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quality Ceramic Capacitor AIDE CAPACITOR 0603X5R475M160NT for in Switch Power Supplies and Communication Interfaces factory
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quality Ceramic Capacitor AIDE CAPACITOR 0603X5R475M160NT for in Switch Power Supplies and Communication Interfaces factory
quality Ceramic Capacitor AIDE CAPACITOR 0603X5R475M160NT for in Switch Power Supplies and Communication Interfaces factory
quality Ceramic Capacitor AIDE CAPACITOR 0603X5R475M160NT for in Switch Power Supplies and Communication Interfaces factory
>
Specifications
Voltage Rating:
16V
Capacitance:
4.7uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
0603X5R475M160NT
Model Number:
0603X5R475M160NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving crucial roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and are available in a wide range of dimensions and electrical specifications to meet diverse industrial needs.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Category Specification Details
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC)
Testing Conditions Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
Part Number Components 1. Dimension Code 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm)
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R08.0pF, 10010pF, 101100pF
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 25025V, 251250V, 2522500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T Tape/Reel, P Bag packing (PE)
Construction Construction Items 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimensions (mm)
Part NumberDimension (mm) LDimension (mm) WDimension (mm) TWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.200.500.20
1206 (3216)3.200.301.600.301.000.200.600.30
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
Specification and Testing Method 1. Temperature -55~+125
2. Visual/Dimension 1. No Damage, 2. Dimension meet Spec. (Visual inspection, Digital caliper)
3. Static Capacity NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
4. Dissipation Factor (DF) Refer to Note 1 and detailed specifications in the document.
5. IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA.
Hi-pot (DC) Dielectric breakdown or damage. Voltage: 1.1x to 2.5x rated voltage depending on Ur. Voltage Raising time: 110S, Voltage maintaining time: 2S.
Solderability Soldering area 90%. Visual inspection: No damage. Pre-heating: 80-120, 10-30s. Solder: Lead-free. Temperature: 2455, Time: 20.5s.
Resistance to the heat of soldering Visual inspection: No damage, soldering area 90%. Pre-heating: 100-200, 102s. Soldering Temperature: 2655, Time: 51s. Cleaning: With solvent. Room temperature: 242 hours.
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%.
Flexural Strength Visual inspection: No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: C/C10%.
Terminal Bonding Strength No visual damage. Applied Force: 5N, Duration: 101S.
Thermal Shock NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles.
Temperature Moisture Exposure Visual inspection: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. (Tested after 242 hours normal temp & humidity).
High Temperature Exposure Visual inspection: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. (Tested after 48 hours under normal pressure & temperature).
PCB Flexural Strength No crack and other defect. IR measurement after soldering.
Embossed Plastic Taping Dimensions provided for tape sizes 0805 to 1812.
Paper Tape Reel Packing Dimensions provided for 1005, 0201, 0402, 0603, 0805, 1206 types.
Reel Dimensions 7' REEL (1782.0mm), 13' REEL (3302.0mm).
Top Tape Peeling Strength Paper Taping: Standard values provided. Embossed Taping: 0.1N < peeling strength < 0.7N.
Packing Quantity Paper T/R: 4000 pcs (0805, 0805). Plastic T/R: Varies by size and thickness (e.g., 3000 pcs for 1210 T1.60mm).
Soldering Method Recommendations RReflow Soldering, WWave Soldering. Specific recommendations based on size, temperature characteristic, rated voltage, and capacitance.
Soldering Temperature Profile Preheating: T150 temperature difference between soldering temperature and surface temperature of chips.

2509251626_AIDE-CAPACITOR-0603X5R475M160NT_C49326381.pdf

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