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Specifications
Voltage Rating:
50V
Capacitance:
4.7nF
Temperature Coefficient:
X7R
Tolerance:
±5%
Mfr. Part #:
0603X7R472J500NT
Model Number:
0603X7R472J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Details | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC). | |||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | ||||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||||
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | |||||||||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | ||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||||
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||
| Packing | T Tape/Reel, P Bag packing (PE) | |||||||||||
| Construction | Item | Description | ||||||||||
| 1 | Ceramic dielectric | |||||||||||
| 2 | Inner electrode | |||||||||||
| 3 | Outer electrode | |||||||||||
| 4 | Nickle layer | |||||||||||
| 5 | Tin layer | |||||||||||
| Dimensions (mm) | Part Number | L W T WB | ||||||||||
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |||||||||||
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |||||||||||
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 | 0.600.10 | ||||||||||
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 | 0.500.20, 1.250.20, 0.800.20 | ||||||||||
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 | 0.600.30, 1.600.30 | ||||||||||
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |||||||||||
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |||||||||||
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |||||||||||
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |||||||||||
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |||||||||||
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |||||||||||
| Specifications and Testing Methods | Item | Specification/Requirement | Testing Method | |||||||||
| 1. Temperature | -55~+125 | |||||||||||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||||
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||||
| 4. Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) | ||||||||||
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||
| 7. Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||
| 8. Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||
| 9. Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||||
| 10. Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||
| 11. Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after 242 hours normal temp & humidity. | ||||||||||
| 12. Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | ||||||||||
| 13. High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | ||||||||||
| 14. PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on the photo. | ||||||||||
| Embossed Plastic Taping | Type | Tape size (mm) | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||
| Paper Tape Reel Packing | Code | Paper size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | ||
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | ||
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||
| Reel Dimensions | Unit: mm | A | B | C | D | E | F | G | ||||
| 7' REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| 13' REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||
| Taping Specification | Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | - | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||
| 1206 | - | 3000 (T1.60mm) | ||||||||||
| Precautions For Use | MLCCs may fail in short or open circuit modes under severe electrical/mechanical stress beyond ratings. Following precautions for safety and application notes are crucial. For handling questions, contact engineering or factory. | |||||||||||
| Soldering Profile | To avoid cracks from sudden temperature change, follow the temperature profile in the adjacent graph. | |||||||||||
| Manual Soldering | Manual soldering risks thermal cracks. Handle soldering iron carefully, paying attention to tip selection and temperature contact. | |||||||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||||||
| Recommended Soldering Amounts | ||||||||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | |||||||
| 1005 | NPO | / | / | R | ||||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||||
| 0603 | X7R/X5R/X7S/X6S | / | C1uf | R | C1uf | R/W | ||||||
| 0805 | X7R/X5R/X7S/X6S | / | C4.7uf | R | C4.7uf | R/W | ||||||
| 1206 | X7R/X5R/X7S/X6S | / | C10uf | R | C10uf | R/W | ||||||
| 1210 | X7R/X5R/X7S/X6S | / | / | R | ||||||||
| Soldering method | RReflow Soldering, WWave Soldering | |||||||||||
| The temperature profile for soldering | While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |||||||||||
2509251626_AIDE-CAPACITOR-0603X7R472J500NT_C49326645.pdf
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