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Specifications
Voltage Rating:
2kV
Capacitance:
47pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G470J202NT
Model Number:
1206C0G470J202NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in power supplies such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are suitable for medium and high voltage circuits.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |
| Dimensions (Code) | 0201 | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 |
| 0402 | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | |
| 0603 | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | |
| 0805 | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | |
| 1206 | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | |
| 1210 | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | |
| 1808 | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | |
| 1812 | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | |
| 1825 | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | |
| 2211 | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8 | |
| 2225 | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | |
| Temperature Characteristic | C0G | (030 PPM/) |
| X7R | (15%) | |
| X5R | (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Specification and Testing Method | Temperature | -55~+125 |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | |
| Static Capacity | NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms. X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. (See Note 1 for exceptions) | |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90%, Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |
| Flexural strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10%. Flexural depth 452. | |
| Terminal bonding strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Run 5 cycles. Test after 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual No visual damage. Temperature 402, Humidity 90~95%RH, time 50024 hours. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | |
| High temperature exposure | Visual No visual damage. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | |
| PCB flexural strength | No crack and other defect. IR. | |
| Embossed Plastic Taping | Details provided for tape sizes: 0805, 1206, 1210, 1808, 1812. | |
| Paper Tape Reel Packing | Details provided for tape sizes: 1005, 0201, 0402, 0603, 0805, 1206. | |
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. | |
| Packing Quantity | Details provided for Paper T/R and Plastic T/R by size. | |
| Soldering Method | RReflow Soldering, WWave Soldering. Recommended methods for various sizes and characteristics. | |
| Soldering Profile | Recommended temperature profile for soldering to avoid cracks. | |
Precautions for Use
To prevent MLCC failure under severe electrical or mechanical stress, adhere to the specified ratings and conditions. Failure to do so may result in burnout, flaming, or glowing. Follow safety precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the provided temperature profile to prevent cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to avoid thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering: Recommended solder amounts are provided.
- Recommended Soldering Method: Specific methods (Reflow/Wave) are recommended based on component size and characteristics.
2509251626_AIDE-CAPACITOR-1206C0G470J202NT_C48579670.pdf
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