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Specifications
Voltage Rating:
50V
Capacitance:
3.3pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G3R3C500NT
Model Number:
0603C0G3R3C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs are available in various sizes and temperature characteristics, with options for different tolerances, rated voltages, and terminal compositions.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal (15~35, 45~75%RH, 86~106kPa) and Relative (252, 60~70%RH, 86~106kPa) | |||||
| Part Number Description | 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) | ||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | ||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | ||||
| Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | |||
| Dimension (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| ... (other dimensions listed in the source) | ... | ... | ... | ... | |
| Specification and Testing Method | Temperature | -55~+125 | |||
| Visual/ Dimension | 1, No Damage; 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF) | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S | |||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | |||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | ||||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||
| Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |||
| High temperature exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | |||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction base on the photo. | |||
| Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type | See table for dimensions (A, B, C, D, E, F, G, H, J, T) | |||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard | |||
| Paper Tape Reel Packing | For 1005(0402)~1206(3216) types | See table for dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) | |||
| For 0603, 0805, 1206 types | See table for dimensions (A, B, C, D, E, F, G, H, J, T) | ||||
| Reel Dimensions | 7REEL (1782.0), 13REEL (3302.0) | Unit: mm | |||
| Packing Quantity | See table for Paper T/R (Pcs) and Plastic T/R (Pcs) by size | ||||
| Soldering Method | RReflow Soldering, WWave Soldering | Recommended for different sizes, characteristics, rated voltage, and capacitance | |||
| Soldering Profile | Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. | Refer to adjacent graph (enclosure page) | |||
2509251626_AIDE-CAPACITOR-0603C0G3R3C500NT_C49326327.pdf
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