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Specifications
Voltage Rating:
50V
Capacitance:
3pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G3R0C500NT
Model Number:
0603C0G3R0C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Applications: Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Testing (for Notes 3, 11, 12, 13) | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. | |
| Part Number Description Example | Structure | 1812 X7R 684 M 251 N T |
| Item Breakdown | Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | |
| Dimension Codes (L*W) | Inch | 0.02*0.01 (0201), 0.04*0.02 (0402), 0.06*0.03 (0603), 0.08*0.05 (0805), 0.12*0.06 (1206), 0.12*0.10 (1210), 0.18*0.08 (1808), 0.18*0.12 (1812), 0.18*0.25 (1825), 0.22*0.11 (2211), 0.22*0.25 (2225) |
| Dimension Codes (L*W) | mm | 0.50*0.25 (0201), 1.00*0.50 (0402), 1.60*0.80 (0603), 2.00*1.25 (0805), 3.20*1.60 (1206), 3.20*2.50 (1210), 4.50*2.00 (1808), 4.50*3.20 (1812), 4.50*6.30 (1825), 5.70*2.8 (2211), 5.70*6.30 (2225) |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) |
| Nominal Electrostatic Capacity (pF) | Format | 8R0=8.0, 100=10, 101=100 |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% |
| Rated Voltage (DC) | Format | 250=25V, 251=250V, 252=2500V |
| Construction | 1 | Ceramic dielectric |
| 2 | Inner electrode | |
| 3 | Outer electrode | |
| 4 | Nickel layer | |
| 5 | Tin layer | |
| Dimensions (mm) | Part Number | L Tol | W Tol | T Tol | WB Tol |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 1.000.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 1.250.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 0603 (Additional) | 0.600.10 | 0.300.05 | 0.600.10 | (WB not specified) | |
| 0805 (Additional) | 2.000.20 | 1.250.20 | 0.500.20 | 1.250.20 | |
| 0805 (Additional) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (Additional) | 3.200.30 | 1.600.30 | 0.600.30 | 1.600.30 | |
| 1206 (Additional) | 3.200.30 | 1.600.30 | 1.250.20 | 0.800.20 | |
| 1210 (Additional) | 3.200.30 | 2.500.30 | 0.800.30 | (WB not specified) | |
| 1808 (Additional) | 4.500.40 | 2.000.20 | 0.800.30 | (WB not specified) | |
| 1812 (Additional) | 4.500.40 | 3.200.30 | 0.800.30 | (WB not specified) | |
| 1825 (Additional) | 4.500.40 | 6.300.50 | 0.800.30 | (WB not specified) | |
| 2220 (Additional) | 5.700.50 | 5.000.50 | 1.000.40 | (WB not specified) | |
| 2225 (Additional) | 5.700.50 | 6.300.50 | 1.000.40 | (WB not specified) | |
| Temperature Characteristic | -55~+125 | Testing Method: Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) | X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Frequency: 110%MHz (Cr1000pF), 110%KHz (Cr1000pF). Voltage: 1V0.2rms. | X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C10nF). Testing Conditions: Rated voltage, 605s, Humidity75%, Temp: 255, Current50mA. | X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C25nF). |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Maintaining time: 2S. | No dielectric breakdown or damage. |
| Solderability | Soldering area90%. Visual-No damage. Pre-heating: 80-120, 10-30s. Lead free solder, flux. Soldering temp: 2455, Time: 20.5s. | Visual inspection. |
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating: 100-200, 102s. Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temp, 242 hours. | Visual inspection. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | DF Refer to NO#4, IR Refer to NO#5. |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | Electro static capacity change rate: C/C10%. Flexural depth: 452mm. |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | Visual inspection. |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R): Upper limit temp 1hr, place 241 hrs. 5 cycles. Test after 242hrs normal temp & humidity. | Visual inspection. |
| Temperature Moisture Exposure | Visual: No visual damage. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242hrs normal temp & humidity. | Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. |
| High Temperature Exposure | Visual: No visual damage. Temp: 1253, Time: 100048 hours. Charging/discharging current: 50mA Max. Test after 48hrs normal pressure & temperature. | Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. |
| PCB Flexural Strength | No crack and other defect. IR Soldering MLCC on PCB, then pressing direction based on photo. | SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. |
| Embossed Plastic Taping Dimensions (mm) | Code | Tape Size A Tol | B Tol | C Tol | D Tol | E Tol | F Tol | G Tol | H Tol | J Tol | T Max |
| 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.50 | |
| 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 1.85 | |
| 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 3.2 | |
| 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.0 | |
| 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 4.0 | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper Size W1 Tol | L1 Tol | D Tol | C Tol | B Tol | P1 Tol | P2 Tol | P0 Tol | d Tol | t Below |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 | |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 | |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 | |
| 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (mm) | Unit:mm | A | B | C | D | E | F | G |
| 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity (Pcs) | Paper T/R | 0201: 10000, 0402: 10000, 0603: 4000, 0805: 4000, 1206: 4000 |
| Packing Quantity (Pcs) | Plastic T/R | 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm), 1812 above: 500 |
| Soldering Method Recommendation | Size | Method (R=Reflow, W=Wave) |
| 1005 | NPO: R; X7R/X5R/X7S/X6S: R | |
| 0201 | NPO: R; X7R/X5R/X7S/X6S: R; Y5V: R | |
| 0402 | NPO: R; X7R/X5R/X7S/X6S: R; Y5V: R | |
| 0603 | NPO: R/W; X7R/X5R/X7S/X6S: R (C1uF), R/W (C1uF); Y5V: R (C1uF), R/W (C1uF) | |
| 0805 | NPO: R/W; X7R/X5R/X7S/X6S: R (C4.7uF), R/W (C4.7uF); Y5V: R (C1uF), R/W (C1uF) | |
| 1206 | NPO: R/W; X7R/X5R/X7S/X6S: R (C10uF), R/W (C10uF); Y5V: R (C10uF), R/W (C10uF) | |
| 1210 | NPO: R; X7R/X5R/X7S/X6S: R; Y5V: R | |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering for handling questions.
- Soldering Profile: Follow the provided temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Soldering Temperature Profile: Keep the temperature difference between soldering temperature and chip surface temperature T 150 during preheating.
2509251626_AIDE-CAPACITOR-0603C0G3R0C500NT_C49326326.pdf
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