<
>
Specifications
Voltage Rating:
50V
Capacitance:
150pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R151K500NT
Model Number:
0603X7R151K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: RoHS and REACH compliant
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | |
| Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Terminal Composition | Au/Ag-Ni-Sn | |
| Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | Construction Items | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer |
| Dimension (mm) - British System | 0201 (0.02*0.01 in), 0402 (0.04*0.02 in), 0603 (0.06*0.03 in), 0805 (0.08*0.05 in), 1206 (0.12*0.06 in), 1210 (0.12*0.10 in), 1808 (0.18*0.08 in), 1812 (0.18*0.12 in), 1825 (0.18*0.25 in), 2211 (0.22*0.11 in), 2225 (0.22*0.25 in) | |
| Dimension (mm) - Metric System | 0603 (0.600.10 L x 0.300.05 W x 0.300.05 T), 1005 (1.000.15 L x 0.500.15 W x 0.500.10 T), 1608 (1.600.20 L x 0.800.15 W x 0.800.15 T), 2012 (2.000.20 L x 1.250.20 W x 0.800.20 T), 3216 (3.200.30 L x 1.600.30 W x 1.000.20 T), 3225 (3.200.30 L x 2.500.30 W 2.70 T), 4520 (4.500.40 L x 2.000.20 W 2.70 T), 4532 (4.500.40 L x 3.200.30 W 3.50 T), 4563 (4.500.40 L x 6.300.50 W 3.50 T), 5750 (5.700.50 L x 5.000.50 W 3.50 T), 5763 (5.700.50 L x 6.300.50 W 6.20 T) | |
| WB (mm) | 0201 (0.100.05), 0402 (0.200.10), 0603 (0.300.10), 0805 (0.500.20), 1206 (0.600.30), 1210 (0.800.30), 1808 (0.800.30), 1812 (0.800.30), 1825 (0.800.30), 2220 (1.000.40), 2225 (1.000.40) | |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Temperature Range | -55~+125 | |
| Static Capacity Tolerance | NPO: 1000pF (1MHz10%, 1.00.2Vrms), >1000pF (1KHz10%, 1.00.2Vrms); X7R/X7T/X7P: 10uF (1KHz10%, 1.00.2Vrms), >10uF (120Hz24, 0.50.1Vrms) | |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Testing frequency: 110%MHz (Cr1000pF), 110%KHz (Cr1000pF). Voltage: 1V0.2rms. X7R/X7T/X7P: 10uF (1KHz10%, 1V0.1rms), >10uF (12024Hz, 0.5V0.1rms). See Note 1 for specific DF exceptions. | |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C10nF). Testing: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF). | |
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage: 2.5 x rated voltage (Ur=100V), 2.0 x rated voltage (Ur=200V/250V), 1.5 x rated voltage (Ur=450/500/630V), 1.2 x rated voltage (1KVUr2KV), 1.1 x rated voltage (2KVUr). Voltage Raising time: 110S, Maintaining time: 2S. | |
| Reliability Testing | Solderability | Soldering area 90%. Visual-No damage. Pre-heating: 80-120 (10-30s). Solder: Lead-free. Temp: 2455. Time: 20.5s. |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s). Soldering Temp: 2655. Time: 51s. Cleaning: Solvent. Room temp: 242 hours. | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electrostatic capacity change rate: NPO: C/C0.5% or 0.5pF, X7R: C/C15%, X7T: -33% C/C22%, X7P: C/C10%. DF & IR refer to relevant sections. | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R): Upper limit temp 1hr, 241 hrs, 5 cycles. Test after 242 hrs normal temp & humidity. | |
| Environmental Testing | Temperature Moisture Exposure | Visual: No visual damage. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Capacitance change rate: NPO: C/C2% or 1pF, X7R/X7T/X7P: C/C10%. DF 2x initial standard. IR: NPO: IR2500M or IR*Cr25S, X7R/X7T/X7P: IR1000M or IR*Cr25S. Test after 242 hrs normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance change rate: NPO: C/C2% or 1pF, X7R/X7T/X7P: C/C20%. DF 2x initial standard. IR: NPO: IR4000M or IR*Cr40S, X7R/X7T/X7P: IR2000M or IR*Cr50S. Test after 48 hrs normal pressure & temperature. | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering MLCC on PCB. | |
| Packing Details | Embossed Plastic Taping | For 0805(2012) to 1812(4532) type. Specific dimensions for tape size, pitch, and reel dimensions provided. |
| Paper Tape Reel Packing | For 1005(0402) to 1206(3216) types, and 0603, 0805, 1206 types. Specific dimensions for paper tape and reel dimensions provided. | |
| Packing Quantity | Varies by size and packing type (Paper T/R, Plastic T/R). Examples: 0603 Paper T/R (4000 pcs), 0805 Plastic T/R (3000 pcs). | |
| Soldering Method | Recommended methods include Reflow Soldering (R) and Wave Soldering (W), with specific recommendations based on size, temperature characteristics, rated voltage, and capacitance. |
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent issues like burn out, flaming, or glowing:
- Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to avoid direct contact with the ceramic body and prevent thermal cracks. Select appropriate soldering iron tips and temperatures.
- Soldering Amount: Adhere to optimum solder amounts for reflow and wave soldering.
2509251626_AIDE-CAPACITOR-0603X7R151K500NT_C49326615.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
