Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits (e.g., switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | ||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 3. Part Number Description | Item | Description | Example |
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | 1812 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | X7R | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | 684 (680000pF or 680nF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | M (20%) | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | 251 (250V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | T | |
| 4. Construction and Dimension | Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer | ||
| Dimension (mm): (See table below) | |||
| Part Number | Dimension (mm) L x W x T | WB | |
| 0201 (0603) | 0.600.10 x 0.300.05 x 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 x 0.500.15 x 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 x 0.800.15 x 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 x 1.250.20 x 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 x 1.600.30 x 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 x 2.500.30 (2.70) x 0.800.30 | 0.800.30 | |
| 1808 (4520) | 4.500.40 x 2.000.20 (2.70) x 0.800.30 | 0.800.30 | |
| 1812 (4532) | 4.500.40 x 3.200.30 (3.50) x 0.800.30 | 0.800.30 | |
| 1825 (4563) | 4.500.40 x 6.300.50 (3.50) x 0.800.30 | 0.800.30 | |
| 2220 (5750) | 5.700.50 x 5.000.50 (3.50) x 1.000.40 | 1.000.40 | |
| 2225 (5763) | 5.700.50 x 6.300.50 (6.20) x 1.000.40 | 1.000.40 | |
| 5. Specification and Testing Method | 1. Temperature | -55~+125 | |
| 2. Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | |
| 3. Static Capacity | Meet standard specification and tolerance | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | |
| 4. Dissipation Factor (DF) | Refer to Note 1 | NPO: Cr1000pF: 1MHz10%, 1V0.2rms; Cr>1000pF: 1KHz10%, 1V0.2rms X7R/X7T/X7P: Cr10uF: 1KHz10%, 1V0.1rms; Cr>10uF: 120Hz24, 0.5V0.1rms | |
| 5. IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Voltage based on rated voltage (Ur): 100V: 2.5xUr; 200V/250V: 2.0xUr; 450/500/630V: 1.5xUr; 1KVUr2KV: 1.2xUr; 2KVUr: 1.1xUr. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| 7. Solderability | Soldering area 90% | Pre-heating: 80-120, 10-30s; Solder: Lead free, flux; Soldering Temp: 2455, Time: 20.5s | |
| 8. Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating: 100-200, 102s; Soldering Temp: 2655, Time: 51s. Cleaning with solvent. Room temp, time: 242 hours. | |
| 9. Flexural strength | No damage | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. Test under flexural status. | |
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11. Thermal shock | Capacity change rate: NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: -33% to 22% | 5 cycles of thermal shock. Test after 242 hours at normal temp & humidity. | |
| 12. Temperature moisture exposure | Visual: No visual damage; Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10%; DF: 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity. | |
| 13. High temperature exposure | Visual: No visual damage; Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20%; DF: 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V: 2xRated voltage; 250VV1KV: 1.5xRated voltage; 1KVV: 1.2xRated voltage. Test after 48 hours under normal pressure & temperature. | |
| 14. PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing. See table for dimensions (A, B, C) based on MLCC size. | |
| 6. EMBOSSED PLASTIC TAPING | Embossed tape reel packing for 0805(2012)~1812(4532) type | Dimensions (A, B, C, D, E, F, G, H, J, T) listed for each code (0805, 1206, 1210, 1808, 1812) | |
| Paper tape reel packing for 10050402~12063216 | Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) listed for each code (1005, 0201, 0402) and (A, B, C, D, E, F, G, H, J, T) listed for each code (0603, 0805, 1206) | ||
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | ||
| Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | ||
| 7. Packing quantity | Paper T/R (Pcs) | 0201: 4000, 0402: 4000, 0603: 4000, 0805: 4000, 1206: 4000 | |
| Plastic T/R (Pcs) | 0805: 3000 (T1.35mm), 1206: 3000 (T1.60mm) / 2000 (T>1.60mm), 1210: 2000 (T1.85mm) / 1000 (T>1.85mm), 1808: 1000, 1812: 800, 1812: 500 | ||
| 8. Precautions For Use | MLCCs may fail in short or open circuit modes under severe conditions beyond specified ratings. Follow soldering profiles and handling precautions to avoid cracks and damage. Direct contact with hot soldering iron tip on the ceramic body should be avoided. | ||
| 9. Recommended Soldering Method | See table for recommended soldering methods (R-Reflow, W-Wave) based on size, temperature characteristic, rated voltage, and capacitance. | ||
| 10. Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips as T 150 during preheating. | ||
Note 1: Dissipation Factor (DF) Exception for X7R/X5R/X6S/X7S/Y5V
(Detailed DF exceptions based on rated voltage and capacitance values are provided in the original text, too extensive to list here in full detail but available in the source document.)
2509251626_AIDE-CAPACITOR-0603X7R502K500NT_C49326652.pdf
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