quality High reliability multi layer ceramic capacitor AIDE CAPACITOR 0603C0G6R0C500NT compliant with RoHS and REACH standards factory

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Specifications

Voltage Rating:

50V

Capacitance:

6pF

Temperature Coefficient:

C0G

Mfr. Part #:

0603C0G6R0C500NT

Model Number:

0603C0G6R0C500NT

Package:

0603

Key Attributes

Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. The MLCCs are available in various dimensions and temperature characteristics, offering reliable performance in demanding electrical environments.

Product Attributes

Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
RoHS/REACH Compliance: Meets RoHS and REACH standards.

Technical Specifications

Item

Description/Specification

Testing Method

Application Field

Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.)

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Testing Conditions (Normal)

Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa

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Testing Conditions (Relative)

Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa

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Part Number Description Example

1812 X7R 684 M 251 N T

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Dimension Codes

0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm)

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Nominal Electrostatic Capacity

8R0 (8.0 pF), 100 (10 pF), 101 (100 pF)

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Tolerance of Electrostatic Capacity

B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%)

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Rated Voltage (DC)

250 (25V), 251 (250V), 252 (2500V)

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Packing

T (Tape/Reel), P (Bag packing)

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Construction

1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer

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Dimensions (mm)

Part Number Code	Dimension L (mm)	Dimension W (mm)	Dimension T (mm)	WB (mm)
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40

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Temperature

-55~+125

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Visual/Dimension

1. No Damage, 2. Dimension meet Spec

Naked eye (Visual inspection), Digital calliper

Static Capacity

NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms.

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Dissipation Factor (DF)

NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. (See Note 1 for exceptions)

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IR Insulation Resistance

NPO: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF.

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Hi-pot (DC)

Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S.

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Solderability

Soldering area 90%

Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.

Resistance to the heat of soldering

No visual damage, soldering area 90%

Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.

Electrostatic Capacity Change Rate

NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%.

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Flexural Strength

No damage. Electro static capacity change rate C/C10%.

Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.

Terminal Bonding Strength

No visual damage.

Applied Force: 5N, Duration: 101S.

Thermal Shock

NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%.

Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity.

Temperature Moisture Exposure

Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading).

Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity.

High Temperature Exposure

Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading).

Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature.

PCB Flexural Strength

No crack and other defect.

Soldering the MLCC on the PCB, then pressing direction based on provided diagrams.

Embossed Plastic Taping Dimensions (mm)

Code	Tape Size A	B	C	D	E	F	G	H	J
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10

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Paper Tape Reel Packing Dimensions (mm)

Code	Paper Size W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.24 0.02	0.45 0.02	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.30 Below
0201	0.37 0.10	0.67 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below
0402	0.65 0.10	1.15 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below

Code	Paper Size A	B	C	D	E	F	G	H	J	T
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

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Reel Dimensions (unit: mm)

7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max.

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Top Tape Peeling Strength

0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

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Packing Quantity

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000	-
0805	4000	3000 (T1.35mm)
1206	-	3000 (T1.60mm), 2000 (T1.60mm)
1210	-	1000 (T1.85mm), 800 (T1.85mm)
1808	-	500
1812	-	500

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Soldering Method Recommendation

RReflow Soldering, WWave Soldering. (See Page 13 for detailed size/characteristic recommendations)

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Soldering Temperature Profile

Preheating temperature difference: T150 between soldering temperature and surface temperature of chips.

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2509251626_AIDE-CAPACITOR-0603C0G6R0C500NT_C49326341.pdf

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