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Specifications
Voltage Rating:
50V
Capacitance:
300pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R301K500NT
Model Number:
0603X7R301K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a high-voltage Multi-Layer Ceramic Capacitor (MLCC) designed for applications requiring wave filtering, coupling, and resonance in high-voltage circuits. It is suitable for use in switch power suppliers, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power suppliers, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance across different operating conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS Compliance: Meets the standard
- REACH Compliance: Meets the standard
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | ||
| Testing Conditions | |||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | |
| Part Number Description | Example | 1812 X7R 684 M 251 N T | |
| Item Breakdown | Dimension Code, Temperature characteristic, Nominal electrostatic capacity, Tolerance of electrostatic capacity, Rated voltage (DC), Terminal composition, Packing | ||
| Dimension Code | Inch/mm | 0201 (0.02*0.01 / 0.50*0.25), 0402 (0.04*0.02 / 1.00*0.50), 0603 (0.06*0.03 / 1.60*0.80), 0805 (0.08*0.05 / 2.00*1.25), 1206 (0.12*0.06 / 3.20*1.60), 1210 (0.12*0.10 / 3.20*2.50), 1808 (0.18*0.08 / 4.50*2.00), 1812 (0.18*0.12 / 4.50*3.20), 1825 (0.18*0.25 / 4.50*6.30), 2211 (0.22*0.11 / 5.70*2.8), 2225 (0.22*0.25 / 5.70*6.30) | |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | Format | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | Format | 250 25, 251 250, 252 2500 (V) | |
| Packing | Code | T Tape/Reel, P Bag packing(PE) | |
| Construction | Item | Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer | |
| Dimension (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, (0.600.10) 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20, (1.000.20, 1.250.20, 0.800.20) 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30, (1.250.20, 1.600.30) 1210 (3225): L 3.200.30, W 2.500.30, T 2.70, WB 0.800.30, (1.250.20, 1.600.30) 1808 (4520): L 4.500.40, W 2.000.20, T 2.70, WB 0.800.30 1812 (4532): L 4.500.40, W 3.200.30, T 3.50, WB 0.800.30 1825 (4563): L 4.500.40, W 6.300.50, T 3.50, WB 0.800.30 2220 (5750): L 5.700.50, W 5.000.50, T 3.50, WB 1.000.40 2225 (5763): L 5.700.50, W 6.300.50, T 6.20, WB 1.000.40 | British system / Metric system | |
| Temperature | Specification | -55~+125 | |
| Visual/Dimension | Specification | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO characteristic | 1000pF: 1MHz10%, 1.00.2Vrms 1000 pF: 1KHz10%, 1.00.2Vrms | |
| X7R/X7T/X7P characteristic | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | ||
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF: 110%MHz, 1V0.2rms Cr1000pF: 110%KHz, 1V0.2rms | |
| X7R/X7T/X7P characteristic | Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. | See Note 1 | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | ||
| Hi-pot (DC) | Specification | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S |
| Solderability | Specification | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. Visual-No damage. |
| Resistance to the heat of soldering | Specification | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature. |
| X7R | C/C15% | ||
| X7T | -33% C/C22% | ||
| X7P | C/C10% | ||
| Flexural Strength | Specification | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Flexural depth 452. |
| Terminal Bonding Strength | Specification | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| X7R/X7P characteristic | C/C0.5% | ||
| X7T characteristic | C/C10% | ||
| Temperature Moisture Exposure | Visual | No visual damage | Test after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. |
| Electrostatic Capacitance Change Rate | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | ||
| DF | 2 times initial standard | ||
| IR | NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | ||
| High Temperature Exposure | Visual | No visual damage | Test after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Charging and discharging current 50mA Max. |
| Electrostatic Capacitance Change Rate | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | ||
| DF | 2 X initial standard | ||
| IR | NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | ||
| PCB Flexural Strength | Specification | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 |
| Embossed Plastic Taping (0805-1812) | Tape Size (mm) | 0805: A 1.550.20, B 2.350.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.50 Max 1206: A 1.950.20, B 3.600.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.1, J 1.50 -0/+0.10, T 1.85 Max 1210: A 2.700.10, B 3.420.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.05, H 4.000.10, J 1.55 -0/+0.10, T 3.2 Max 1808: A 2.200.10, B 4.950.10, C 12.000.10, D 5.500.05, E 1.750.10, F 4.000.10, G 2.000.05, H 4.000.10, J 1.50 -0/+0.10, T 3.0 Max 1812: A 3.660.10, B 4.950.10, C 12.000.10, D 5.500.05, E 1.750.10, F 8.000.10, G 2.000.05, H 4.000.10, J 1.55 -0/+0.10, T 4.0 Max | Code T |
| Paper Tape Reel Packing (1005, 0201, 0402, 0603, 0805, 1206) | Paper Size (mm) | 1005: W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30 0201: W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80 0402: W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80 0603: A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 0805: A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 1206: A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | Code |
| Reel Dimensions (mm) | Unit | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | A B C D E F G |
| Top Tape Peeling Strength | Standard | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping |
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1206: 4000 | |
| Plastic T/R (Pcs) | 0805: 3000 (T1.35mm), 1206: 3000 (T1.60mm), 1210: 2000 (T1.85mm), 1808: 1000, 1812: 800, 1812 above: 500 | ||
| Soldering Profile | Recommendation | Follow the temperature profile in the adjacent graph. | |
| Recommended Soldering Method | Size/Characteristic | 1005: NPO/R, X7R/X5R/X7S/X6S/R 0201: NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R 0402: NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R 0603: NPO/R/W, X7R/X5R/X7S/X6S (C1uf R, C1uf R/W), Y5V (C1uf R, C1uf R/W) 0805: NPO/R/W, X7R/X5R/X7S/X6S (C4.7uf R, C4.7uf R/W), Y5V (C1uf R, C1uf R/W) 1206: NPO/R/W, X7R/X5R/X7S/X6S (C10uf R, C10uf R/W), Y5V (C10uf R, C10uf R/W) 1210: NPO/R, X7R/X5R/X7S/X6S/R, Y5V/R | RReflow Soldering, WWave Soldering |
| Soldering Temperature Profile | Condition | While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |
2509251626_AIDE-CAPACITOR-0603X7R301K500NT_C49326637.pdf
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