing(PE) | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Characteristic | Item | Specification/Requirement | Testing Method | ||
| Temperature Range | -55~+125 | N/A | |||
| Static Capacity | NPO Characteristic | 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms | |||
| X7R/X7T/X7P Characteristic | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | ||||
| Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Initial Testing Condition | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature | ||||
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms | ||
| X7R/X7T/X7P Characteristic | See Note 1 | Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms | |||
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current :50mA | ||
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | ||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time2S | |||
| Solderability | Soldering area90% | Pre-heating 80-120, 10-30s; Lead free solder, flux; Soldering temp 2455, Time 20.5s | |||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating 100-200, 102s; Soldering temp 2655, Time 51s. Cleaning with solvent. Room temp, 242 hours. | |||
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | |||
| X7R | C/C15% | ||||
| X7T | -33% C/C22% | ||||
| X7P | C/C10% | ||||
| Flexural Strength | No damage | Base board: Al2O3 /PCB, PCB thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition(X7R h characteristic): Upper limit temp 1hr, place 241 hrs, start testing. Run 5 cycles. Test after 242hrs normal temp & humidity. | ||
| X7R/X7P characteristic | C/C0.5% | ||||
| X7T characteristic | C/C10% | ||||
| Temperature Moisture Exposure | Visual | No visual damage | Test after 242 hours normal temp & humidity. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. | ||
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | ||||
| High Temperature Exposure | Visual | No visual damage | Test after 48 hours under normal pressure & temperature. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). | ||
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | ||||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing. See diagram for dimensions A, B, C for different sizes (0805 to 2220). | |||
| Embossed Plastic Taping | Taping dimensions for 0805 to 1812 | See detailed dimensions in table (A, B, C, D, E, F, G, H, J, T) | |||
| Paper Tape Reel Packing | Taping dimensions for 1005, 0201, 0402, 0603, 0805, 1206 | See detailed dimensions in table (W1, L1, D, C, B, P1, P2, P0, d, t) | |||
| Reel Dimensions | 7REEL, 13REEL | 1782.0 to 3302.0 | |||
| Top Tape Peeling Strength | Paper Taping, Embossed Taping | 0.1N < peeling strength < 0.7N | |||
| Packing Quantity | Paper T/R (Pcs), Plastic T/R (Pcs) | Varies by size and type (e.g., 4000 pcs for 0603 Paper T/R) | |||
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes:
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully, and pay attention to tip selection and temperature contact.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific methods vary by size, temperature characteristic, rated voltage, and capacitance.
- Temperature Profile for Soldering: Keep the temperature difference between soldering temperature and surface temperature of chips 150 during preheating.
2509251626_AIDE-CAPACITOR-0603X7R121K251NT_C48579286.pdf
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