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Specifications
Voltage Rating:
10V
Capacitance:
10uF
Temperature Coefficient:
X7R
Tolerance:
±20%
Mfr. Part #:
0603X7R106M100NT
Model Number:
0603X7R106M100NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in power supplies such as switch mode power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps (Medium and High voltage MLCC). | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | ||||
| Dimension Codes (L*W) | Inch | mm | |||
| 0201 | 0.02*0.01 | 0.50*0.25 | |||
| 0402 | 0.04*0.02 | 1.00*0.50 | |||
| 0603 | 0.06*0.03 | 1.60*0.80 | |||
| 0805 | 0.08*0.05 | 2.00*1.25 | |||
| 1206 | 0.12*0.06 | 3.20*1.60 | |||
| 1210 | 0.12*0.10 | 3.20*2.50 | |||
| 1808 | 0.18*0.08 | 4.50*2.00 | |||
| 1812 | 0.18*0.12 | 4.50*3.20 | |||
| 1825 | 0.18*0.25 | 4.50*6.30 | |||
| 2211 | 0.22*0.11 | 5.70*2.8 | |||
| 2225 | 0.22*0.25 | 5.70*6.30 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | Example: 8R0=8.0pF, 100=10pF, 101=100pF | ||||
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||||
| Rated Voltage (DC) | Example: 250=25V, 251=250V, 252=2500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T: Tape/Reel, P: Bag packing (PE) | ||||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | ||||
| Dimension (mm) | British System | Metric System | |||
| L W T WB | L W T WB | ||||
| 0201 | 0.600.10 0.300.05 0.300.05 0.100.05 | 0603 | |||
| 0402 | 1.000.15 0.500.15 0.500.10 0.200.10 | 1005 | |||
| 0603 | 1.600.20 0.800.15 0.800.15 0.300.10 | 1608 | 0.600.10 | ||
| 0805 | 2.000.20 1.250.20 0.800.20 1.000.20 | 2012 | 0.500.20 | ||
| 1206 | 3.200.30 1.600.30 1.000.20 1.250.20 | 3216 | 0.600.30 | ||
| 1210 | 3.200.30 2.500.30 2.70 0.800.30 | 3225 | 1.250.20 | ||
| 1808 | 4.500.40 2.000.20 2.70 0.800.30 | 4520 | |||
| 1812 | 4.500.40 3.200.30 3.50 0.800.30 | 4532 | |||
| 1825 | 4.500.40 6.300.50 3.50 0.800.30 | 4563 | |||
| 2220 | 5.700.50 5.000.50 3.50 1.000.40 | 5750 | |||
| 2225 | 5.700.50 6.300.50 6.20 1.000.40 | 5763 | |||
| Specification and Testing Method | |||||
| Temperature | -55~+125 | ||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec. Testing: Naked eye (Visual inspection), Digital calliper. | ||||
| Static Capacity | Meet standard specification and tolerance. Testing frequency and voltage vary by NPO and X7R/X7T/X7P characteristics and capacitance value. | ||||
| Dissipation Factor (DF) | Specification varies by NPO and X7R/X7T/X7P characteristics and capacitance value. Testing frequency and voltage also vary. See Note 1 for X7R/X5R/X6S/X7S/Y5V exceptions. | ||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | ||||
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (Ur) depending on the Ur value (e.g., 2.5 x Ur for Ur=100V, 1.2 x Ur for 1KVUr2KV). Voltage Raising time: 110S, Voltage maintaining time: 2S. | ||||
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. DF and IR refer to previous sections. | ||||
| Flexural strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% under flexural status. | ||||
| Terminal bonding strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading). X7R/X7P- characteristic: C/C0.5%. X7T characteristic: C/C10%. Testing involves 5 cycles of thermal shock after pre-conditioning. | ||||
| Temperature moisture exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). Test after 242 hours at 402, 90~95%RH for 50024 hours. | ||||
