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Specifications
Voltage Rating:
16V
Capacitance:
470nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R474K160NT
Model Number:
0603X7R474K160NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing Options: Tape/Reel (T), Bag packing (P)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||||||||||||||||||||||||||||||||||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||||||||||||||||||||||||||||||
| 3. Part Number Description | Item | Description | Example | |||||||||||||||||||||||||||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | 1812 | ||||||||||||||||||||||||||||||||||||
| 2. Temperature Characteristic | C0G, X7R, X5R | X7R | ||||||||||||||||||||||||||||||||||||
| 3. Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | 684 (68000pF or 68nF) | ||||||||||||||||||||||||||||||||||||
| 4. Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | M (20%) | ||||||||||||||||||||||||||||||||||||
| 5. Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | 251 (250V) | ||||||||||||||||||||||||||||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | Au/Ag-Ni-Sn | ||||||||||||||||||||||||||||||||||||
| 7. Packing | T (Tape/Reel), P (Bag packing) | |||||||||||||||||||||||||||||||||||||
| 4. Construction and Dimension | Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | |||||||||||||||||||||||||||||||||||||
| Dimension (mm): | L, W, T, WB |
| ||||||||||||||||||||||||||||||||||||
| 5. Specification and testing method | Temperature: | -55~+125 | Naked eye (Visual inspection), Digital calliper | |||||||||||||||||||||||||||||||||||
| Visual/Dimension: 1. No Damage, 2. Dimension meet Spec | ||||||||||||||||||||||||||||||||||||||
| Static Capacity: | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | See document for detailed frequency and voltage conditions. | ||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF): | See document for detailed specifications based on characteristic and capacitance. | See document for detailed frequency and voltage conditions. | ||||||||||||||||||||||||||||||||||||
| IR Insulation Resistance: | NPO: 50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||||||||||||||||||||||||||||||||||
| Hi-pot (DC): | No dielectric breakdown or damage. Voltage multiplier based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||||||||||||||||||||||||||||||
| Solderability: | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering: | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||||||||||||||||||||||||||||
| Electrostatic capacity change rate: | NPO: 0.5% or 0.5pF; X7R: 15%; X7T: -33% to 22%; X7P: 10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | ||||||||||||||||||||||||||||||||||||
| Flexural strength: | No damage. Electrostatic capacity change rate 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | ||||||||||||||||||||||||||||||||||||
| Terminal bonding strength: | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||||||||||||||||||||||||||||
| Thermal shock: | NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||
| Temperature moisture exposure: | Visual: No visual damage. Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: 2500M or IR*Cr25S; X7R/X7T/X7P: 1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. | ||||||||||||||||||||||||||||||||||||
| High temperature exposure: | Visual: No visual damage. Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: 4000M or IR*Cr40S; X7R/X7T/X7P: 2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage dependent on rating. | ||||||||||||||||||||||||||||||||||||
| PCB flexural strength: | No crack and other defect. IR. | Soldering the MLCC on the PCB, then pressing direction based on diagrams. | ||||||||||||||||||||||||||||||||||||
| 6. EMBOSSED PLASTIC TAPING | Embossed tape reel packing: | Dimensions A, B, C, D, E, F, G, H, J, T for 0805 to 1812 types. | ||||||||||||||||||||||||||||||||||||
| Paper tape reel packing: | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t for 1005, 0201, 0402, 0603, 0805, 1206 types. | |||||||||||||||||||||||||||||||||||||
| Reel Dimensions: | 7REEL (1782.0), 13REEL (3302.0) | |||||||||||||||||||||||||||||||||||||
| Taping specification: | Top tape peeling strength: 0.1N < peeling strength < 0.7N | |||||||||||||||||||||||||||||||||||||
| Packing quantity: | See document for quantities per size and packing type (Paper T/R, Plastic T/R). | |||||||||||||||||||||||||||||||||||||
| 8. Precautions For Use | MLCCs may fail short circuit or open circuit under severe electrical or mechanical stress. Follow safety precautions and application notes. Refer to soldering profiles and recommended methods. Avoid sudden temperature changes. Use careful handling during manual soldering. | |||||||||||||||||||||||||||||||||||||
| 9. Recommended Soldering Method | Details provided for each size and characteristic (NPO, X7R, X5R, etc.) with methods R (Reflow Soldering) and W (Wave Soldering). | |||||||||||||||||||||||||||||||||||||
| 10. The temperature profile for soldering | Maintain temperature difference T 150 between soldering temperature and surface temperature of chips during preheating. | |||||||||||||||||||||||||||||||||||||
2509251626_AIDE-CAPACITOR-0603X7R474K160NT_C49326648.pdf
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