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Specifications
Voltage Rating:
50V
Capacitance:
2.2nF
Temperature Coefficient:
X7R
Tolerance:
±5%
Mfr. Part #:
0603X7R222J500NT
Model Number:
0603X7R222J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for various power supply and networking interfaces such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer a wide range of capacitance, voltage, and temperature characteristics, with options for different tolerances and packaging methods.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits, switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy saving lamps. | ||||
| Medium and High voltage MLCC | |||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | 1. Dimension Code: | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| 2. Temperature Characteristic: | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| 3. Nominal Electrostatic Capacity: | 8R08.0pF, 10010pF, 101100pF | ||||
| 4. Tolerance of Electrostatic Capacity: | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| 5. Rated Voltage (DC): | 25025V, 251250V, 2522500V | ||||
| 6. Terminal Composition: | Au/Ag-Ni-Sn | ||||
| 7. Packing: | T Tape/Reel, P Bag packing (PE) | ||||
| Construction | 1. Ceramic dielectric | ||||
| 2. Inner electrode | |||||
| 3. Outer electrode | |||||
| Dimensions (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specifications and Testing Methods | 1. Temperature: | -55~+125 | |||
| 2. Visual/Dimension: | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms | X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | |||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms | |||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF (Rated voltage, 605s, Humidity:75%, Temp:255, Current :50mA) | X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | |||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | ||||
| Solderability | Soldering area90%. Pre-heating: 80-120, 10-30s. Solder: lead free, flux. Soldering temp: 2455, Time: 20.5s. | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area90%. Pre-heating: 100-200, 102s. Soldering temp: 2655, Time: 51s. Cleaning with solvent. Room temp, time: 242 hours. | ||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | DF Refer to NO#4, IR Refer to NO#5 | |||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | Electro static capacity change rate C/C10% | |||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | ||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles. Test after 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, Time 50024 hours. Test after 242 hours normal temp & humidity. | |||
| High Temperature Exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect. IR. Soldering the MLCC on the PCB. Pressing direction based on photo. | ||||
| Embossed Plastic Taping | 0805: Tape size 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max | 1206: Tape size 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max | |||
| 1210: Tape size 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max | 1808: Tape size 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max | ||||
| 1812: Tape size 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max | |||||
| Paper Tape Reel Packing | 1005: W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.30 Below | 0201: W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below | |||
| 0402: W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below | 0603: A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | ||||
| 0805: A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | 1206: A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | ||||
| Reel Dimensions | 7' REEL: 1782.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max | 13' REEL: 3302.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max | |||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||
| Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000, 1206: 4000 | Plastic T/R (Pcs): 0805: 3000, 1210 (T1.35mm): 3000, 1210 (T>1.35mm): 2000, 1812 (T1.60mm): 3000, 1812 (T>1.60mm): 2000 | |||
| Soldering Method | RReflow Soldering, WWave Soldering | See page 13 for detailed recommendations by size, characteristics, voltage, and capacitance. | |||
| Soldering Profile | To avoid crack problems due to sudden temperature change, follow the recommended temperature profile. Keep temperature difference between soldering temperature and surface temperature of chips T150. | ||||
2509251626_AIDE-CAPACITOR-0603X7R222J500NT_C49326625.pdf
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