| High temperature exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). Test after 48 hours at normal pressure & temperature, then 100048 hours at 1253 with specified voltage. | ||||
| PCB flexural strength | No crack and other defect. IR testing after soldering MLCC on PCB. Pressing direction and dimensions (A, B, C) vary by size (0805 to 2220). | ||||
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size (A B C D E F G H J T) | |||
| 0805 | 1.550.20 2.350.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.50 Max | ||||
| 1206 | 1.950.20 3.600.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.1 1.50 -0/+0.10 1.85 Max | ||||
| 1210 | 2.700.10 3.420.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.55 -0/+0.10 3.2 Max | ||||
| 1808 | 2.200.10 4.950.10 12.000.10 5.500.05 1.750.10 4.000.10 2.000.05 4.000.10 1.50 -0/+0.10 3.0 Max | ||||
| 1812 | 3.660.10 4.950.10 12.000.10 5.500.05 1.750.10 8.000.10 2.000.05 4.000.10 1.55 -0/+0.10 4.0 Max | ||||
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size (W1 L1 D C B P1 P2 P0 d t) | |||
| 1005 | 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below | ||||
| 0201 | 0.370.10 0.670.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | ||||
| 0402 | 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below | ||||
| 0603 | 1.100.10 1.900.10 8.000.10 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||||
| 0805 | 1.450.15 2.300.15 8.00.15 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||||
| 1206 | 1.800.20 3.400.20 8.000.20 3.500.05 1.750.10 4.000.10 2.000.10 4.000.10 1.50 -0/+0.10 1.10 Max | ||||
| Reel Dimensions (mm) | Unit: mm | 7REEL (1782.0) | 13REEL (3302.0) | ||
| A | 3.0 | 3.0 | |||
| B | 130.5 | 130.5 | |||
| C | 210.5 | 210.5 | |||
| D | 21 or Bigger | 21 or Bigger | |||
| E | 1010.5 | 1010.5 | |||
| F | 12max | 12max | |||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||
| Packing Quantity (Pcs) | Size | Paper T/R | Plastic T/R | ||
| 0603 | 4000 | - | |||
| 0805 | 4000 | 3000 (T1.35mm) | |||
| 1206 | - | 3000 (T>1.35mm) / 2000 (T1.60mm) | |||
| 1210 | - | 3000 (T>1.60mm) | |||
| 1808 | - | 2000 | |||
| 1812 | - | 1000 (T1.85mm) | |||
| 1812 | - | 1000 (T>1.85mm) / 800 / 500 | |||
| Recommended Soldering Method | Size | Temperature Characteristics | Capacitance | Soldering Method | |
| 1005 | NPO | / | / | R | |
| X7R/X5R/X7S/X6S | / | / | R | ||
| 0201 | NPO | / | / | R | |
| X7R/X5R/X7S/X6S | / | / | R | ||
| Y5V | / | / | R | ||
| 0402 | NPO | / | / | R | |
| X7R/X5R/X7S/X6S | / | / | R | ||
| Y5V | / | / | R | ||
| 0603 | NPO | / | / | R/W | |
| X7R/X5R/X7S/X6S | C1uf | R | C1uf | R/W | |
| Y5V | C1uf | R | C1uf | R/W | |
| 0805 | NPO | / | / | R/W | |
| X7R/X5R/X7S/X6S | C4.7uf | R | C4.7uf | R/W | |
| Y5V | C1uf | R | C1uf | R/W | |
| 1206 | NPO | / | / | R/W | |
| X7R/X5R/X7S/X6S | C10uf | R | C10uf | R/W | |
| Y5V | C10uf | R | C10uf | R/W | |
| 1210 | NPO | / | / | R | |
| X7R/X5R/X7S/X6S | / | / | R | ||
| Y5V | / | / | R | ||
| Soldering method | RReflow Soldering, WWave Soldering | ||||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. Keep temperature difference between soldering temperature and surface temperature of chips T150. | ||||
2509251626_AIDE-CAPACITOR-0603X7R106M100NT_C49326610.pdf
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