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Specifications
Voltage Rating:
50V
Capacitance:
220pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G221J500NT
Model Number:
0603C0G221J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These are high-quality Multi-Layer Ceramic Capacitors (MLCCs) designed for a wide range of high-voltage applications. They are ideal for coupling, wave filtering, and resonant functions in demanding circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance and durability.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |||||||||
| Construction | ||||||||||
| 1. Ceramic Dielectric | ||||||||||
| 2. Inner Electrode | ||||||||||
| 3. Outer Electrode | ||||||||||
| 4. Nickel Layer | ||||||||||
| 5. Tin Layer | ||||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| 1. Temperature | -55~+125 | |||||||||
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance | |||||||||
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | |||||||||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF | Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | ||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,.......2.5 x rated voltage; Ur=200V/250V,.... 2.0 x rated voltage; Ur=450/500/630V,1.5 x rated voltage; 1KVUr2KV,.......1.2 x rated voltage; 2KVUr,...............1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S | ||||||||
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120,time10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s | ||||||||
| 8. Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours. | ||||||||
| 9. Flexural Strength | No damage | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| 11. Thermal Shock | NPO Characteristic; C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristicC/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||
| 12. Temperature Moisture Exposure | Visual: No visual damage; Capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%; DF 2 times initial standard; IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity | ||||||||
| 13. High Temperature Exposure | Visual: No visual damage; Capacitance change rate: NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO : IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | ||||||||
| 14. PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping: Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (b) Embossed Taping: Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||
| Packing Quantity | ||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) | ||||||||
| 1210 | - | 1000 (T1.85mm), 800 (T1.85mm) | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |||||||||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||||
| Recommended Soldering amounts | ||||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| 0201 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0402 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0603 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||||
| C4.7uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| Y5V | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| Soldering Method: RReflow Soldering, WWave Soldering | ||||||||||
| The temperature profile for soldering | ||||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-0603C0G221J500NT_C49326311.pdf
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