Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in different temperature characteristics (C0G, X7R, X5R) and a wide range of dimensions and electrical specifications.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) | - |
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Components: Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | - |
| Dimension Codes & Sizes | Code | L*W (inch) | L*W (mm) 0201 | 0.02*0.01 | 0.50*0.25 0402 | 0.04*0.02 | 1.00*0.50 0603 | 0.06*0.03 | 1.60*0.80 0805 | 0.08*0.05 | 2.00*1.25 1206 | 0.12*0.06 | 3.20*1.60 1210 | 0.12*0.10 | 3.20*2.50 1808 | 0.18*0.08 | 4.50*2.00 1812 | 0.18*0.12 | 4.50*3.20 1825 | 0.18*0.25 | 4.50*6.30 2211 | 0.22*0.11 | 5.70*2.8 2225 | 0.22*0.25 | 5.70*6.30 | - |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | - |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | - |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | - |
| Packing | T Tape/Reel, P Bag packing (PE) | - |
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | - |
| Dimensions (mm) | Part number | Dimension (mm) L | W | T | WB 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | Digital caliper |
| Temperature Range | -55~+125 | - |
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1. Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. | - |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Condition: Rated voltage, 605s, Humidity:75%, Temp:255, Current:50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. | - |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S. | - |
| Solderability | Soldering area 90%. No Damage. Pre-heating: 80-120, 10-30s. Solder: Lead free. Flux. Temp: 2455, Time: 20.5s. | Visual |
| Resistance to the heat of soldering | No visual damage, soldering area 90%. Pre-heating: 100-200, 102s. Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | - |
| Flexural Strength | No damage. Electrostatic capacity change rate: C/C10%. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm. Bend speed: 0.5mm/sec. | Visual |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | - |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | - |
| Temperature Moisture Exposure | Capacity Change: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Visual |
| High Temperature Exposure | Capacity Change: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Visual |
| PCB Flexural Strength | No crack and other defect. | IR |
| Embossed Plastic Taping Dimensions | Code | Tape size A | B | C | D | E | F | G | H | J 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | - |
| Paper Tape Reel Packing Dimensions | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | - |
| Reel Dimensions | Type | A | B | C | D | E | F 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | - |
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) 1206 | | 3000 (T1.60mm) / 2000 (T1.60mm) 1210 | | 1000 (T1.85mm) / 800 (T1.85mm) 1812 | | 500 | - |
| Soldering Method Recommendation | Size | Capacitance | Soldering Method 1005 | / | R 0201 | / | R 0402 | / | R 0603 | C1uf | R 0603 | C1uf | R/W 0805 | C4.7uf | R 0805 | C4.7uf | R/W 1206 | C10uf | R 1206 | C10uf | R/W 1210 | / | R *RReflow Soldering, WWave Soldering | - |
Note 1: X7R/X5R/X6S/X7S/Y5V DF exceptions are detailed in the provided document.
Precautions for Use: MLCCs may fail in short or open circuit modes under severe conditions. Follow soldering profiles, handle with care during manual soldering, and ensure optimum solder amount for reflow soldering to avoid cracks and damage.
2509251626_AIDE-CAPACITOR-0603C0G101J251NT_C49326290.pdf
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